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Overview

The Cyclone 10 LP Reference Kit is the world's first development board with a 55 kLE (Logic Elements) Intel Cyclone 10 LP and a variety of interfaces for numerous applications. The board is comprehensively tested and ready for use with end products and can also be ordered in customer-specific variants according to your requirements.

Refer to http://trenz.org/tei0009-info for the current online version of this manual and other available documentation.

Key Features

• Intel Cyclone 10 LP [10CL055YU484C8G]
  • Package: UBGA-484
  • Speed Grade: 8 (Slowest)
  • Temperature: 0 °C to 85° C
  • Package compatible device 10CL016, 10CL040, 10CL055, 10CL080 as assembly variant on request is possible
• 16 MBit (2 MByte) Flash Memory (optional up to 32 MBit (4 MByte))
• Integrated USB-JTAG Programmer
• Pin Header Connectors
• 64 MBit (8 MByte) SDRAM (optional up to 512 MBit (64 MByte))
• 64 MBit (8 MByte) User Quad-SPI Flash Memory (optional up to 128 MBit (16 MByte))
• 64 MBit (8 MByte) HyperRAM (Pseudo SRAM) (optional up to 128 MBit (16 MByte))
• 2x MAC Address EEPROM
• 2x Fast Ethernet PHY (10/100 Mbps)
• 8-Channel, 12-Bit, configurable ADC/DAC
  
• D-Sub Connector
• 2x RJ45 Connector
• LEDs:
  • Status LEDs, Power LED
  • 13x User LEDs
  • 7-Segment Display
• Push Buttons:
  • 2x Reset Push Buttons
  • 5x User Push Buttons
• I/O: 70 GPIO
• 5 V Power Supply
  
• Dimension: 95 mm x 110 mm
• Others:
  • Reverse Supply Protection
  • Undervoltage/Overvoltage Protection

Block Diagram

Main Components

1. Power Jack, J12
2. RJ45 Socket, J8...9
3. D-Sub Connector, J11
4. Push Button (Reset), S7
5. Grove Connector, J5
6. Undervoltage/Overvoltage Protector, U9
7. 7-Segment LED, D11
8. 1x6 Pin Header, J4
9. 1x8 Pin Header, J2...3
10. 8x User LEDs (Red), D2...9
11. 5x User LEDs (Red), D13...17
12. 5x User Push Buttons, S1 - S3...6
13. Red LED (CONF_DONE), D10
14. PSRAM Memory, U3
15. SDRAM Memory, U10
16. Voltage Regulator, U4 - U7
17. AD/DA Converter, U2
18. 6x Pmod Host Socket, P1...6
19. Intel Cyclone 10 LP, U1
20. Serial Configuration Memory, U5
21. 1x10 Pin Header, J1
22. EEPROM, U15 - U18 - U20
23. FTDI USB 2 to JTAG/UART Converter, U14
24. Micro USB 2.0, J10
25. Push Button (RST_GPIO), S2
26. Oscillator, U22
27. Ethernet PHY, U17 - U19
28. QSPI Flash Memory, U12

Initial Delivery State

Configuration Signals

Configuration mode has been set to AS (Active Serial) configuration. 

Signals, Interfaces and Pins

I/Os on Pin Headers and Connectors

FPGA bank number and number of I/O signals connected to the connectors:

Pmod Host Socket

TEI0009 has 6 Pmod 2x6 host sockets which are connected to Cyclon 10 LP (U1).

Pin Header

TEI0009 has 5 pin headers. The pin headers J1...4 are usable for Arduino modules, too.

Micro USB 2.0 Connector

FTDI FT2232 (U14) can be accessed through micro USB 2.0 B connector (J10) for JTAG (channel A). Channel B is connected to the FPGA and can be used for UART or other standards.

RJ45 Connectors

TEI0009 is equipped with two RJ45 connectors and two Ethernet PHYs. RJ45 connectors J8 and J9 are connected to Ethernet PHYs U17 and U19 respectively.

D-Sub Connector

TEI0009 is equipped with a D-Sub connector which provides interface to Cyclone 10 LP through Bank 2.

On-board Peripherals

QSPI Flash Memory

There is a 64 MBit (8 MByte) QSPI Flash memory (U12) provided by Integrated Silicon Solution Inc. which can be used to store data or configuration. Up to 128 MBit (16 MByte) memory is available on other assembly option.

SDRAM Memory

The TEI0009 has 64 MBit (8 MByte) volatile memory provided by Integrated Silicon Solution Inc., SDRAM IC(U10) for storing user application code and data. Up to 512 MBit (64 MByte) SDRAM is available on other assembly option.

• Part number: IS42S16400J-7BL

• Supply voltage: 3.3 V

• Clock Frequency: 143 MHz (optional up to 200 MHz)
  

• Temperature: 0°C to 70°C (optional other ranges are available)

PSRAM Memory

The TEI0009 is integrated with 64 Mbit (8 MByte) Pseudo Static Random Access Memory (PSRAM) using a self-refresh DRAM array organized as 8M words by 8 bits. The device supports a HyperBus interface, Very Low Signal Count (Address, Command and data through 8 DQ pins), Hidden Refresh Operation, and Automotive Temperature Operation. Up to 128 MBit (16 MByte) memory is available on other assembly option.

• Part number: IS66WVH8M8BLL

• Supply voltage: 3.3 V

• Clock Frequency: 100 MHz

• Temperature: -40°C to 85°C (optional other ranges are available)

7-Segment Display

The TEI0009 has a 4-Digit-7-Segment LED display which is connected to Bank 6.

FTDI FT2232

The FTDI chip U14 converts signals from USB 2.0 to a variety of standard serial and parallel interfaces. Refer to the FTDI data sheet for more information about the capacity of the FT2232H chip.
Channel A of FTDI FT2232H chip is used in MPPSE mode for JTAG. Channel B is routed to FPGA bank 6 and is usable for other standard interfaces.

The configuration of FTDI FT2232H chip is pre-programmed on the EEPROM U15.

Serial Configuration Memory

On-board serial configuration memory (U5) is provided by Intel with 16 MBit (2 MByte) storage capacity. This non volatile memory is used to store initial FPGA configuration via JTAG interface. The memory is connected to FPGA bank 1 via active serial (AS) x1 interface.

Ethernet PHY

The TEI0009 is equipped with two Ethernet PHY (U17, U19) which are connected to two RJ45 (J8, J9) connectors. 

EEPROM

TEI0009 has three EEPROM, U15, U18 and U20. U15 is pre-programmed for the FTDI FT2232H configuration. U18 and U19 are used for the MAC address configuration.

ADC/DAC

The TEI0009 module is equipped with a 12-Bit ADC/DAC (U2).

LEDs

Push Buttons

Clock Sources

Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of 3 A for system startup is recommended.

Power Consumption

* TBD - To Be Determined

Power Distribution Dependencies

Power-On Sequence

There is the following power-on sequence. The DCDC converter U7 enables the device U4 according to the diagram below.

Voltage Protection Circuit

There is a transient voltage suppression diode (D12) which protects the board from voltage spikes. Additionaly, there is an overvoltage / undervoltage protection device (U9) for board protection.

Power Rails

Bank Voltages

Technical Specifications

Absolute Maximum Ratings

Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Physical Dimensions

• Module size: 95 mm × 110 mm.  Please download the assembly diagram for exact numbers.

• PCB thickness: 1.6 mm.

Currently Offered Variants 

Revision History

Hardware Revision History

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Document Change History

Disclaimer