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  • Intel® MAX 10 Commercial [10M08SAU169C8G]

    • Package: UBGA-169

    • Speed Grade: C8 (Slowest)

    • Temperature: 0°C ~ to 85°C

    • Package compatible device 10M0210M08...10M16 as assembly variant on request possible

  • SDRAM Memory up to 64Mb, 166MHzDual High Speed USB to 32 Mbyte (8Mbyte default)

  • USB 2.0 Multipurpose UART/FIFO IC

  • 64Mb Quad SPI Flash

  • 4Kb EEPROM Memory 

  • (FT2232H)

    • 4 Kbit EEPROM Memory for FTDI configuration data
    • Micro USB Receptacle (communication and power)
  • SPI Flash - NOT INSTALLED (only special option)

  • 8x User LED 
  • Micro USB2 Receptacle 90USB Connector

  • 16 Bit 500kSPS Analog to Digital Converter with 1 MSPS or 500 kSPS

  • 2x SMA Female Connector

  • I/O interface:

    250x

    23x GPIO

    116x LVDS

  • Power Supply: 5V

  • Minimum 1A
  • (from USB)

  • Dimension:

    25m

    25 mm x 86.

    5m

    5 mm

  • Others:

    • Instrumentation Amplifier

    • Differential Amplifier

    • Operational Amplifier

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Scroll Title
anchorFigure_OV_BD
titleTEI0016 block diagram


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Scroll Title
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titleTEI0016 main components


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  1. SMA Connector, J5...6
  2. Amplifier, U12
  3. Analog to Digital ConvertorConverter, U6
  4. Voltage Reference, U8
  5. Voltage Regulator, U10 - U13 - U16
  6. Switching Voltage3 Voltage Regulator/LDO, U11 - U4
  7. SDRAM Memory, U2
  8. Intel® MAX 10 FPGA, U1
  9. SPI Flash Memory, U5 (not populated)
  10. 12.00 MHz MEMS oscillator, U7
  11. FTDI USB2 USB to JTAG/UART adapter/FIFO, U3
  12. User LEDs, D2...9
  13. 4Kb EEPROM, U9
  14. Configuration LED (Red) , D10
  15. Power-on LED (Green), D1
  16. Push button, S1...2
  17. Micro USB2 ReceptacleUSB Connector, J9
  18. 1x14 pin header , J2 (Not assembled), J2
  19. 1x6 pin header , J4 (Not assembled), J4
  20. Jumper, J3
  21. 1x14 pin header , J1 (Not assembled), J1

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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titleInitial delivery state of programmable devices on the module

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Not Programmed

Storage device name

Content

Notes

Quad SPI Flash

N/A

Not

Programmed

populated

EEPROMProgrammed

FTDI configuration

SDRAM


Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.

The FPGA configuration for Intel MAX 10 FPGAs can be stored through JTAG interface either in external configuration device (active serial configuration memory U5) or (using a *.POF file) on the FPGA itself since the Intel MAX 10 FPGA offers non-volatile configuration memory on chip. The FPGA configuration is loaded from the non-volatile memory when the board is powered up. To configure the FPGA directly, the JTAG interface can be used to configure the FPGA volatile , means (using a *.SOF file), means the configuration is lost after power off.

Reset process must be done FPGA Reconfigration can be triggered by pressing push button S1.

Scroll Title
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titleReset process.

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Signal

Push ButtonPin HeaderNote

RESET

S1J2connected Connected to nCONFIG


Signals, Interfaces and Pins

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titleFPGA I/O Banks

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FPGA BankI/O Signal CountConnected toNotes
Bank 1A71x14 Pin header, J1AIN0...6
1Jumper, J3AIN7
Bank 1B51x6 Pin header, J4JTAG_EN, TDI, TDO, TMS, TCK
Bank 2


41x14 Pin header, J1D2...5
5A2DADC, U15ADC_EN, ADC_SDI, ADC_SDO, ADC_SCK, ADC_CNV
112MHz Oscillator, U7CLK12M
2Amplifier, U12nIAMP_A0, nIAMP_A1
Bank 322SDRAM, U2RAM_ADDR_CMD
Bank 59

1x14 Pin header, J2

DIO6...14
21x14 Pin header, J1DIO0...1
1D12_RDIO12
Bank 616SDRAM, U2DQ0...15
2SDRAM, U2DQM0...1
1D11_RDIO11
Bank 8



8User Red LEDs, D2...9LED0...7
6SPI Flash, U5F_CS, F_CKCLK, F_DI, F_DO, nSTATUS, DEVCLRn
1Red LED, D10CONF_DONE
6FTDI JTAG/UART Adapter, U3BDBUS0...5
1Push Button, S2USER_BTN


Micro-

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USB Connector

The Micro-USB2 connector J9 provides an interface to access the UART and JTAG functions via FTDI FT2232 chip. The use of this feature requires that USB driver is installed on your host PC.

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titleMicro USB-2 connector pins

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It is connected to GND
PinsConnected toNote
VBUSUSB_VBUS
D+FTDI U3, DP pin
D-FTDI U3, DM pin


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titleJTAG pins connection

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JTAG Signal

Pin Header Connector

Note
TMSJ4-6
TDIJ4-5
TDOJ4-4
TCK

J4-3


JTAG_ENJ4-2connected Pulled-up to 3.3V.3


On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

...

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titleOn board peripherals

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Chip/InterfaceDesignatorNotes
SDRAM77530151U2
FTDI FT2232HU3JTAG/UART Adapter/FIFO
77530151Active Serial ConfigurationU5
EEPROM77530151U9
OscillatorU712MHz 12 MHz clock source
ADC77530151U6Analog to Digital ConvertorConverter
8x User LEDsD2...9Red LEDs
Push ButtonsS1...2


SDRAM

TEI0016 is equipped with a Winbond 64 MBit (8 MByte) SDRAM chip in standard configuration, variants with 256 Mbit (32 MByte) memory density are also available. The SDRAM chip is connected to the FPGA bank 3 and 6 via 16-bit memory interface with 166MHz clock frequency and CL3 CAS latency.

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

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Scroll Title
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titleSDRAM interface IOs and pins

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SDRAM I/O Signals

Signal Schematic Name

Connected toNotes
Address inputs

A0 ... A13

bank 3-
Bank address inputs

BA0 / BA1

bank 3

-
Data input/output

DQ0 ... DQ15

bank 6

-
Data mask

DQM0 ... DQM1

bank 6

-
ClockCLKbank 3-
Control Signals

CS

bank 3

Chip select

CKE

bank 3

Clock enable

RAS

bank 3

Row Address Strobe

CAS

bank 3

Column Address Strobe

WEbank 3Write Enable


FTDI FT2232H

The FTDI chip U3 converts signals from USB2 USB to a variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the capacity features of the FT2232H chip.
FTDI FT2232H chip channel A is used in MPPSE mode for JTAG, 6 I/O's of . Channel B are routed to FPGA bank 8 of the FPGA SoC and are usable for example as GPIOs, UART or other standard interfacesis configured to be used as in async FIFO mode, this is default mode when using preprogrammed FTDI configuration. In this mode the communication from host PC looks like normal UART but from the FTDI side it is 8 bit FIFO style interface.

The configuration of FTDI FT2232H chip is pre-programmed on the EEPROM U9.

Scroll Title
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titleFTDI chip interfaces and pins

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FTDI Chip U3 PinSignal Schematic NameConnected toNotes
ADBUS0TCKFPGA bank 1B, pin G2JTAG interface
ADBUS1TDIFPGA bank 1B, pin F5
ADBUS2TDOFPGA bank 1B, pin F6
ADBUS3TMS

FPGA bank 1B, pin G1

BDBUS0BDBUS0FPGA bank 8, pin A4user User configurable
BDBUS1BDBUS1FPGA bank 8, pin B4user User configurable
BDBUS2BDBUS2FPGA bank 8, pin B5user User configurable
BDBUS3BDBUS3FPGA bank 8, pin A6user User configurable
BDBUS4BDBUS4FPGA bank 8, pin B6user User configurable
BDBUS5BDBUS5FPGA bank 8, pin A7user User configurable

Active Serial configuration

On-board serial configuration memory (U5) is provided by Winbond with 64 MBit (8 MByte) storage capacity. This non volatile memory is used to store initial FPGA configuration via JTAG interface. The memory is connected to FPGA bank 8 via SPI interface.

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anchorTable_OBP_QSPI
titleQuad SPI Flash memory interface

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FPGA bank 8, pin C4

...

BDBUS6BDBUS6FPGA bank 6, pin C11
BDBUS7BDBUS7FPGA bank 3, pin J7
BCBUS0BCBUS0FPGA bank 5, pin J9
BCBUS1BCBUS1FPGA bank 3, pin K5
BCBUS2BCBUS2FPGA bank 3, pin K5
BCBUS3BCBUS3FPGA bank 3, pin K5
BCBUS4BCBUS4FPGA bank 3, pin K5


SPI Flash

Optional SPI flash device maybe assembled in custom variants, normally it is not populated.

Scroll Title
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titleQuad SPI Flash memory interface

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Signal Schematic NameConnected toNotes
F_CSFPGA bank 8, pin B3Chip select
F_CLKFPGA bank 8, pin A3Clock
F_DIFPGA bank 8, pin A2Data in / out
nSTATUS

FPGA bank 8, pin C4

Data in / out, configuration dual-purpose pin of FPGA
DEVCLRNFPGA bank 8, pin B9Data in / out, configuration dual-purpose pin of FPGA
F_DOFPGA bank 8, pin B2Data in / out


EEPROM

The configuration of FTDI FT2232H chip is pre-programmed in the EEPROM U9.

Scroll Title
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titleI2C EEPROM interface MIOs and pins

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SchematicConnected toNotes

EECS

FTDI U3, Pin EECS
EECLKFTDI U3, Pin EECLK
EEDATAFTDI U3, Pin EEDATA


ADC

The boards with article nuber - TEI0016-03-08-C8A - are equipped with the Analog DevicesADC - ADAQ7988BCCZ - 16-bit 500kSPS,
boards wit article number TEI0016-03-08-C8B are equipped with the Analog Devices ADC - ADAQ7980BCCZ - 16-bit 1MSPS.

The ADC can be distinguished via its part code:

  • TEI0016-03-08-C8A: ADAQ7988BCCZ - 16-bit 500kSPS - starts with Y6H
  • TEI0016-03-08-C8B: ADAQ7980BCCZ - 16-bit 1.0MSPS - starts with Y6F
Scroll Title
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titleTEI0016 part code variants


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EEPROM

The configuration of FTDI FT2232H chip is pre-programmed on the EEPROM U9.

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anchorTable_OBP_EEP
titleI2C EEPROM interface MIOs and pins

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EECS

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ADC

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titleA2D ADC converter interface and pins

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PinsConnected toNotes

IN+

U8, VOUTVREF_ADC
IN-U12, VOUT
SDIBank 2, ADC_SDI
SDOBank 2, ADC_SDO
SCKBank 2, ADC_SCK
CNVBank 2, ADC_CNV


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titleOn-board LEDs

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DesignatorColorConnected toActive LevelNote
D2...9RedLED1...8Active HighUser LEDs
D10RedCONF_DONEActive LowConfiguration DONE LED
D1Green3.3V Power RailActive HighAfter power on it will be on.


Push Buttons

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titleOn-board Push Buttons

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DesignatorConnected toFunctionalityNote
S1RESETGeneral reset
S2USER_BTNUser push buttonConnected to FPGA Bank 8.


Clock Sources

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titleOsillators

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Clock SourceSchematic NameFrequencyNote
Microchip
MEMS Oscillator, U7CLK12M12.00 MHz

Connected to FTDI FT2232 U3, pin 3.

Connected to FPGA

SoC

bank 2, pin H6.


Power and Power-On Sequence

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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit


Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


Power Supply

To power-up the module, power supply with minimum current capability of 1A is recommendedThe module is supplied from USB (optionally via unpopulated pin header).

Power Consumption

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titlePower Consumption

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FPGATypical Current
Intel MAX 10 10M08 FPGA SoCFPGATBD*


* TBD - To Be Determined

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titlePower Distribution


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Power-On Sequence

There is no specific or special power-on sequence, just one single power source is needed. After power on, the Green green LED (D1) must will be on.

Power Rails

Voltage
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titleModule power rails.

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Power Rail Name

Connector

Designator
VCC / VCCIO Schematic Name

J2 Pin

Connector

J9 Pin

DirectionNotes
VINJ2-13
VIN
-
5VInput
Input5 V - Pin Header
3.3V
J2-12-
3.3V
Output
5VJ2-14
5V
-Output

J9


USB_VBUS

5V
-J9-1Input5 V - USB Connector


Bank Voltages

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titleZynq Intel Max 10 SoC bank voltages.

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Bank          

Schematic Name

Voltage

Notes
Bank 1AVCCIO1A3.3V
Bank 1B

VCCIO1B

3.3V
Bank 2VCCIO23.3V
Bank 3VCCIO33.3V
Bank 5VCCIO53.3V
Bank 6VCCIO63.3V


Bank 8VCCIO83.3V



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Absolute Maximum Ratings

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titleAbsolute maximum ratings
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titleAbsolute maximum ratings

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SymbolsDescriptionMinMaxUnitReference Document

VIN 

Supply voltage4.755.25V
CH1-, CH1+Analog input voltage on amplifier U12 pin 1, 10-3030VAD8251
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SymbolsDescriptionMinMaxUnitReference Document

VIN 

Supply voltage4.755.25V
VCC_ONESupply voltage for core and periphery through on-die voltage
regulator
-0.53.9VIntel MAX 10 datasheet
VCCIO

Supply voltage for input and output buffers

-0.53.9VIntel MAX 10 datasheet
VCCASupply voltage for phase-locked loop (PLL) regulator and ADC-0.53.9VIntel MAX 10 datasheet
V_AN_INAnalog Input Voltage on ADC IC U15 pins-0.15.1VADAQ7988B datasheet
V_REFAnalog reference voltage on IC U15-3.27.7VADAQ7988B datasheet

T_STG

Storage Temperature-40+85°C



Recommended Operating Conditions

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see ADAQ7988B datasheet
Scroll Title
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titleRecommended operating conditions.

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SymbolsMinMaxUnitReference Document
VIN supply voltage (5.0V nominal)4.755.25V
Analog input voltage on amplifier U12 pin 1 (CH1-), 10 (CH1+)-1010V
SymbolsMinMaxUnitReference Document
VIN supply voltage (5.0V nominal)4.755.25V
VCC_ONE3.1353.456Vsee Intel MAX 10 datasheet
VCCIO3.1353.456Vsee Intel MAX 10 datasheet
VCCA3.1353.456Vsee Intel MAX 10 datasheet
V_AN_IN05Vsee ADAQ7988B datasheet
V_REF2.45.1V

T_OP0+70°CW9864G6JT-6 datasheet