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Table of Contents

Table of Contents

Overview

The Cyclone10 LP Reference Kit is the world's first development board with a 55kLE Intel Cyclone 10 LP and a variety of interfaces for numerous applications. The board is comprehensively tested and ready for use with end products and can also be ordered in customer-specific variants according to your requirements.

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Notes :

Key Features

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Note:
 'Key Features' description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

  • Intel Cyclone 10 LP FPGA 10CL055YU484C8G, 55 kLE in 484-pin
  • 16 MBit flash memory (optional up to 32 MBit possible)
  • Integrated USB Programmer 2
  • Connectors
  • 256 MBit (optional up to 512 MBit possible) SDRAM
  • 128 MBit (optional up to 512 MBit possible) User Quad-SPI Flash memory
  • 64 MBit HyperRAM (optional up to 128 MBit possible)
  • 2 x MAC address EEPROM
  • 2 x Fast Ethernet PHY (10/100 Mbps)
  • 8-channel, 12-bit, configurable ADC / DAC with on-chip reference
  • Status LEDs, Power LED
    • 13 x User LEDs
    • 1 x 7-segment display
    • 2 x reset buttons
    • 5 x user buttons

Block Diagram

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Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


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titleTEI0009 block diagram


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Main Components

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  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


Note

For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .


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  1. Barrel Jack, J12
  2. RJ45 socket, J8...9
  3. VGA Socket, J11
  4. Push button(Reset), S7
  5. Grove connector, J5
  6. Under/Over Voltage Protector, U9
  7. 7-segment LED, D11
  8. 1x6 pin header, J4
  9. 1x8 pin header, J2...3
  10. User Red LEDs, D2...9
  11. User Red LEDs, D13...17
  12. Push buttons, S1- S3...6
  13. Red LED (CONF_DONE), D10
  14. PSDRAM PSRAM memory, U3
  15. SDRAM memory, U10
  16. Voltage Regulator, U5- U7
  17. AD/DA Convertor, U2
  18. Pmod 2x6 SMD host socket, P1...6
  19. Intel Cyclone 10 LP, U1
  20. Config Device, U5
  21. 1x10 pin header, J1
  22. EEEPROM, U15- U18- U20
  23. FTDI FT2232H, U14
  24. Micro USB 2.0 receotacle 90, J10
  25. Push button (RST_GPIO), S2
  26. Oscillator, U22
  27. Ethernet PHY, U17- U19
  28. SPI Flash memory, U12

Initial Delivery State

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Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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Storage device name

Content

Notes

SPI Flash



EEPROM


DDR3 SDRAM


FTDI System Controller CPLD

PSRAM

Config Device


Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.

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titleReset process.

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Signal

Connected to Note

RESET

S1 (Push button)Connected to nCONFIG
EXT_RST

J3 (1x8 pin header)

Bank 2



Signals, Interfaces and Pins

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  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

I/Os on Pin Headers and Connectors

FPGA bank number and number of I/O signals connected to the B2B connector:

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FPGA BankConnector I/O Signal CountVoltage LevelNotes
Bank 1J1 (Pin header)8 Single ended3.3 V
J2 (Pin header)8 Single ended3.3 V
J4 (Pin header)6 Single ended3.3 V
Bank 2

J3 (Pin header)

1 Single ended3.3 V
P1 (PMod SMD host socket)8 Single ended3.3 V
P2 (PMod SMD host socket)8 Single ended3.3 V
J11 (VGA host Socket)14 Single ended3.3 V
Bank 6J5 (Grove connector)2 Single ended3.3 V
Bank 7P5 (PMod SMD host socket)8 Single ended3.3 V
P6 (PMod SMD host socket)8 Single ended3.3 V
Bank 8P3 (PMod SMD host socket)8 Single ended3.3 V
P4 (PMod SMD host socket)8 Single ended3.3 V


PMod SMD Host Socket

TEI0009 has 6 PMod 2x6 SMD Host Socket 90° which are connected to Cyclon 10 LP.

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DesignatorSignalsConnected to Notes
P1P1_IO1...8Bank 2
P2P2_IO1...8Bank 2
P3P3_IO1...8Bank 8
P4P4_IO1...8Bank 8
P5P5_IO1...8Bank 7
P6P6_IO1...8Bank 7


UART Interface

UART access to TEI0009 is available on 1x8 pin header J2. 

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SchematicPin HeaderConnected to Voltage LevelNotes
TXDJ2Bank 13.3 V
RXDJ2Bank 13.3 V


Micro USB2.0 Connector

U14(FTDI FT2232) can be accessed through Micro USB2.0 B Receptacle 90 (J10).

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SchematicConnected to Voltage LevelNotes
USB_VBUSGND

D-U14 (FTDI FT2232)3.3 V
D+U14 (FTDI FT2232)3.3 V


RJ45 Connectors

TEI0009 is equipped with two RJ45 connectors and two Ethernet PHYs. RJ45 connectors J8 and J9 are connected to Ethernet PHYs U17 and U19 respectively. .

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PinSchematicETH1 PinETH2 PinNotes
TD+ETH_TX_PU17- TXPU19- TXP
CTETH_CTREF_TCT--Connected to GND
TD-ETH_TX_NU17- TXMU19- TXM
RD+ETH_RX_PU17- RXPU19- RXP
CTETH_CTREF_RCT--Connected to GND
RD-ETH_RX_NU17- RXMU19- RXM
LED GreenETH_LED0U17- NWAYENU19- NWAYEN
LED YellowETH_LED1U17- SPEEDU19- SPEED


VGA socket Connectors

VGA host socket is connected to Cyclone 10 LP through Bank 2.

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SchematicCorresponding SignalsConnected toNotes
VGA_REDVGA_R0...3Bank 2Red channel
VGA_GREENVGA_G0...3Bank 2Green channel
VGA_BLUEVGA_B0...3Bank 2Blue channel
VGA_RGB_HSYNCVGA_HSBank 2Horizontal sync
VGA_RGB_VSYNCVGA_VSBank 2Vertical sync


On-board Peripherals

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  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

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Chip/InterfaceDesignatorNotes
SPI Flash memoryU12
SDRAM memoryU10
PSRAM memoryU3
7 Segment D11
FTDI FT2232U14
Ethernet PHYU17, U19
Configuration DeviceU5
AD/DA ConverterU2
EEPROMU15, U18, U20
User LEDsD2...D17
OscillatorsU16, U22


SPI Flash Memory

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

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PinSchematicConnected to Notes
CSF_CSBank 7 
CLKF_CLKBank 7 
IO0...3F_IO0...3Bank 7 


SDRAM Memory

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

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  • Part number: W9864G6JT-6-ND

  • Supply voltage: 3.3 V

  • Clock Frequency: 166MHz
  • Temperature: 0°C ~ 70°C

PSRAM Memory

The TEI0009 is integrated with 64Mbit Pseudo Static Random Access Memory (SDRAM) using a self-refresh DRAM array organized as 8M words by 8 bits. The device supports a HyperBus interface, Very Low Signal Count (Address, Command and data through 8 DQ pins), Hidden Refresh Operation, and Automotive Temperature Operation. 

  • Part number: IS66WVH8M8BLL

  • Supply voltage: 3.3 V

  • Clock Frequency: 100MHz
  • Temperature: -40°C ~ 85°C

LED 7 Segment 4 Digit

the TEI0009 has a LED 7 Segment 4 Digit which is connected to Bank 6.

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titleLED 7 Segment pins

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PinSchematicConnected to Notes
A/L1SEG_CABank 6 
B/L2SEG_CBBank 6 
C/L3SEG_CCBank 6
DSEG_CDBank 6
ESEG_CEBank 6
FSEG_CFBank 6
GSEG_CGBank 6
DPSEG_CDPBank 6
A1SEG_ANBank 6
A2SEG_AN4Bank 6
A3SEG_AN3Bank 6
A4SEG_AN2Bank 6
L1-L3SEG_AN1Bank 6


FTDI FT2232H

The FTDI chip U14 converts signals from USB2.0 to a variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the capacity of the FT2232H chip.
FTDI FT2232H chip is used in MPPSE mode for JTAG, 6 I/O's of Channel B are routed to FPGA bank 8 of the FPGA SoC and are usable for example as GPIOs, UART or other standard interfaces.

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titleFTDI chip interfaces and pins

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FTDI Chip PinSignal Schematic NameConnected toNotes
ADBUS0TCKBank 1JTAG interface
ADBUS1TDIBank 1
ADBUS2TDOBank 1
ADBUS3TMS

Bank 1

BDBUS0BDBUS0Bank 6
BDBUS1BDBUS1Bank 6
BDBUS2BDBUS2Bank 6
BDBUS3BDBUS3Bank 6
BDBUS4BDBUS4Bank 6
BDBUS5BDBUS5Bank 6
EECSEECSU15 (EEPROM)
EECLKEECLKU15 (EEPROM)
EEDATAEEDATAU15 (EEPROM)
OSCICK12MU16 (12MHz Oscillator)
DMD_NJ10 (Micro USB2.0)
DPD_PJ10 (Micro USB2.0)


Ethernet PHY

The TEI0009 is equipped with two Ethernet PHY (U19, U17) which are connected to two RJ45 connectors. 

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Ethernet PinSignalsETH 1ETH 2Note
TXD0...3ETH_TXD0...3Bank 5Bank 5
TXCETH_TXCBank 5Bank 5
TXENETH_TXENBank 5Bank 5
RXD0...3ETH_RXD0...3Bank 5Bank 5
RXC//B-CAST_OFFETH_RXCBank 5Bank 5
RXER/ISOETH_RXERBank 5Bank 5
INTRP//NAND_TreeETH_INTRPBank 5

Bank 5


XIETH_CLKINU22 (Oscillator)U22 (Oscillator)
MDCETH_MDCBank 5Bank 5
MDIOETH_MDIOBank 5Bank 5
COL/CONFIG0ETH_COLBank 5Bank 5
CRS/CONFIG1ETH_CRSBank 5Bank 5
RXDV/CONFIG2ETH_RXDVBank 5Bank 5
LED0/NWAYENETH_LED0

Bank 5

J8B (RJ45- Green LED)

Bank 5

J9B (RJ45-Green LED)


LED1/SPEEDETH_LED1

Bank 5

J8C (RJ45-Yellow LED)

Bank 5

J9B (RJ45-Yellow LED)


nRSTETH_RSTBank 5Bank 5
RXMETH_RX_NJ8 (RJ45)J9 (RJ45)
RXPETH_RX_PJ8 (RJ45)J9 (RJ45)
TXMETH_TX_NJ8 (RJ45)J9 (RJ45)
TXPETH_TX_PJ8 (RJ45)J9 (RJ45)


EEPROM

TEI0009 has three EEPROM, U15, U18 and U20. U15 containt FTDI FT2232H configuration.

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titleI2C address for EEPROM

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I2C AddressDesignatorNotes
0x50U18
0x52U20


LEDs

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SchematicDesignator ColorConnected toActive LevelNote
LED1...8D2...9RedBank 3High
LED_PB1D13...17RedBank 7High
CONF_DONED10RedBank 6Low


Clock Sources

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titleOsillators

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DesignatorDescriptionFrequencyNote
U22MEMS Oscillator25 MHz
U16MEMS Oscillator12 MHz


Power and Power-On Sequence

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  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit


Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


Power Supply

Power supply with minimum current capability of xx A for system startup is recommended.

Power Consumption

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titlePower Consumption

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Power Input PinTypical Current
VINTBD*


* TBD - To Be Determined

Power Distribution Dependencies

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Power-On Sequence

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Voltage Monitor Circuit

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Power Rails

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Power Rail Name

B2B Connector

JM1 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

DirectionNotes

























Bank Voltages

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Bank          

Schematic Name

Voltage

Notes





























Technical Specifications

Absolute Maximum Ratings

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SymbolsDescriptionMinMaxUnit




V




V




V




V




V




V




V




V











Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

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ParameterMinMaxUnitsReference Document



VSee ???? datasheets.



VSee Xilinx ???? datasheet.



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°CSee Xilinx ???? datasheet.



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Physical Dimensions

  • Module size: 95 mm × 110 mm.  Please download the assembly diagram for exact numbers.

  • PCB thickness: ?? mm.

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Currently Offered Variants 

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Set correct link to the shop page overview table of the product on English and German.

Example for TE0728:

    ENG Page: https://shop.trenz-electronic.de/en/Products/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

    DEU Page: https://shop.trenz-electronic.de/de/Produkte/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

For Baseboards, where no overview page is available (and revision number is coded in the direct link) use shop search link, e.g. TE0706:

    ENG Page: https://shop.trenz-electronic.de/en/search?sSearch=TE0706

   DEU Page: https://shop.trenz-electronic.de/de/search?sSearch=TE0706

if not available, set.

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Trenz shop TE0728 overview page
English pageGerman page


Revision History

Hardware Revision History

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Set correct links to download  arrier, e.g. TE0706 REV02:

  TE0706-02  ->   https://shop.trenz-electronic.de/Download/?path=Trenz_Electronic/Modules_and_Module_Carriers/4x5/4x5_Carriers/TE0706/REV02/Documents

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titleBoard hardware revision number.


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Document Change History

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    • Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template

    • Metadata is only used of compatibility of older exports

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DateRevisionContributorDescription

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  • change list

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all

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  • --


Disclaimer

Include Page
IN:Legal Notices
IN:Legal Notices

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