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The Trenz Electronic TEI0016 is an commercial-grade module based on Intel® MAX 10. Intel MAX 10 devices are the ideal solution for system management, I/O expansion, communication control planes, industrial, automotive, and consumer applications.

Refer to http://trenz.org/tei0016-info for the current online version of this manual and other available documentation.

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titleTEI0016 block diagram


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Main Components

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titleTEI0016 main components


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  1. SMA Connector, J5...6
  2. Instrumentation Amplifier, U12
  3. Analog to Digital Convertor, U6
  4. Voltage Reference, U8
  5. Voltage Regulator, U10- U13- U16
  6. Buck Switching Voltage3 Regulator, U11- U4
  7. SDRAM Memory, U2
  8. Intel® MAX 10, U1
  9. SPI Flash Memory, U5
  10. Oscillator 12MHz12.00 MHz MEMS oscillator, U7
  11. FTDI USB USB2 to JTAG/UART convertoradapter, U3
  12. User LEDs, D2...9
  13. 4Kb EEPROM, U9
  14. Configuration LED (Red) , D10
  15. Power-on LED (Green), D1
  16. SwitchPush button, S1...2
  17. USB port, J9
  18. Micro USB2 socket (Receptacle), J9
  19. 1x14 pin header (Not assembled), J2
  20. 1x6 pin header (Not assembled), J4
  21. Jumper, J3
  22. 1x14 pin header Pin Holder (Not assembled), J1...4

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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JTAG Interface

JTAG access to the TEI0015 TEI0016 SoM through pin header connector J4.

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Chip/InterfaceDesignatorNotes
SDRAMU2
FTDI FT2232HU3JTAG/UART Adapter
SPI Flash MemoryU5
EEPROMU9
OscillatorU712MHz clock source
A2D ConvertorU6Analog to Digital Convertor
8x User LEDsD2...9Red LEDs


SDRAM

TEI0015 TEI0016 is equipped with a Winbond 64 MBit (8 MByte) SDRAM chip in standard configuration, variants with 256 Mbit (32 MByte) memory density are also available. The SDRAM chip is connected to the FPGA bank 3 and 6 via 16-bit memory interface with 166MHz clock frequency and CL3 CAS latency.

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