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Table of Contents

Table of Contents

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The Trenz Electronic TE0802 is an evalution modulea development board integrating a Xilinx Zynq UltraScale+ . Other assymbly assembly options for the FPGA and the memory chips are available. Please ask contact us for further information.

Refer to http://trenz.org/te0802-info for the current online version of this manual and other available documentation.

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Notes :

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Note:
 'Key Features' description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

  • MPSoC: Xilinx Zynq XCZU2CG-1SBVA484E  XCZU2CG - Xilinx Zynq UltraScale+ MPSoC
    • Package: 1SBVA484E
    • Speed Grade: -1 (Slowest)
    • Temperature Grade: Extended (0 to +100 °C)

  • RAM/Storages:
    • SDRAM: LPDDR4
    -3733
    • 8Gb
    256Mx32
    • 256Mx16x 2 
    Storages:
    • SPI Flash 256Mb (32M x 8) 133 MHz
    • microSD Card
    • EEPROMs 2Kb (256 x 8)
    • EEPROMs 4Kb (512 x 8)
  • Interfaces: 
    • USB JTAG/UART microUSB
    • 1GB Ethernet RJ45
    • USB 3.0 Host (Type A Connector)
    • microSD Card
    • M.2 SSD PCIe
    • 3.5 mm Earphone Jack (PWM Output)
    • Display
    Interfaces: 
    • DisplayPortPort
    • VGA
    • 4 Digit 7-Segment LED Display
    • 8 LEDs
    Audio:
    • 3.5 mm Jack (PWM Output)
    Input:
    • 5 User Buttons
    • 8 Bit Slide Switches
    • Reset Button
    User I/O:
    • 2x Pmod Connector
  • Communication:
    • 1GB Ethernet RJ45
    • USB 3.0 Host (Type A Connector)
  • Debug
    • USB JTAG/UART microUSB
  • Power
    • 5 V +/- 10%
    • ~3.5 W
  • Power
    • 5 V +/- 10%
    • ~3.5 W
  • Dimension: 100mm x 100mm

Block Diagram

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Main Components

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  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


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Scroll Title
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titleTE0802 Main Components (Picture shows Revision 01)


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  1. Xilinx Zynq UltraScale+ MPSoc, U14
  2. LPDDR4 SDRAM, U13
  3. M.2 Key M PCIe x1, U5
  4. SPI Flash Memory, U16
  5. EEPROM, U2, U18
  6. Oscillator, U15, U7, U19, U23, U43
  7. Clock Generator, U8
  8. Clock Generator Programming Connector, J14
  9. Grove Connector, J10
  10. Pmod Host Socket, J5...6
  11. Headphone Jack, J12
  12. D-Sub Connector, J7
  13. DisplayPort, J3
  14. RJ45 Socket, J4
  15. Ethernet PHY, U6
  16. USB Type A, J11
  17. USB 2.0 PHY, U22
  18. Micro USB 2.0 Type B, J8
  19. FTDI USB 2.0 to JTAG/UART Converter, U17
  20. microSD Card, J9
  21. Slide Switch, S1
  22. Push Button, BTN1...5
  23. DIP Switch, S7...8
  24. 4 Digit 7-Segment LED Display, D9
  25. 8x LEDs (Red), LED0...7
  26. Power Jack, J13
  27. Overvoltage/Undervoltage/Reverse Supply Protector, U12
  28. Power Management Integrated Circuit (PMIC), U1, U9
  29. Power Good LED (Green), D12

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titleInitial Delivery State of Programmable Devices on the Module

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Storage device name

Content

Notes

SPI Flash (U16)

Not programmed


EEPROM (U2)Not programmedExcept Ethernet MAC
EEPROM (U18)Programmed

FTDI Configuration

LPDDR4 SDRAM (U13)Not programmed


Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.

Bootmode signals must be set through DIP Switch S1. 

MODE[1
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MODE Signal State

MODE0MODE1Boot Mode

MODE1

S1-2(B)

MODE0

S1-1(A)

Boot Mode

MODE[2:0]=000

0
OFF
0
OFF

JTAG

MODE[

1

2:0]=001

0
OFF
1---
ONnot supported

MODE[

1

2:0]=010

1
ON
0
OFFQSPI(32 bit)

MODE[

1

2:0]=011

1
ON
1
ONSD0(2.0)


Reset setting is available through Push Button BTN6.

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Signal

Connected toNote

POR_B

BTN6, Push ButtonConnected to nRESET


Signals, Interfaces and Pins

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U5
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FPGA BankConnector I/O Signal CountVoltage LevelNotes
Bank 503
J8
Micro USB, J8 (
Micro USB
over FTDI)4 Single Ended3.3 VJTAG
Bank 500
J8
Micro USB, J8 (
Micro USB
over FTDI)2 Single Ended3.3 VUART
Bank 500
J9, (
Micro SD Card
)
, J97 Single Ended3.3 V
Bank 502ETH RJ45, J4
,
(
RJ45
over ETH PHY)14 Single Ended1.8 V
Bank 505, 502
J11, (
USB 3.0, J11 (USB2 over USB PHY)2 Differential Pairs
0.85 V
, 12 Single Ended-- / 1.8V

Bank 505, 501

U5, (
SSD M.2
)
, U5

2 Differential Pairs

0.85 V

Bank 501

,

(SSD M.2)

5 Single Ended

-- / 3.3 V


Bank 505, 501
J3, (
Display Port Connector
)
, J32 Differential Pairs
0.85 VBank 26J7, (D-Sub Host Socket)2
, 5 Single Ended--/ 3.3 V
Bank 26, 65, 66,
J7, (
D-Sub Host Socket (VGA), J7
12
14 Single Ended3.3 V / 1.8 V / 1.8 V
Bank 65Earphone, J12
, Headphone
3 Single Ended1.8 V
Bank 500
J10, (
Grove Connector
)
, J102 Single Ended3.3 V
Bank 26
J5 (
Pmod Host Socket
)
, J58 Single Ended3.3 V
Bank 26
J6 (
Pmod Host Socket
)
, J6 8 Single Ended3.3 V

Micro USB 2.0 Connector

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Micro SD Card

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TEI0802 TE0802 is equipped with a micro SD card connector (J9).

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SchematicConnected toNotes
SD_DAT0

MIO 13, FPGA Bank 500


SD_DAT1MIO 14, FPGA Bank 500
SD_DAT2MIO 15, FPGA Bank 500
SD_DAT3MIO 16, FPGA Bank 500
SD_CLKMIO 22, FPGA Bank 500
SD_CMDMIO 21, FPGA Bank 500
SD_CDMIO 24, FPGA Bank 500


RJ45 Connector

TEI0802 TE0802 is equipped with a RJ45 connector and an Ethernet PHYs. RJ45 connectors connector J4 is connected to Ethernet PHYs U6.

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PinSchematicETH PinNotes
2PHY_MDI0_PMDIP[0]
3PHY_MDI0_NMDIN[0]
4PHY_MDI1_PMDIP[1]
5PHY_MDI1_NMDIN[1]
6PHY_MDI2_PMDIP[2]
7PHY_MDI2_NMDIN[2]
8PHY_MDI3_PMDIP[3]
9PHY_MDI3_NMDIN[3]

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USBs Sockets

TEI0802 TE0802 is equipped with a USB connector (J11).a Micro USB2.0 B connector J8 and a USB3.0 connector J11.

FTDI FT2232 (U17) can be accessed through Micro USB 2.0 B connector (J8) for JTAG (channel A). Channel B is connected to the FPGA and can be used for UART.

MIO 52...63 FPGA Bank 502
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USB2.0 PinSchematic
Corresponding Signals
Connected toNotes
D-
USB0_
D_N
USB0_DATA0...7

FTDI, U17


D+
USB0_
D_P
USB0_DATA0...7MIO 52...63 FPGA Bank 502
FTDI, U17
VbusUSB_VBUSGND