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  • Intel® MAX 10 Commercial [10M08SAU169C8G]

    • Package: UBGA-169

    • Speed Grade: C8 (Slowest)

    • Temperature: 0°C to 85°C

    • Package compatible device 10M08...10M16 as assembly variant on request possible

  • SDRAM Memory up to 32 Mbyte (8Mbyte default)

  • USB 2.0 Multipurpose UART/FIFO IC (FT2232H)

    • 4 Kbit EEPROM Memory for FTDI configuration data
    • Micro USB Receptacle (communication and power)
  • SPI Flash - NOT INSTALLED (only special option)

  • 8x User LED 
  • Micro USB2 Receptacle 90USB Connector

  • 16 Bit Analog to Digital Converter with 1 MSPS or 500 kSPS

  • 2x SMA Female Connector

  • I/O interface: 23x GPIO

  • Power Supply: 5V (from USB)

  • Dimension: 25 mm x 86.5 mm

  • Others:

    • Instrumentation Amplifier

    • Differential Amplifier

    • Operational Amplifier

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  1. SMA Connector, J5...6
  2. Amplifier, U12
  3. Analog to Digital Converter, U6
  4. Voltage Reference, U8
  5. Voltage Regulator, U10 - U13 - U16
  6. Switching Voltage Regulator/LDO, U11 - U4
  7. SDRAM Memory, U2
  8. Intel® MAX 10 FPGA, U1
  9. SPI Flash Memory, U5 (not populated)
  10. 12.00 MHz MEMS oscillator, U7
  11. FTDI USB2 USB to JTAG/UART/FIFO, U3
  12. User LEDs, D2...9
  13. 4Kb EEPROM, U9
  14. Configuration LED (Red) , D10
  15. Power-on LED (Green), D1
  16. Push button, S1...2
  17. Micro USB Connector, J9
  18. 1x14 pin header, J2 (Not assembled)
  19. 1x6 pin header, J4 (Not assembled)
  20. Jumper, J3
  21. 1x14 pin header, J1 (Not assembled)

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Clock SourceSchematic NameFrequencyNote
Microchip MEMS Oscillator, U7CLK12M12.00 MHz

Connected to FTDI FT2232 U3, pin 3.

Connected to FPGA bank 2, pin H6.


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DateRevisionContributorDescription

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infoTypeModified date
dateFormatyyyy-MM-dd
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infoTypeCurrent version
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  • major cleanup multiply sections

2019-09-20

Sept 2019

v.56Kilian Jahn
  • update notes for variants
2019-06-05v.55ED
  • Technical Specifications updated

  • Power Rails updated

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