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Template Revision 2.6

  • Module: TRM Name always "TE Series Name" +TRM
    Example: "TE0728 TRM"
  • Carrier: TRM Name usually "TEB Series Name" +TRM
    Example: "TEB0728 TRM"

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Important General Note:

  • If some section is configurable and depends on Firmware, please refer to the addition page (for example CPLD). If not available, add note, that this part is configurable
  • Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro

    • Use "Scroll Title" macro for pictures and table labels. Figure number must be set manually at the moment (automatically enumeration is planned by scrollPDF)
      • Figure template:

        Scroll Title
        anchorFigure_anchorname
        titleText


        Scroll Ignore

        Create DrawIO object here: Attention if you copy from other page, objects are only linked.


        Scroll Only

        image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed



      • Table template:

        • Layout macro can be use for landscape of large tables

      • Scroll Title
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        ExampleComment
        12



    • The anchors of the Scroll Title should be named consistant across TRMs. A incomplete list of examples is given below

      • <type>_<main section>_<name>

        • type: Figure, Table
        • main section:
          • "OV" for Overview
          • "SIP" for Signal Interfaces and Pins,
          • "OBP" for On board Peripherals,
          • "PWR" for Power and Power-On Sequence,
          • "B2B" for Board to Board Connector,
          • "TS" for Technical Specification
          • "VCP" for Variants Currently in Production
          •  "RH" for Revision History
        • name: custom, some fix names, see below
      • Fix names:
        • "Figure_OV_BD" for Block Diagram

        • "Figure_OV_MC" for Main Components

        • "Table_OV_IDS" for Initial Delivery State

        • "Table_PWR_PC" for Power Consumption

        • "Figure_PWR_PD" for Power Distribution
        • "Figure_PWR_PS" for Power Sequence
        • "Figure_PWR_PM" for Power Monitoring
        • "Table_PWR_PR" for Power Rails
        • "Table_PWR_BV" for Bank Voltages
        • "Table_TS_AMR" for Absolute_Maximum_Ratings

        • "Table_TS_ROC" for Recommended_Operating_Conditions

        • "Figure_TS_PD" for Physical_Dimensions
        • "Table_VCP_SO" for TE_Shop_Overview
        • "Table_RH_HRH" for Hardware_Revision_History

        • "Figure_RH_HRN" for Hardware_Revision_Number
        • "Table_RH_DCH" for Document_Change_History
    • Use Anchor in the document: add link macro and add "#<anchorname>
    • Refer to Anchror from external : <page url>#<pagename without space characters>-<anchorname>


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Note for Download Link of the Scroll ignore macro:


Scroll Ignore

Download PDF version of this document.


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Table of Contents

Table of Contents

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Notes :

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Note:
Use 'Key Features' description in shoping page, for example: https://shop.trenz-electronic.de/de/TE0728-04-1Q-SoC-Micromodul-mit-Xilinx-Automotive-Zynq-7020-512-MByte-DDR3L-6-x-6-cm

  • Intel® MAX 10 Commercial [10M08SAU169C8G]

    • Package: UBGA-169

      -UBGA

    • Speed Grade: C8 (Slowest)

    • Temperature: 0°C

      ~

      to 85°C

    • Package compatible device

      10M02

      10M08...10M16 as assembly variant on request possible

  • SDRAM Memory up to

    64Mb, 166MHzDual High Speed USB to

    32 Mbyte (8Mbyte default)

  • USB 2.0 Multipurpose UART/FIFO IC

  • Quad SPI Flash, 64Mb
  • EEPROM Memory, 4Kb

    (FT2232H)

    • 4 Kbit EEPROM Memory for FTDI configuration data
    • Micro USB Receptacle (communication and power)
  • SPI Flash - NOT INSTALLED (only special option)

  • 8x User LED Micro USB2 Receptacle 90
  • 18 Bit 2MSPS Analog to Digital Converter
  • 2x SMA Female Connector

  • I/O interface:

    • 250x GPIO
    • 116x LVDS

    23x GPIO - Arduino MKR compatible

  • Power Supply:

    5V

  • Others:
  • Dimension: 86.5mm x 25mm

  • Others:

    • Instrumentation Amplifier

    • Differential Amplifier

    • Operational Amplifier

Block Diagram

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add drawIO object here.

Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


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Scroll Title
anchorFigure_OV_BD
titleTEI0015 block diagram


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Main Components

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titleTEI0015 main components


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  1. SMA Connector, J5...6

  2. Amplifier, U12 - U14 - U6

  3. Series

    Voltage Reference, U8

  4. Analog to Digital

    Convertor

    Converter, U15

  5. Voltage Regulator, U10 - U13 - U16

  6. Switching Voltage Regulator/LDO, U11 - U4

  7. SDRAM Memory, U2

  8. Intel® MAX 10 FPGA, U1SDRAM Memory, U2
  9. SPI Flash Memory, U5

  10. 12.00 MHz MEMS oscillator, U7

  11. FTDI USB2 to JTAG/UART adapter, U3

  12. User LEDs, D2...9

  13. 4Kb

    FTDI configuration EEPROM, U9

  14. Configuration/Status LED (Red) , D10

  15. Power-on LED (Green), D1

  16. Push button, S1...2

  17. Micro

    USB2 Receptacle

    USB Connector, J9

  18. 1x14 pin header

     

    , J2 (Not assembled)

    , J2

  19. 1x6 pin header

     

    , J4 (Not assembled)

    , J4

  20. Jumper

    1x4 Header, J3 (Not assembled)

  21. 1x14 pin header

     

    , J1 (Not assembled)

    , J1

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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Scroll Title
anchorTable_OV_IDS
titleInitial delivery state of programmable devices on the module

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Not Programmed

Storage device name

Content

Notes

Quad SPI Flash

N/A

Not

Programmed

populated

EEPROM

Programmed

FTDI configuration

SDRAM


Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.

The FPGA configuration for Intel MAX 10 FPGAs can be stored through JTAG interface either in external configuration device (QSPI flash memory U5) or (using a *.POF file) on the FPGA itself since the Intel MAX 10 FPGA offers non-volatile configuration memory on chip. The FPGA configuration is loaded from the non-volatile memory when the board is powered up. To configure the FPGA directly, the JTAG interface can be used to configure the FPGA volatile (using a *.SOF file), means the configuration is lost after power off.

Reset process must be done FPGA Reconfigration can be triggered by pressing push button S1.

Scroll Title
anchorTable_OV_RST
titleReset process.

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Signal

Push ButtonPin HeaderNote

RESET

S1J2connected Connected to nCONFIG


Signals, Interfaces and Pins

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titleGeneral I/Os to Pin Headers and connectors information

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FPGA BankConnector DesignatorI/O Signal CountVoltage LevelNotes
Bank 1AJ173.3VAIN0...6
Bank 1BJ453.3VJTAG interface
Bank 2J143.3VDIO2...5
Bank 5J293.3VDIO6...14
J123.3VDIO0...1
Bank 8J213.3VRESET


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Scroll Title
anchorTable_OBP_IOs
titleFPGA I/O Banks


FPGA BankI/O Signal CountConnected toNotes
Bank 1A71x14 Pin header, J1AIN0...6
1Jumper, J3AIN7
Bank 1B51x6 Pin header, J4JTAG_EN, TDI, TDO, TMS, TCK
Bank 2


41x14 Pin header, J1D2...5
5A2D, U15ADC_EN, ADC_SDI, ADC_SDO, ADC_SCK, ADC_CNV
112MHz Oscillator, U7CLK12M
2Amplifier, U12nIAMP_A0, nIAMP_A1
Bank 322SDRAM, U2RAM_ADDR_CMD
Bank 59

1x14 Pin header, J2

DIO6...14
21x14 Pin header, J1DIO0...1
1D12_RDIO12
Bank 616SDRAM, U2DQ0...15
2SDRAM, U2DQM0...1
1D11_RDIO11
Bank 8



8User Red LEDs, D2...9LED0...7
6SPI Flash, U5F_CS, F_CKCKL, F_DI, F_DO, nSTATUS, DEVCLRn
1Red LED, D10CONF_DONE
6FTDI JTAG/UART Adapter, U3BDBUS0...5
1Push Button, S2USER_BTN


Micro-

...

USB Connector

The Micro-USB2 USB connector J9 provides an interface to access the FIFO/UART and JTAG functions via FTDI FT2232 chip. The use of this feature requires that FTDI USB driver is drivers are installed on your host PC.

Scroll Title
anchorTable_OBP_USB
titleMicro USB-2 connector pins

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PinsConnected toNote
VBUSUSB_VBUS
It is connected to GND

D+

FTDI FT2232H U3, DP pin


D-

FTDI FT2232H U3, DM pin



JTAG Interface

JTAG access to the TEI0015 SoM through pin header connector J4. This is normally not needed as there is on-board USB JTAG functionality.

Scroll Title
anchorTable_SIP_JTG
titleJTAG pins connection

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JTAG Signal

Pin Header Connector

Note
TMSJ4-6
TDIJ4-5
TDOJ4-4
TCK

J4-3


JTAG_ENJ4-2Pulled-up to 3.3V


On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

...

Scroll Title
anchorTable_OBP
titleOn board peripherals

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Chip/InterfaceDesignatorNotes
SDRAM
77530153U2
FTDI FT2232HU3JTAG/UART
Adapter
/FIFO
SPI Flash
Memory
U5
EEPROM

77530153U9
OscillatorU7
12MHz
12 MHz clock source
ADC
77530153U12, U14Analog to Digital
Convertor
Converter
Push ButtonsS1...2
8x User LEDsD2...9Red LEDs


SDRAM

TEI0015 is equipped with a Winbond 64 MBit (8 MByte) SDRAM chip in standard configuration, variants with 256 Mbit (32 MByte) memory density are also available. The SDRAM chip is connected to the FPGA bank 3 and 6 via 16-bit memory interface with 166MHz clock frequency and CL3 CAS latency.

...

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titleSDRAM interface IOs and pins

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SDRAM I/O Signals

Signal Schematic Name

Connected toNotes
Address inputs

A0 ... A13

bank 3-
Bank address inputs

BA0 / BA1

bank 3

-
Data input/output

DQ0 ... DQ15

bank 6

-
Data mask

DQM0 ... DQM1

bank 6

-
ClockCLKbank 3-
Control Signals

CS

bank 3

Chip select

CKE

bank 3

Clock enable

RAS

bank 3

Row Address Strobe

CAS

bank 3

Column Address Strobe

WEbank 3Write Enable


FTDI FT2232H

The FTDI chip U3 converts signals from USB2 to a variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the capacity features of the FT2232H chip. FTDI FT2232H chip channel A is used in MPPSE mode for JTAG, 6 I/O's of . Channel B are routed to FPGA bank 8 of the FPGA SoC and are usable for example as GPIOs, UART or other standard interfacesis configured to be used in async FIFO mode, this is default mode when using preprogrammed FTDI configuration. In this mode the communication from host PC looks like normal UART but from the FTDI side it is 8 bit FIFO style interface.

The configuration of FTDI FT2232H chip is pre-programmed on in the EEPROM U9.

Scroll Title
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titleFTDI chip interfaces and pins

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titleQuad SPI Flash memory interface
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FTDI Chip U3 PinSignal Schematic NameConnected toNotes
ADBUS0TCKFPGA bank 1B, pin G2JTAG interface
ADBUS1TDIFPGA bank 1B, pin F5
ADBUS2TDOFPGA bank 1B, pin F6
ADBUS3TMS

FPGA bank 1B, pin G1

BDBUS0BDBUS0FPGA bank 8, pin A4user User configurable
BDBUS1BDBUS1FPGA bank 8, pin B4user User configurable
BDBUS2BDBUS2FPGA bank 8, pin B5user User configurable
BDBUS3BDBUS3FPGA bank 8, pin A6user User configurable
BDBUS4BDBUS4FPGA bank 8, pin B6user User configurable
BDBUS5BDBUS5FPGA bank 8, pin A7user User configurable

SPI Flash Memory

On-board serial configuration memory (U5) is provided by Winbond with 64 MBit (8 MByte) storage capacity. This non volatile memory is used to store initial FPGA configuration via JTAG interface. The memory is connected to FPGA bank 8 via SPI interface.

BDBUS6BDBUS6FPGA bank 6, pin C11
BDBUS7BDBUS7FPGA bank 3, pin J7
BCBUS0BCBUS0FPGA bank 5, pin J9
BCBUS1BCBUS1FPGA bank 3, pin K5
BCBUS2BCBUS2FPGA bank 3, pin L4
BCBUS3BCBUS3FPGA bank 3, pin L5
BCBUS4BCBUS4FPGA bank 3, pin N12


SPI Flash

Optional SPI flash device maybe assembled in custom variants, normally it is not populated.

Scroll Title
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titleQuad SPI Flash memory interface

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Signal Schematic NameConnected toNotes
F_CSFPGA bank 8, pin B3chip Chip select
F_CLKFPGA bank 8, pin A3clockClock
F_DIFPGA bank 8, pin A2data Data in / out
nSTATUS

FPGA bank 8, pin C4

data Data in / out, configuration dual-purpose pin of FPGA
DEVCLRNFPGA bank 8, pin B9data Data in / out, configuration dual-purpose pin of FPGA
F_DOFPGA bank 8, pin B2data in / out

EEPROM

...

FPGA
F_DOFPGA bank 8, pin B2Data in / out


EEPROM

The configuration of FTDI FT2232H chip is pre-programmed in the EEPROM U9.

Scroll Title
anchorTable_OBP_EEP
titleI2C EEPROM interface MIOs and pins

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SchematicConnected toNotes

EECS

FTDI U3, Pin EECS
EECLKFTDI U3, Pin EECLK
EEDATAFTDI U3, Pin EEDATA


ADC

The TEI0015 board is equipped with the Analog Devices AD4003BCPZ-RL7 18-bit 2MSPS ADC.

Scroll Title
anchorTable_OBP_EEPA2D
titleI2C EEPROM A2D converter interface MIOs and pins

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SchematicPinsConnected toNotes

EECS

FTDI U3, Pin EECSEECLKFTDI U3, Pin EECLKEEDATAFTDI U3, Pin EEDATA

ADC

...

Notes

IN+

Diff Amplifier U14, VOUT-
IN-Diff Amplifier U14, VOUT+
SDIFPGA, bank 2, pin M2, ADC_SDI
SDOFPGA, bank 2, pin M1,  ADC_SDO
SCKFPGA, bank 2, pin N3,  ADC_SCK
CNVFPGA, bank 2, pin N2, ADC_CNV


LEDs

Scroll Title
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titleA2D converter interface and pinsOn-board LEDs

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Designator
Pins
ColorConnected to
Notes

IN+

Diff Amplifier U14, VOUT-IN-Diff Amplifier U14, VOUT+SDIBank 2, ADC_SDISDOBank 2, ADC_SDOSCKBank 2, ADC_SCKCNVBank 2, ADC_CNV

...

Active LevelNote
D2...9RedLED1...8Active HighUser LEDs
D10RedCONF_DONEActive LowConfiguration DONE LED
D1Green3.3V Active HighAfter power on it will be on.


Push Bottuns

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titleOn-board LEDsPush Buttons

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Designator
Color
Connected to
Active Level
FunctionalityNote
D2...9RedLED1...8Active HighUser LEDsD10RedCONF_DONEActive LowConfiguration DONE LEDD1Green3.3V Power RailActive HighAfter power on it will be on
S1RESETGeneral reset
S2USER_BTNUser push buttonConnected to FPGA Bank 8.


Clock Sources

Scroll Title
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titleOsillators

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Clock SourceSchematic NameFrequencyNote
Microchip MEMS Oscillator, U7CLK12M12.00 MHz

Connected to FTDI FT2232 U3, pin 3.

Connected to FPGA SoC bank 2, pin H6.


Power and Power-On Sequence

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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit


Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


Power Supply

To power-up the module, power supply with minimum current capability of 1A is recommendedThe module is power supplied from USB (optionally via unpopulated pin header).

Power Consumption

Scroll Title
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titlePower Consumption

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FPGATypical Current
Intel MAX 10 10M08 FPGA SoCFPGATBD*


* TBD - To Be Determined

...

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titlePower Distribution


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Power-On Sequence

There is no specific or special power-on sequence, just one single power source is needed. After power on the Green green LED (D1) must will be on.

Power Rails

Voltage
Scroll Title
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titleModule power rails.

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Power Rail Name

Connector

Designator
VCC / VCCIO Schematic Name

J2 Pin

Connector

J9 Pin

DirectionNotes
VINJ2-13
VIN
-
5VInput
Input5 V - Pin Header
3.3V
3.3V
J2-12-Output
5V
5V
J2-14-Output

J9


USB_VBUS

-
5V
J9-1Input5 V - USB Connector


Bank Voltages

Scroll Title
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titleZynq Intel MAX 10 SoC bank voltages.

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Bank          

Schematic Name

Voltage

Notes
Bank 1AVCCIO1A3.3V
Bank 1B

VCCIO1B

3.3V
Bank 2VCCIO23.3V
Bank 3VCCIO33.3V
Bank 5VCCIO53.3V
Bank 6VCCIO63.3V


Bank 8VCCIO83.3V



...

AD4003BCPZ datasheet
Scroll Title
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titleAbsolute maximum ratings

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SymbolsDescriptionMinMaxUnitReference Document

VIN 

VIN supply
Supply voltage4.755.25
V
I/O Input voltage for FPGA I/O bank-0.54.12VIntel MAX 10 datasheet
Analog Input Voltage on ADC IC U15 pins–0.33.6VAD4003BCPZ datasheet
Analog reference voltage on IC U152.45.1V
V
CH1-, CH1+Analog input voltage on amplifier U12 pin 1, 10-3030VAD8251 datasheet

T_STG

Storage Temperature-25+85°C


Recommended Operating Conditions

...

Storage Temperature
Scroll Title
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titleRecommended operating conditions.

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SymbolsMin
MaxUnitReference Document

VIN supply voltage (5.0V nominal)

4.755.25V
I/O Input voltage for FPGA I/O bank-0.53.6VIntel MAX 10 datasheet
Analog Input Voltage on ADC IC U15 pins03.6VAD4003BCPZ datasheet
Analog reference voltage on IC U1513.3VAD4003BCPZ datasheet
MaxUnitReference Document

VIN supply voltage (5.0V nominal)

4.755.25V
Analog input voltage on amplifier U12 pin 1 (CH1-), 10 (CH1+)-1010VAD8251 datasheet

T_OP

0+70°CW9864G6JT-6 datasheet


Physical Dimensions

Module size: 25 mm × 86.5 mm × 25 mm.  Please download the assembly diagram for exact numbers.

PCB thickness: 1.65 22 mm.

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In 'Physical Dimension' section, top and button view of moduloe must be insterted, information regarding physical dimention can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part)for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


...

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titlePhysical Dimension


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titleTrenz Electronic Shop Overview

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Trenz shop TEI0015 overview page
English pageGerman page


...

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titleHardware Revision History

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DateRevisionChangesDocumentation Link
2019-02-061101-REV01


Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

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titleBoard hardware revision number.


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titleDocument change history.

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DateRevisionContributorDescription

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prefixv.
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change list

  • multiple sections updated

2020-02-04

v.98ED
  • Technical Specifications updated

  • Power Rails updated

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