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Table of Contents

Table of Contents

Overview

The Cyclone10 Cyclone 10 LP Reference Kit is the world's first development board with a 55 kLE (Logic Elements) Intel Cyclone 10 LP and a variety of interfaces for numerous applications. The board is comprehensively tested and ready for use with end products and can also be ordered in customer-specific variants according to your requirements.

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Note:
 'Key Features' description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

  • Intel® Cyclone 10 LP  LP [10CL055YU484C8G],
    • Package: UBGA-484
    • Speed Grade: 8 (Slowest)
    • Temperature: 0 °C to 85° C
    • Package compatible device 10CL016, 10CL040, 10CL055, 10CL080 as assembly variant on request is possible
  • 16 MBit (2 MByte) Flash Memory (optional up to 32 MBit (4 MByte) possible)
  • Integrated USB-JTAG Programmer
  • Pin Header Connectors
  • 64 MBit (8 MByte) SDRAM , (optional up to 512 MBit (64 MByte) memory mountable)
  • 64 MBit (8 MByte) User Quad-SPI Flash Memory , (optioneal up to 128 MBit (16 MByte)) memory mountable
  • 64 MBit (8 MByte) HyperRAM (Pseudo SRAM) , (optional up to 128 MBit (16 MByte) memory mountable)
  • 2x MAC Address EEPROM
  • 2x Fast Ethernet PHY (10/100 Mbps)
  • 8-Channel, 12-Bit, configurable ADC/DAC
  • D-Sub Connector
  • 2x RJ45 Connector
  • LEDs:
    • Status LEDs, Power LED
    • 13x User LEDs
    • 7-Segment Display
  • Push Buttons:
    • 2x Reset Push Buttons
    • 5x User Push Buttons
  • I/O: 70 GPIO
  • 5 V Power Supply
  • Dimension: 95 mm x 110 mm
  • Others:
    • Reverse Supply Protection
    • Undervoltage/Overvoltage Protection

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titleTEI0009 block diagram


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  1. Power Jack, J12
  2. RJ45 Socket, J8...9
  3. D-Sub Connector, J11
  4. Push Button (Reset), S7
  5. Grove Connector, J5
  6. Undervoltage/Overvoltage Protector, U9
  7. 7-Segment LED, D11
  8. 1x6 Pin Header, J4
  9. 1x8 Pin Header, J2...3
  10. 8x User LEDs (Red), D2...9
  11. 5x User LEDs (Red), D13...17
  12. 5x User Push Buttons, S1 - S3...6
  13. Red LED (CONF_DONE), D10
  14. PSRAM Memory, U3
  15. SDRAM Memory, U10
  16. Voltage Regulator, U4 - U7
  17. AD/DA Converter, U2
  18. 6x Pmod Host Socket, P1...6
  19. Intel® Cyclone 10 LP, U1
  20. Serial Configuration Memory, U5
  21. 1x10 Pin Header, J1
  22. EEEPROMEEPROM, U15 - U18 - U20
  23. FTDI USB2 USB 2 to JTAG/UART Converter, U14
  24. Micro USB 2.0, J10
  25. Push Button (RST_GPIO), S2
  26. Oscillator, U22
  27. Ethernet PHY, U17 - U19
  28. QSPI Flash Memory, U12

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titleReset process.

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Signal

Connected to Note

RESET

S7 (Push button)S7, Push ButtonConnected to nCONFIG.


Signals, Interfaces and Pins

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FPGA bank number and number of I/O signals connected to the B2B connectorconnectors:

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titleGeneral I/O to Pin header Header and Pmod SMD connectors information

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FPGA BankConnector I/O Signal CountVoltage LevelNotes
Bank 1J1 (Pin header)8 Single ended3.3 V
J2 (Pin header)8 Single ended3.3 V
J4 (Pin header)6 Single ended3.3 V
Bank 2

J3 (Pin header)

1 Single ended3.3 V
P1 (Pmod Host Socket)8 Single ended3.3 V
P2 (Pmod Host Socket)8 Single ended3.3 V
J11 (VGA host Host Socket)14 Single ended3.3 V
Bank 6J5 (Grove connectorConnector)2 Single ended3.3 V
Bank 7P5 (Pmod Host Socket)8 Single ended3.3 V
P6 (Pmod Host Socket)8 Single ended3.3 V
Bank 8P3 (Pmod Host Socket)8 Single ended3.3 V
P4 (Pmod Host Socket)8 Single ended3.3 V


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titleVGA host socket information

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SchematicCorresponding SignalsConnected toNotes
VGA_REDVGA_R0...3Bank 2Red channelChannel
VGA_GREENVGA_G0...3Bank 2Green channelGreen Channel
VGA_BLUEVGA_B0...3Bank 2Blue channelBlue Channel
VGA_RGB_HSYNCVGA_HSBank 2Horizontal syncSync
VGA_RGB_VSYNCVGA_VSBank 2Vertical syncSync


On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

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titleOn-board peripheralsPeripherals

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

There is a 64MBit 64 MBit (8 MByte) QSPI Flash memory (U12) provided by Integrated Silicon Solution Inc. which can be used to store data or configuration. Up to 128 MBit (16 MByte) memory is possible available on other assembly option.

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The TEI0009 has 64 MBit (8 MByte) volatile memory provided by Integrated Silicon Solution Inc., SDRAM IC(U10) for storing user application code and data. Up to 512 MBit (64 MByte) SDRAM is possible available on other assembly option.

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The TEI0009 is integrated with 64 Mbit (8 MByte) Pseudo Static Random Access Memory (PSRAM) using a self-refresh DRAM array organized as 8M words by 8 bits. The device supports a HyperBus interface, Very Low Signal Count (Address, Command and data through 8 DQ pins), Hidden Refresh Operation, and Automotive Temperature Operation. Up to 128 MBit (16 MByte) memory is possible available on other assembly option.

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titleLED 7-Segment LED pins

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PinSchematicConnected to Notes
A/L1SEG_CABank 6 
B/L2SEG_CBBank 6 
C/L3SEG_CCBank 6
DSEG_CDBank 6
ESEG_CEBank 6
FSEG_CFBank 6
GSEG_CGBank 6
DPSEG_CDPBank 6
A1SEG_ANBank 6
A2SEG_AN4Bank 6
A3SEG_AN3Bank 6
A4SEG_AN2Bank 6
L1-L3SEG_AN1Bank 6


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The TEI0009 module is equipped with a 12 bit -Bit ADC/DAC (U2).

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titleADC/DAC interface and pins

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PinsSchematicConnected toNotes

nRESET

ADDA_RSTNBank 2, U1
nSYNCADDA_SYNCBank 2, U1
SCLKMCLKBank 2, U1
SDIMOSIBank 2, U1
SDOMISOBank 2, U1
VREFAREFPin Header, J1External reference is 1 V to 3.3 V.
Internal reference is 2.5 V.
IO0...5AIN0...5

Bank 1, U1

Pin Header, J4


IO6AIN6Testpoint, TP1
IO7AIN7Testpoint, TP2


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titleOsillatorsOscillators

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DesignatorDescriptionFrequencyNote
U22Crystal Oscillator25 MHz
U16Crystal Oscillator12 MHz


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Power supply with minimum current capability of 1 3 A for system startup is recommended.

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There is the following power-on sequence. The DCDC converter U7 enables the device U4 according to the diagram below.

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There is a transient voltage suppression diode (D12) which protects the board from voltage spikes. Additionaly, there is an overvoltage / undervoltage protection device (U9) for board protection.

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titleVoltage Monitor Protection Circuit


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titleModule power rails.

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5
Connector Designator

VCC / VCCIO Schematic Name

Pin DirectionVCCNotes
J125 V / VIN1In5 V
J33.3 V / 3.3V2, 4Out3.3 V
/ 5V5Out5 V
J53.3 V / 3.3V3Out3.3 V


Bank Voltages

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titleZynq SoC Intel Cyclone 10 LP bank voltages.

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Bank          

Schematic Name

Voltage

Notes
Bank 1...8VCCIO1...83.3V


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titleAbsolute maximum ratingsMaximum Ratings

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SymbolsDescriptionMinMaxUnitNote
VIN 
Input supply voltage
Input Supply Voltage (J12)
4.55.5V
AREFExternal Reference Voltage for ADC/DAC (J1 - 8)-0.33.6VOnly for input usage.
AIN0...5Input Voltage for ADC/DAC (J4)-0.33.6VOnly for input usage.
AIN6...7Input Voltage for ADC/DAC (TP1...2)-0.33.6VOnly for input usage.
EXT_RSTExternal Reset (J3 - 3)-0.54.2V
D0_RXD, D1_TXD, D2...7Arduino Interface (J2)-0.54.2VOnly for input usage.

D8...13, D14_SDA, D15_SCL

Arduino Interface (J1 - 1...6, 9...10)-0.54.2VOnly for input usage.
I2C_SCL, I2C_SDAI2C Interface (J5 - 1...2)-0.34.2VOnly for input usage.

P1_IO1...8, P2_IO1...8,

P3_IO1...8, P4_IO1...8,

P5_IO1...8, P6_IO1...8,

Pmod Interface (P1...6)-0.54.2VOnly for input usage.
CLK_INExternal FPGA Clock (J19)-0.54.2V
CLK_OUTClock / IO (J20)-0.54.2VOnly for input usage.
T_STGStorage Temperature-3585°CSee LTC2623WC datasheet


Recommended Operating Conditions

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titleRecommended operating conditions.Operating Conditions

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ParameterMinMaxUnitsReference Document
VIN 4.755.25V

AREF13.3V

AIN0...50AREFV

AIN6...70AREFV

EXT_RST-0.53.6V

D0_RXD, D1_TXD, D2...7-0.53.6V

D8...13, D14_SDA, D15_SCL

-0.53.6V

I2C_SCL, I2C_SDA-0.33.3V

P1_IO1...8, P2_IO1...8,

P3_IO1...8, P4_IO1...8,

P5_IO1...8, P6_IO1...8,

-0.53.6V

CLK_IN-0.53.6V

CLK_OUT-0.53.6V

T_OP070°C

See SDRAM W9864G6JT datasheet



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titleTrenz Electronic Shop Overview

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Trenz shop TE0728 TEI0009 overview page
English pageGerman page


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titleHardware Revision History

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DateRevisionChangesDocument Link
2018-2-1901-REV01---
2018-7-1802
  • Change J5 from SMD Connector to GROVE Connector
  • Change connection of 12 MHz clock from Bank 1 to Bank 6
  • Change connection of I2C SLA/SDA from Bank 3 to Bank 6
  • SMA Coaxial Connector J19, J20 not mounted
  • Change connection of CLK_IN/CLK_OUT from Bank 4 to Bank 8
  • Remove DIP Switch S1
  • Add 5 LEDs (red)
  • Add 2 Push Buttons
  • Add 64 Mbit QSPI Flash Memory
  • Change SDRAM Memory
  • Remove 10-Bit ADC
  • Remove 10-Bit DAC
  • Add 12-Bit ADC/DAC
  • Remove USB Transceiver
  • Remove 24 MHz Oscillator
  • Remove DIP Switch S2
  • Changed Power Supply Circuit
  • Add 4 Pmod Host Sockets
REV02


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titleDocument change history.Change History

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  • Updated Figures

  • Updated Technical Specifications

v.40Pedram Babakhani
  • change list

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