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Table of Contents

Table of Contents

Overview

The Cyclone10 Cyclone 10 LP Reference Kit is the world's first development board with a 55kLE 55 kLE (Logic Elements) Intel Cyclone 10 LP and a variety of interfaces for numerous applications. The board is comprehensively tested and ready for use with end products and can also be ordered in customer-specific variants according to your requirements.

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Notes :

Key Features

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Note:
 'Key Features' description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

  • Intel Cyclone 10 LP FPGA 10CL055YU484C8G, 55 kLE in 484-pin[10CL055YU484C8G]
    • Package: UBGA-484
    • Speed Grade: 8 (Slowest)
    • Temperature: 0 °C to 85° C
    • Package compatible device 10CL016, 10CL040, 10CL055, 10CL080 as assembly variant on request is possible
  • 16 MBit (2 MByte) Flash Memory 16 MBit flash memory (optional up to 32 MBit possibleMBit (4 MByte))
  • Integrated USB-JTAG Programmer 2
  • Pin Header Connectors
  • 256 64 MBit (8 MByte) SDRAM (optional up to 512 MBit possible(64 MByte)) SDRAM128
  • 64 MBit (optional up to 512 MBit possible8 MByte) User Quad-SPI Flash memoryMemory (optional up to 128 MBit (16 MByte))
  • 64 MBit (8 MByte) HyperRAM (Pseudo SRAM) (optional up to 128 MBit possible(16 MByte))
  • 2 x 2x MAC address Address EEPROM
  • 2 x 2x Fast Ethernet PHY (10/100 Mbps)
  • 8-channelChannel, 12-bitBit, configurable ADC/DAC with on-chip reference
  • D-Sub Connector
  • 2x RJ45 Connector
  • LEDs:
    • Status LEDs, Power LED
    • 13 x 13x User LEDs
    • 1 x 7-segment display
    • 2 x reset buttons
    • Segment Display
  • Push Buttons:
    • 2x Reset Push Buttons
    • 5x User Push Buttons
  • I/O: 70 GPIO
  • 5 V Power Supply
  • Dimension: 95 mm x 110 mm
  • Others:
    • Reverse Supply Protection
    • Undervoltage/Overvoltage Protection5 x user buttons

Block Diagram

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Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


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titleTEI0009 block diagramBlock Diagram


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Main Components

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Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


Note

For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .


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titleTExxxx main componentsTEI0009 Main Components


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  1. Power Jack, J12
  2. RJ45 Socket, J8
  3. ...
  4. ...
  5. ...

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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anchorTable_OV_IDS
titleInitial delivery state of programmable devices on the module
  1. 9
  2. D-Sub Connector, J11
  3. Push Button (Reset), S7
  4. Grove Connector, J5
  5. Undervoltage/Overvoltage Protector, U9
  6. 7-Segment LED, D11
  7. 1x6 Pin Header, J4
  8. 1x8 Pin Header, J2...3
  9. 8x User LEDs (Red), D2...9
  10. 5x User LEDs (Red), D13...17
  11. 5x User Push Buttons, S1 - S3...6
  12. Red LED (CONF_DONE), D10
  13. PSRAM Memory, U3
  14. SDRAM Memory, U10
  15. Voltage Regulator, U4 - U7
  16. AD/DA Converter, U2
  17. 6x Pmod Host Socket, P1...6
  18. Intel Cyclone 10 LP, U1
  19. Serial Configuration Memory, U5
  20. 1x10 Pin Header, J1
  21. EEPROM, U15 - U18 - U20
  22. FTDI USB 2 to JTAG/UART Converter, U14
  23. Micro USB 2.0, J10
  24. Push Button (RST_GPIO), S2
  25. Oscillator, U22
  26. Ethernet PHY, U17 - U19
  27. QSPI Flash Memory, U12

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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Storage device name

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Content

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Notes

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Quad SPI Flash

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Configuration Signals

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Overview of Boot Mode, Reset, Enables.


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MODE Signal State

Boot Mode
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Signal

B2BI/ONote

Signals, Interfaces and Pins

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

Storage device name

Content

Notes

QSPI Flash (U12)

Not programmed


EEPROM (U15)Programmed

FTDI Configuration

EEPROM (U18, U20)Not programmedExcept Ethernet MAC
SDRAM (U10)Not programmed


PSRAM (U3)Not programmed
Serial Configuration Memory (U5)Programmed


Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.

Configuration mode has been set to AS (Active Serial) configuration. 

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titleBoot Process

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MODE Signal State

MSEL0MSEL1MSEL2MSEL3Connected to Boot Mode

MSEL[0:3]

0100Bank 6

AS (Active Serial)



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titleReset Process
Scroll Title
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titleGeneral PL I/O to B2B connectors information

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FPGA BankB2B ConnectorI/O Signal CountVoltage LevelNotes

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JTAG access to the TExxxx SoM through B2B connector JMX.

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anchorTable_SIP_JTG
titleJTAG pins connection

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JTAG Signal

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B2B Connector

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MIO Pins

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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

Signal

Connected to Note

RESET

S7, Push ButtonConnected to nCONFIG.


Signals, Interfaces and Pins

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

I/Os on Pin Headers and Connectors

FPGA bank number and number of I/O signals connected to the connectors:

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FPGA BankConnector I/O Signal CountVoltage LevelNotes
Bank 1J1 (Pin header)8 Single ended3.3 V
J2 (Pin header)8 Single ended3.3 V
J4 (Pin header)6 Single ended3.3 V
Bank 2

J3 (Pin header)

1 Single ended3.3 V
P1 (Pmod Host Socket)8 Single ended3.3 V
P2 (Pmod Host Socket)8 Single ended3.3 V
J11 (VGA Host Socket)14 Single ended3.3 V
Bank 6J5 (Grove Connector)2 Single ended3.3 V
Bank 7P5 (Pmod Host Socket)8 Single ended3.3 V
P6 (Pmod Host Socket)8 Single ended3.3 V
Bank 8P3 (Pmod Host Socket)8 Single ended3.3 V
P4 (Pmod Host Socket)8 Single ended3.3 V


Pmod Host Socket

TEI0009 has 6 Pmod 2x6 host sockets which are connected to Cyclon 10 LP (U1).

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SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

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anchorTable_OBP_MIOs
titleMIOs pins

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

...

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Notes :

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titleOn board peripheralsPmod SMD Host Socket Information

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Chip/Interface

Designator
Notes

Quad SPI Flash Memory

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

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titleQuad SPI interface MIOs and pins
SignalsConnected to Notes
P1P1_IO1...8Bank 2
P2P2_IO1...8Bank 2
P3P3_IO1...8Bank 8
P4P4_IO1...8Bank 8
P5P5_IO1...8Bank 7
P6P6_IO1...8Bank 7


Pin Header

TEI0009 has 5 pin headers. The pin headers J1...4 are usable for Arduino modules, too.

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titleI2C interface MIOs and pins
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MIO PinSchematicU? PinNotes
Pin Header J1


Pin Header J1SignalsConnected to Notes
J1 - 1...6D8...13Bank 1
J1 - 7GND

J1 - 8AREFADC/DAC
J1 - 9D14_SDABank 1
J1 - 10D14_SCLBank 1



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titleI2C Address for RTCPin Header J2

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MIO
Pin Header J2
I2C Address
Signals
Designator
Connected to Notes

...

J2 - 1D0_RXDBank 1
J2 - 2D1_TXDBank 1
J2 - 3...8D2...4Bank 1



U?? Pin
Scroll Title
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titleI2C EEPROM interface MIOs and pinsPin Header J3

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MIO
Pin Header J3
Schematic
SignalsConnected to Notes
scroll
J2 -
title
1
anchorTable_OBP_I2C_EEPROM
titleI2C address for EEPROM
Scroll Table LayoutorientationportraitsortDirectionASCrepeatTableHeadersdefaultstylewidthssortByColumn1sortEnabledfalsecellHighlightingtrueMIO PinI2C AddressDesignatorNotes

LEDs

NC-
J3 - 23.3V3.3 V
J3 - 3EXT_RSTBank 2Pulled-up to 3.3 V
J3 - 43.3V3.3 V
J3 - 55V5 V
J3 - 6...7GNDGND
J2 - 8NC-



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titlePin Header J4
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titleOn-board LEDs

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Schematic
Pin Header J4
Color
SignalsConnected
to
Active LevelNote

DDR3 SDRAM

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.

  • Part number: 
  • Supply voltage:
  • Speed: 
  • NOR Flash
  • Temperature: 

Ethernet

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anchorTable_OBP_ETH
titleEthernet PHY to Zynq SoC connections
to Notes
J4 - 1...6AIN0...5FPGA Bank 1 and ADC/DAC



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titlePin Header J5

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Pin Header J5SignalsConnected to Notes
J5 - 1I2C_SCLFPGA Bank 6 and EEPROM (U18, U20)Pulled-up to 3.3V.
J5 - 2I2C_SDAFPGA Bank 6 and EEPROM (U18, U20)Pulled-up to 3.3V.
J5 - 33.3V3.3 V
J5 - 4GNDGND


Micro USB 2.0 Connector

FTDI FT2232 (U14) can be accessed through micro USB 2.0 B connector (J10) for JTAG (channel A). Channel B is connected to the FPGA and can be used for UART or other standards.

RJ45 Connectors

TEI0009 is equipped with two RJ45 connectors and two Ethernet PHYs. RJ45 connectors J8 and J9 are connected to Ethernet PHYs U17 and U19 respectively.

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titleRJ45 Connectors Information

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CAN Transceiver

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titleCAN Tranciever interface MIOs

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Bank
PinSchematic
U??
ETH1 PinETH2 PinNotes
D-TxDriver InputR-RxReciever Output

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anchorTable_OBP_CLK
titleOsillators

...

Power and Power-On Sequence

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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit
Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .

TD+ETH1_TX_P, ETH2_TX_PU17 - TXPU19 - TXP
CTETH1_CTREF_TCT, ETH2_CTREF_TCT--
TD-ETH1_TX_N, ETH2_TX_NU17 - TXMU19 - TXM
RD+ETH1_RX_P, ETH2_RX_PU17 - RXPU19 - RXP
CTETH1_CTREF_RCT, ETH2_CTREF_RCT--
RD-ETH1_RX_N, ETH2_RX_NU17 - RXMU19 - RXM
LED GreenETH1_LED0, ETH2_LED0U17 - LED0/NWAYENU19 - LED0/NWAYEN
LED YellowETH1_LED1, ETH2_LED1U17 - LED1/SPEEDU19 - LED1/SPEED


D-Sub Connector

TEI0009 is equipped with a D-Sub connector which provides interface to Cyclone 10 LP through Bank 2.

Power Supply

Power supply with minimum current capability of xx A for system startup is recommended.

Power Consumption

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titlePower ConsumptionVGA Host Socket Information

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Power Input PinTypical Current
VINTBD*

* TBD - To Be Determined

Power Distribution Dependencies

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anchorFigure_PWR_PD
titlePower Distribution
SchematicCorresponding SignalsConnected toNotes
VGA_REDVGA_R0...3Bank 2Red Channel
VGA_GREENVGA_G0...3Bank 2Green Channel
VGA_BLUEVGA_B0...3Bank 2Blue Channel
VGA_RGB_HSYNCVGA_HSBank 2Horizontal Sync
VGA_RGB_VSYNCVGA_VSBank 2Vertical Sync


On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs


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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection

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titlePower SequencyOn-board Peripherals

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Voltage Monitor Circuit

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titleVoltage Monitor Circuit
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Chip/InterfaceDesignatorNotes
QSPI Flash MemoryU12
SDRAM MemoryU10
PSRAM MemoryU3
7-Segment LEDD11
FTDI FT2232U14
Ethernet PHYU17, U19
Serial Configuration MemoryU5
ADC/DACU2
EEPROMU15, U18, U20
User LEDsD2...D10, D13...D17
Push ButtonsS1...7
OscillatorsU16, U22


QSPI Flash Memory

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

There is a 64 MBit (8 MByte) QSPI Flash memory (U12) provided by Integrated Silicon Solution Inc. which can be used to store data or configuration. Up to 128 MBit (16 MByte) memory is available on other assembly option.

Scroll Title
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titleQuad SPI Interface MIOs and Pins

Power Rails

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anchorTable_PWR_PR
titleModule power rails.

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B2B Connector

JM1 Pin

...

B2B Connector

JM2 Pin

...

B2B Connector

JM3 Pin

...

Bank Voltages

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Bank          
PinSchematic
Name
Voltage
Connected to Notes

...

CSF_CSBank 7 
CLKF_CLKBank 7 
IO0...3F_IO0...3Bank 7 


SDRAM Memory

  • This section is optional and only for modules.
  • use "include page" macro and link to the general B2B connector page of the module series,

    For example: 6 x 6 SoM LSHM B2B Connectors
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    Include Page
    PD:6 x 6 SoM LSHM B2B ConnectorsPD:6 x 6 SoM LSHM B2B Connectors

    ? x ? modules use two or three Samtec Micro Tiger Eye Connector on the bottom side.

    • 3 x REF-??????? (compatible to ????????), (?? pins, ?? per row)

      Operating Temperature: -??°C ~ ??°C
      Current Rating: ??A per ContactNumber of Positions: ??
      Number of Rows: ??

    Technical Specifications

    ...

    Notes :

    Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

    The TEI0009 has 64 MBit (8 MByte) volatile memory provided by Integrated Silicon Solution Inc., SDRAM IC(U10) for storing user application code and data. Up to 512 MBit (64 MByte) SDRAM is available on other assembly option.

    • Part number: IS42S16400J-7BL

    • Supply voltage: 3.3 V

    • Clock Frequency: 143 MHz (optional up to 200 MHz)
    • Temperature: 0°C to 70°C (optional other ranges are available)

    PSRAM Memory

    The TEI0009 is integrated with 64 Mbit (8 MByte) Pseudo Static Random Access Memory (PSRAM) using a self-refresh DRAM array organized as 8M words by 8 bits. The device supports a HyperBus interface, Very Low Signal Count (Address, Command and data through 8 DQ pins), Hidden Refresh Operation, and Automotive Temperature Operation. Up to 128 MBit (16 MByte) memory is available on other assembly option.

    • Part number: IS66WVH8M8

    • Supply voltage: 3.3 V

    • Clock Frequency: 100 MHz
    • Temperature: -40°C to 85°C (optional other ranges are available)

    7-Segment Display

    The TEI0009 has a 4-Digit-7-Segment LED display which is connected to Bank 6.

    Scroll Title
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    title7-Segment LED Pins

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    PinSchematicConnected to Notes
    A/L1SEG_CABank 6 
    B/L2SEG_CBBank 6 
    C/L3SEG_CCBank 6
    DSEG_CDBank 6
    ESEG_CEBank 6
    FSEG_CFBank 6
    GSEG_CGBank 6
    DPSEG_CDPBank 6
    A1SEG_ANBank 6
    A2SEG_AN4Bank 6
    A3SEG_AN3Bank 6
    A4SEG_AN2Bank 6
    L1-L3SEG_AN1Bank 6


    FTDI FT2232

    The FTDI chip U14 converts signals from USB 2.0 to a variety of standard serial and parallel interfaces. Refer to the FTDI data sheet for more information about the capacity of the FT2232H chip.
    Channel A of FTDI FT2232H chip is used in MPPSE mode for JTAG. Channel B is routed to FPGA bank 6 and is usable for other standard interfaces.

    The configuration of FTDI FT2232H chip is pre-programmed on the EEPROM U15.

    Scroll Title
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    titleFTDI Chip Interfaces and Pins

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    FTDI Chip PinSignal Schematic NameConnected toNotes
    ADBUS0TCKBank 1JTAG interface
    ADBUS1TDIBank 1
    ADBUS2TDOBank 1
    ADBUS3TMS

    Bank 1

    BDBUS0...7BDBUS0...7Bank 6
    BCBUS0...7BCBUS0...7Bank 6
    EECSEECSEEPROM, U15
    EECLKEECLKEEPROM, U15
    EEDATAEEDATAEEPROM, U15
    OSCICK12M12 MHz Oscillator, U16
    DMD_NMicro USB 2.0, J10
    DPD_PMicro USB 2.0, J10


    Serial Configuration Memory

    On-board serial configuration memory (U5) is provided by Intel with 16 MBit (2 MByte) storage capacity. This non volatile memory is used to store initial FPGA configuration via JTAG interface. The memory is connected to FPGA bank 1 via active serial (AS) x1 interface.

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    titleSerial Configuration Memory

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    Configuration Memory PinSignal Schematic NameConnected toNotes
    DATA1AS_DATA0U1, Bank 1

    DATA0AS_ASDOU1, Bank 1
    nCSAS_nCSU1, Bank 1
    DCLKAS_DCLK

    U1, Bank 1



    Ethernet PHY

    The TEI0009 is equipped with two Ethernet PHY (U17, U19) which are connected to two RJ45 (J8, J9) connectors. 

    Scroll Title
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    titleEthernet PHY Connections and Pins

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    Ethernet PHY PinSignal Schematic Names (ETH1/ETH2)ETH 1ETH 2Note
    TXD0...3ETH1_TXD0...3, ETH2_TXD0...3Bank 5Bank 5
    TXCETH1_TXC, ETH2_TXCBank 5Bank 5
    TXENETH1_TXEN, ETH2_TXENBank 5Bank 5
    RXD0...3ETH1_RXD0...3, ETH2_RXD0...3Bank 5Bank 5
    RXC/B-CAST_OFFETH1_RXC, ETH2_RXCBank 5Bank 5
    RXER/ISOETH1_RXER, ETH2_RXERBank 5Bank 5
    INTRP/nNAND_TreeETH1_INTRP, ETH2_INTRPBank 5

    Bank 5


    XIETH1_CLKIN, ETH2_CLKINOscillator, U22Oscillator, U22
    MDCETH1_MDC, ETH2_MDCBank 5Bank 5
    MDIOETH1_MDIO, ETH2_MDIOBank 5Bank 5
    COL/CONFIG0ETH1_COL, ETH2_COLBank 5Bank 5
    CRS/CONFIG1ETH1_CRS, ETH2_CRSBank 5Bank 5
    RXDV/CONFIG2ETH1_RXDV, ETH2_RXDVBank 5Bank 5
    LED0/NWAYENETH1_LED0, ETH2_LED0

    RJ45 - Green LED, J8

    RJ45 - Green LED, J9


    LED1/SPEEDETH1_LED1, ETH2_LED1

    RJ45 - Yellow LED, J8

    RJ45 - Yellow LED, J9


    nRSTETH1_RST, ETH2_RSTBank 5Bank 5
    RXMETH1_RX_N, ETH2_RX_NRJ45, J8RJ45, J9
    RXPETH1_RX_P, ETH2_RX_PRJ45, J8RJ45, J9
    TXMETH1_TX_N, ETH2_TX_NRJ45, J8RJ45, J9
    TXPETH1_TX_P, ETH2_TX_PRJ45, J8RJ45, J9


    EEPROM

    TEI0009 has three EEPROM, U15, U18 and U20. U15 is pre-programmed for the FTDI FT2232H configuration. U18 and U19 are used for the MAC address configuration.

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    DesignatorEEPROM PinSignal Schematic NamesConnected to Notes
    U15CSEECSFTDI, U14
    CLKEECLKFTDI, U14
    DIN/DOUTEEDATAFTDI, U14



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    DesignatorPinSchematicConnected to Grove HeaderNotes
    U18, U20SCLI2C_SCLBank 6J5
    SDAI2C_SDABank 6J5



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    I2C AddressDesignatorNotes
    0x50U18
    0x51U20


    ADC/DAC

    The TEI0009 module is equipped with a 12-Bit ADC/DAC (U2).

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    PinsSchematicConnected toNotes

    nRESET

    ADDA_RSTNBank 2, U1
    nSYNCADDA_SYNCBank 2, U1
    SCLKMCLKBank 2, U1
    SDIMOSIBank 2, U1
    SDOMISOBank 2, U1
    VREFAREFPin Header, J1External reference is 1 V to 3.3 V.
    Internal reference is 2.5 V.
    IO0...5AIN0...5

    Bank 1, U1

    Pin Header, J4


    IO6AIN6Testpoint, TP1
    IO7AIN7Testpoint, TP2


    LEDs

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    SchematicDesignator ColorConnected toActive LevelNote
    LED1...8D2...9RedBank 3High
    LED_PB1...5D13...17RedBank 7High
    CONF_DONED10RedBank 6Low
    3.3VD1Green3.3VHigh


    Push Buttons

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    SchematicDesignator Connected toFunctionalityNote
    RESETS7Bank 1Reset
    RST_GPIOS2Bank 4Reset/GPIO
    USER_BTN1S3Bank 3User Push Button
    USER_BTN2S4Bank 3User Push Button
    USER_BTN3S5Bank 3User Push Button
    USER_BTN4S6Bank 3User Push Button
    USER_BTN5S1Bank 3User Push Button


    Clock Sources

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    DesignatorDescriptionFrequencyNote
    U22Crystal Oscillator25 MHz
    U16Crystal Oscillator12 MHz


    Power and Power-On Sequence

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    In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

    • Power on-sequence
    • Power distribution
    • Voltage monitoring circuit


    Note

    For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


    Power Supply

    Power supply with minimum current capability of 3 A for system startup is recommended.

    Power Consumption

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    FPGATypical Current
    Intel Cyclone 10 LP FPGATBD*


    * TBD - To Be Determined

    Power Distribution Dependencies

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    Power-On Sequence

    There is the following power-on sequence. The DCDC converter U7 enables the device U4 according to the diagram below.

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    Voltage Protection Circuit

    There is a transient voltage suppression diode (D12) which protects the board from voltage spikes. Additionaly, there is an overvoltage / undervoltage protection device (U9) for board protection.

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    Power Rails

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    Connector Designator

    VCCIO Schematic Name

    Pin VCCDirectionNotes
    J12VIN15 VIn
    J33.3V2, 43.3 V Out
    5V55 V Out
    J53.3V33.3 V Out


    Bank Voltages

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    Bank          

    Schematic Name

    Voltage

    Notes
    Bank 1...8VCCIO1...83.3V


    Technical Specifications

    Absolute Maximum Ratings

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    SymbolsDescriptionMinMaxUnitNote
    VIN Input Supply Voltage (J12)
    4.55.5V
    AREFExternal Reference Voltage for ADC/DAC (J1 - 8)-0.33.6VOnly for input usage.
    AIN0...5Input Voltage for ADC/DAC (J4)-0.33.6VOnly for input usage.
    AIN6...7Input Voltage for ADC/DAC (TP1...2)-0.33.6VOnly for input usage.
    EXT_RSTExternal Reset (J3 - 3)-0.54.2V
    D0_RXD, D1_TXD, D2...7Arduino Interface (J2)-0.54.2VOnly for input usage.

    D8...13, D14_SDA, D15_SCL

    Arduino Interface (J1 - 1...6, 9...10)-0.54.2VOnly for input usage.
    I2C_SCL, I2C_SDAI2C Interface (J5 - 1...2)-0.34.2VOnly for input usage.

    P1_IO1...8, P2_IO1...8,

    P3_IO1...8, P4_IO1...8,

    P5_IO1...8, P6_IO1...8,

    Pmod Interface (P1...6)-0.54.2VOnly for input usage.
    CLK_INExternal FPGA Clock (J19)-0.54.2V
    CLK_OUTClock / IO (J20)-0.54.2VOnly for input usage.
    T_STGStorage Temperature-3585°CSee LTC2623WC datasheet


    Recommended Operating Conditions

    Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

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    Symbols
    Parameter
    Description
    MinMaxUnits
    Unit
    Reference Document
    V

    VIN 
    V
    4.755.25
    V
    V
    V


    AREF
    V
    1
    V
    3.3V

    Recommended Operating Conditions

    Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

    See Xilinx ???? datasheet.


    AIN0...50AREFV

    AIN6...70AREFV

    EXT_RST-0.53.6V

    D0_RXD, D1_TXD, D2...7-0.53.6V

    D8...13, D14_SDA, D15_SCL

    -0.53.6V

    I2C_SCL, I2C_SDA-0.33.3V

    P1_IO1...8, P2_IO1...8,

    P3_IO1...8, P4_IO1...8,

    P5_IO1...8, P6_IO1...8,

    -0.53.6V

    CLK_IN-0.53.6V

    CLK_OUT-0.53.6V

    T_OP070°C

    See SDRAM W9864G6JT datasheet

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    ParameterMinMaxUnitsReference Document
    VSee ???? datasheets.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.°CSee Xilinx ???? datasheet.°C