The Cyclone10 Cyclone 10 LP Reference Kit is the world's first development board with a 55 kLE (Logic Elements) Intel Cyclone 10 LP and a variety of interfaces for numerous applications.The board is comprehensively tested and ready for use with end products and can also be ordered in customer-specific variants according to your requirements.
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Note: 'Key Features' description: Important components and connector or other Features of the module → please sort and indicate assembly options
Intel® Intel Cyclone 10 LP LP [10CL055YU484C8G],
Package: UBGA-484
Speed Grade: 8 (Slowest)
Temperature: 0 °C to 85° C
Package compatible device 10CL016, 10CL040, 10CL055, 10CL080 as assembly variant on request is possible
16 MBit (2 MByte) Flash Memory (optional up to 32 MBit (4 MByte)possible)
Integrated USB-JTAG Programmer
Pin Header Connectors
64 MBit (8 MByte) SDRAM , (optional up to 512 MBit (64 MByte)memory mountable)
64 MBit (8 MByte) User Quad-SPI Flash Memory , (optional up to 128 MBit (16 MByte)memory mountable)
64 MBit (8 MByte) HyperRAM (Pseudo SRAM) , (optional up to 128 MBit (16 MByte))memory mountable
2x MAC Address EEPROM
2x Fast Ethernet PHY (10/100 Mbps)
8-Channel, 12-Bit, configurable ADC/DAC
D-Sub Connector
2x RJ45 Connector
LEDs:
Status LEDs, Power LED
13x User LEDs
7-Segment Display
Push Buttons:
2x Reset Push Buttons
5x User Push Buttons
I/O: 70 GPIO
5 V Power Supply
Dimension: 95 mm x 110 mm
Others:
Reverse Supply Protection
Undervoltage/Overvoltage Protection
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Figure_OV_BD
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TEI0009 block diagramBlock Diagram
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Main Components
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TEI0009 main componentsMain Components
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Power Jack, J12
RJ45 Socket, J8...9
D-Sub Connector, J11
Push Button (Reset), S7
Grove Connector, J5
Undervoltage/Overvoltage Protector, U9
7-Segment LED, D11
1x6 Pin Header, J4
1x8 Pin Header, J2...3
8x User LEDs (Red), D2...9
5x User LEDs (Red), D13...17
5x User Push Buttons, S1 - S3...6
Red LED (CONF_DONE), D10
PSRAM Memory, U3
SDRAM Memory, U10
Voltage Regulator, U4 - U7
AD/DA Converter, U2
6x Pmod Host Socket, P1...6
Intel® Intel Cyclone 10 LP, U1
Serial Configuration Memory, U5
1x10 Pin Header, J1
EEEPROMEEPROM, U15 - U18 - U20
FTDI USB2 USB 2 to JTAG/UART Converter, U14
Micro USB 2.0, J10
Push Button (RST_GPIO), S2
Oscillator, U22
Ethernet PHY, U17 - U19
QSPI Flash Memory, U12
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Initial delivery state of programmable devices Delivery State of Programmable Devices on the moduleModule
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Storage device name
Content
Notes
QSPI Flash (U12)
Not programmed
EEPROM (U15)
Programmed
FTDI configurationConfiguration
EEPROM (U18, U20)
Not programmed
Except Ethernet MAC
SDRAM (U10)
Not programmed
PSRAM (U3)
Not programmed
Serial Configuration Memory (U5)
Programmed
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Boot process.Process
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MODE Signal State
MSEL0
MSEL1
MSEL2
MSEL3
Connected to
Boot Mode
MSEL[0:3]
0
1
0
0
Bank 6
AS (Active Serial)
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Reset process.Process
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Signal
Connected to
Note
RESET
S7 (Push button)S7, Push Button
Connected to nCONFIG.
Signals, Interfaces and Pins
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FPGA bank number and number of I/O signals connected to the B2B connectorconnectors:
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General I/O to Pin header Header and Pmod SMD connectors informationConnectors Information
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FPGA Bank
Connector
I/O Signal Count
Voltage Level
Notes
Bank 1
J1 (Pin header)
8 Single ended
3.3 V
J2 (Pin header)
8 Single ended
3.3 V
J4 (Pin header)
6 Single ended
3.3 V
Bank 2
J3 (Pin header)
1 Single ended
3.3 V
P1 (Pmod Host Socket)
8 Single ended
3.3 V
P2 (Pmod Host Socket)
8 Single ended
3.3 V
J11 (VGA host Host Socket)
14 Single ended
3.3 V
Bank 6
J5 (Grove connectorConnector)
2 Single ended
3.3 V
Bank 7
P5 (Pmod Host Socket)
8 Single ended
3.3 V
P6 (Pmod Host Socket)
8 Single ended
3.3 V
Bank 8
P3 (Pmod Host Socket)
8 Single ended
3.3 V
P4 (Pmod Host Socket)
8 Single ended
3.3 V
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PMod SMD host socket informationPmod SMD Host Socket Information
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Designator
Signals
Connected to
Notes
P1
P1_IO1...8
Bank 2
P2
P2_IO1...8
Bank 2
P3
P3_IO1...8
Bank 8
P4
P4_IO1...8
Bank 8
P5
P5_IO1...8
Bank 7
P6
P6_IO1...8
Bank 7
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RJ45 connectors informationConnectors Information
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Pin
Schematic
ETH1 Pin
ETH2 Pin
Notes
TD+
ETH1_TX_P, ETH2_TX_P
U17 - TXP
U19 - TXP
CT
ETH1_CTREF_TCT, ETH2_CTREF_TCT
-
-
TD-
ETH1_TX_N, ETH2_TX_N
U17 - TXM
U19 - TXM
RD+
ETH1_RX_P, ETH2_RX_P
U17 - RXP
U19 - RXP
CT
ETH1_CTREF_RCT, ETH2_CTREF_RCT
-
-
RD-
ETH1_RX_N, ETH2_RX_N
U17 - RXM
U19 - RXM
LED Green
ETH1_LED0, ETH2_LED0
U17 - LED0/NWAYEN
U19 - LED0/NWAYEN
LED Yellow
ETH1_LED1, ETH2_LED1
U17 - LED1/SPEED
U19 - LED1/SPEED
D-Sub
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Connector
TEI0009 is equipped with a D-Sub connector which provides interface to Cyclone 10 LP through Bank 2.
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VGA host socket informationHost Socket Information
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Schematic
Corresponding Signals
Connected to
Notes
VGA_RED
VGA_R0...3
Bank 2
Red channelChannel
VGA_GREEN
VGA_G0...3
Bank 2
Green channelGreen Channel
VGA_BLUE
VGA_B0...3
Bank 2
Blue channelBlue Channel
VGA_RGB_HSYNC
VGA_HS
Bank 2
Horizontal syncSync
VGA_RGB_VSYNC
VGA_VS
Bank 2
Vertical syncSync
On-board Peripherals
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Notes :
add subsection for every component which is important for design, for example:
Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.
There is a 64MBit 64 MBit (8 MByte) QSPI Flash memory (U12) provided by Integrated Silicon Solution Inc. which can be used to store data or configuration. Up to 128 MBit (16 MByte) memory is possible available on other assembly option.
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Quad SPI interface Interface MIOs and pinsPins
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Pin
Schematic
Connected to
Notes
CS
F_CS
Bank 7
CLK
F_CLK
Bank 7
IO0...3
F_IO0...3
Bank 7
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The TEI0009 has 64 MBit (8 MByte) volatile memory provided by Integrated Silicon Solution Inc., SDRAM IC(U10) for storing user application code and data. Up to 512 MBit (64 MByte) SDRAM is possible available on other assembly option.
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The TEI0009 is integrated with 64 Mbit (8 MByte) Pseudo Static Random Access Memory (PSRAM) using a self-refresh DRAM array organized as 8M words by 8 bits. The device supports a HyperBus interface, Very Low Signal Count (Address, Command and data through 8 DQ pins), Hidden Refresh Operation, and Automotive Temperature Operation. Up to 128 MBit (16 MByte) memory is possible available on other assembly option.
Part number: IS66WVH8M8BLLIS66WVH8M8
Supply voltage: 3.3 V
Clock Frequency: 100 MHz
Temperature: -40°C to 85°C (optional other ranges are available)
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LED 7-Segment pinsLED Pins
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Pin
Schematic
Connected to
Notes
A/L1
SEG_CA
Bank 6
B/L2
SEG_CB
Bank 6
C/L3
SEG_CC
Bank 6
D
SEG_CD
Bank 6
E
SEG_CE
Bank 6
F
SEG_CF
Bank 6
G
SEG_CG
Bank 6
DP
SEG_CDP
Bank 6
A1
SEG_AN
Bank 6
A2
SEG_AN4
Bank 6
A3
SEG_AN3
Bank 6
A4
SEG_AN2
Bank 6
L1-L3
SEG_AN1
Bank 6
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FTDI chip interfaces Chip Interfaces and pinsPins
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FTDI Chip Pin
Signal Schematic Name
Connected to
Notes
ADBUS0
TCK
Bank 1
JTAG interface
ADBUS1
TDI
Bank 1
ADBUS2
TDO
Bank 1
ADBUS3
TMS
Bank 1
BDBUS0...7
BDBUS0...7
Bank 6
BCBUS0...7
BCBUS0...7
Bank 6
EECS
EECS
EEPROM, U15
EECLK
EECLK
EEPROM, U15
EEDATA
EEDATA
EEPROM, U15
OSCI
CK12M
12 MHz Oscillator, U16
DM
D_N
Micro USB 2.0, J10
DP
D_P
Micro USB 2.0, J10
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FTDI and EEPROM pin connectionsSerial Configuration Memory
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Configuration Memory Pin
Signal Schematic Name
Connected to
Notes
DATA1
AS_DATA0
U1, Bank 1
DATA0
AS_ASDO
U1, Bank 1
nCS
AS_nCS
U1, Bank 1
DCLK
AS_DCLK
U1, Bank 1
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Ethernet PHY connections Connections and pinsPins
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Ethernet PHY Pin
Signal Schematic Names (ETH1/ETH2)
ETH 1
ETH 2
Note
TXD0...3
ETH1_TXD0...3, ETH2_TXD0...3
Bank 5
Bank 5
TXC
ETH1_TXC, ETH2_TXC
Bank 5
Bank 5
TXEN
ETH1_TXEN, ETH2_TXEN
Bank 5
Bank 5
RXD0...3
ETH1_RXD0...3, ETH2_RXD0...3
Bank 5
Bank 5
RXC/B-CAST_OFF
ETH1_RXC, ETH2_RXC
Bank 5
Bank 5
RXER/ISO
ETH1_RXER, ETH2_RXER
Bank 5
Bank 5
INTRP/nNAND_Tree
ETH1_INTRP, ETH2_INTRP
Bank 5
Bank 5
XI
ETH1_CLKIN, ETH2_CLKIN
Oscillator, U22
Oscillator, U22
MDC
ETH1_MDC, ETH2_MDC
Bank 5
Bank 5
MDIO
ETH1_MDIO, ETH2_MDIO
Bank 5
Bank 5
COL/CONFIG0
ETH1_COL, ETH2_COL
Bank 5
Bank 5
CRS/CONFIG1
ETH1_CRS, ETH2_CRS
Bank 5
Bank 5
RXDV/CONFIG2
ETH1_RXDV, ETH2_RXDV
Bank 5
Bank 5
LED0/NWAYEN
ETH1_LED0, ETH2_LED0
RJ45 - Green LED, J8
RJ45 - Green LED, J9
LED1/SPEED
ETH1_LED1, ETH2_LED1
RJ45 - Yellow LED, J8
RJ45 - Yellow LED, J9
nRST
ETH1_RST, ETH2_RST
Bank 5
Bank 5
RXM
ETH1_RX_N, ETH2_RX_N
RJ45, J8
RJ45, J9
RXP
ETH1_RX_P, ETH2_RX_P
RJ45, J8
RJ45, J9
TXM
ETH1_TX_N, ETH2_TX_N
RJ45, J8
RJ45, J9
TXP
ETH1_TX_P, ETH2_TX_P
RJ45, J8
RJ45, J9
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FTDI and EEPROM pin connectionsPin Connections
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Designator
EEPROM Pin
Signal Schematic Names
Connected to
Notes
U15
CS
EECS
FTDI, U14
CLK
EECLK
FTDI, U14
DIN/DOUT
EEDATA
FTDI, U14
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I2C EEPROM interface Interface MIOs and pinsPins
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Designator
Pin
Schematic
Connected to
Grove Header
Notes
U18, U20
SCL
I2C_SCL
Bank 6
J5
SDA
I2C_SDA
Bank 6
J5
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I2C address Address for EEPROM
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I2C Address
Designator
Notes
0x50
U18
0x51
U20
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The TEI0009 module is equipped with a 12bit -Bit ADC/DAC (U2).
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ADC/DAC interface Interface and pinsPins
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Pins
Schematic
Connected to
Notes
nRESET
ADDA_RSTN
Bank 2, U1
nSYNC
ADDA_SYNC
Bank 2, U1
SCLK
MCLK
Bank 2, U1
SDI
MOSI
Bank 2, U1
SDO
MISO
Bank 2, U1
VREF
AREF
Pin Header, J1
External reference is 1 V to 3.3 V. → ??? Internal reference is 2.5 V.
IO0...5
AIN0...5
Bank 1, U1
Pin Header, J4
IO6
AIN6
Testpoint, TP1
IO7
AIN7
Testpoint, TP2
LEDs
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On-board LEDs
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Schematic
Designator
Color
Connected to
Active Level
Note
LED1...8
D2...9
Red
Bank 3
High
LED_PB1...5
D13...17
Red
Bank 7
High
CONF_DONE
D10
Red
Bank 6
Low
3.3V
D1
Green
3.3V
High
Push Buttons
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On-board Push Buttons
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Schematic
Designator
Connected to
Functionality
Note
RESET
S7
RESETBank 1
HighReset
S2
RST_GPIO
S2
High
Bank 4
Reset/GPIOS1, S3...6
USER_BTN1...5
User push buttons
connected to bank 3
Clock Sources
S3
Bank 3
User Push Button
USER_BTN2
S4
Bank 3
User Push Button
USER_BTN3
S5
Bank 3
User Push Button
USER_BTN4
S6
Bank 3
User Push Button
USER_BTN5
S1
Bank 3
User Push Button
Clock Sources
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Oscillators
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Osillators
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Designator
Description
Frequency
Note
U22
MEMS Crystal Oscillator
25 MHz
U16
MEMS Crystal Oscillator
12 MHz
Power and Power-On Sequence
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Power supply with minimum current capability of 1A 3 A for system startup is recommended.
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Power Distribution
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Power-On Sequence
There is no the following power-on sequence, After power on, all regulators will be enabled as you can see in the diagram below.. The DCDC converter U7 enables the device U4 according to the diagram below.
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Power Sequency
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Voltage
...
Protection Circuit
There is a diod transient voltage suppression diode (D12) which protects the board from reverse polarity, Additionaly voltage spikes. Additionaly, there is an Over/under voltage (IC) which protects the board from over voltage damagesovervoltage / undervoltage protection device (U9) for board protection.
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Voltage Monitor Protection Circuit
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Power Rails
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Module power rails.Power Rails
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Connector Designator
VCC /
VCCIO Schematic Name
Pin
VCC
Direction
Notes
J12
VIN
1
5 V
In
J3
3.3V
2, 4
3.3 V
Out
5V
5
5 V
Out
J5
3.3V
3
3.3 V
Out
Bank Voltages
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Zynq SoC bank voltages.Intel Cyclone 10 LP Bank Voltages
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Bank
Schematic Name
Voltage
Notes
Bank 1
VCCIO1
3.3V
Bank 2
VCCIO2
3.3V
Bank 3
VCCIO3
3.3V
.8
VCCIO1...8
Bank 4
VCCIO4
3.3V
Bank 5
VCCIO5
3.3V
Bank 6
VCCIO6
3.3V
Bank 7
VCCIO7
3.3V
Bank 8
VCCIO8
3.3V
Technical Specifications
Absolute Maximum Ratings
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Absolute maximum ratingsMaximum Ratings
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Symbols
Description
Min
Max
Unit
Note
VIN
Input supply voltage
Input Supply Voltage (J12)
4.5
-5.0
5.
0
5
V
VCCIO
I/O buffers power supply
AREF
External Reference Voltage for ADC/DAC (J1 - 8)
-0.
5
3
3.
75
6
V
VCCINT
Core voltage
-0.5
1.8
V
VCCD_PLL
PLL digital power supply
-0.5
1.8
V
VCCA
Phase-locked loop (PLL) analog power supply
Only for input usage.
AIN0...5
Input Voltage for ADC/DAC (J4)
-0.
5
3
3.
75
6
V
V_AN
Analog Input Voltage on
Only for input usage.
AIN6...7
Input Voltage for ADC/DAC (
U2
TP1...2)
-0.3
3.6
V
V_DIG
Digital Input Voltage on ADC/DAC (U2
Only for input usage.
EXT_RST
External Reset (J3 - 3)
-0.
3
5
3
4.
6
2
V
V
D0_
REF_IN
RXD, D1_TXD, D2...7
Arduino Interface (J2
Internal Reference Voltage Voltage on ADC/DAC (U2
)
-0.
3
5
3
4.
6
2
V
V_REF_EX
External Reference Voltage Voltage on ADC/DAC (U2)