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Important General Note:

  • If some section is configurable and depends on Firmware, please refer to the addition page (for example CPLD). If not available, add note, that this part is configurable
  • Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro

    • Use "Scroll Title" macro for pictures and table labels. Figure number must be set manually at the moment (automatically enumeration is planned by scrollPDF)
      • Figure template:

        Scroll Title
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        titleText


        Scroll Ignore

        Create DrawIO object here: Attention if you copy from other page, objects are only linked.


        Scroll Only

        image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed



      • Table template:

        • Layout macro can be use for landscape of large tables

      • Scroll Title
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        ExampleComment
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    • The anchors of the Scroll Title should be named consistant across TRMs. A incomplete list of examples is given below

      • <type>_<main section>_<name>

        • type: Figure, Table
        • main section:
          • "OV" for Overview
          • "SIP" for Signal Interfaces and Pins,
          • "OBP" for On board Peripherals,
          • "PWR" for Power and Power-On Sequence,
          • "B2B" for Board to Board Connector,
          • "TS" for Technical Specification
          • "VCP" for Variants Currently in Production
          •  "RH" for Revision History
        • name: custom, some fix names, see below
      • Fix names:
        • "Figure_OV_BD" for Block Diagram

        • "Figure_OV_MC" for Main Components

        • "Table_OV_IDS" for Initial Delivery State

        • "Table_PWR_PC" for Power Consumption

        • "Figure_PWR_PD" for Power Distribution
        • "Figure_PWR_PS" for Power Sequence
        • "Figure_PWR_PM" for Power Monitoring
        • "Table_PWR_PR" for Power Rails
        • "Table_PWR_BV" for Bank Voltages
        • "Table_TS_AMR" for Absolute_Maximum_Ratings

        • "Table_TS_ROC" for Recommended_Operating_Conditions

        • "Figure_TS_PD" for Physical_Dimensions
        • "Table_VCP_SO" for TE_Shop_Overview
        • "Table_RH_HRH" for Hardware_Revision_History

        • "Figure_RH_HRN" for Hardware_Revision_Number
        • "Table_RH_DCH" for Document_Change_History
    • Use Anchor in the document: add link macro and add "#<anchorname>
    • Refer to Anchror from external : <page url>#<pagename without space characters>-<anchorname>


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Note for Download Link of the Scroll ignore macro:

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Scroll Ignore

Download PDF version of this document.

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Table of Contents

Table of Contents

Overview

The Trenz Electronic TEBA0714 is a carrier for Trenz Electronic module TE0714 which is an industrial grade module integrated with Xilinx Artix 7.

Refer to http://trenz.org/teba0714-info for the current online version of this manual and other available documentation.

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Notes :

Key Features

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups:

  • FPGA/Module
    • Package:
    • Speed:
    • Temperature:
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension
  • Module:
    • Trenz TE0714 Modul Carrier
    • Temperature: -40 to +85 °C
  • On Board:
    • 2 x User LEDs (Red, Green)
    • 1 x DONE LED (Red)
  • Interface:
    • 2 x Pin-Header 50 (FPGA Bank I/Os and Power)
    • 2x Samtec 100 Pin LSHM Series Connectors
    • 2 x Pin-Header for FPGA Bank Power
    • 1 x XMOD (TE0790) Pin-Header
    • 1 x Pin-Header 16 Pol. (JTAG, MGT-CLK, Boot Mode, XADC, I/O's)
    • 1 x Pin-Header 10 Pol. (Ein-/ und Ausgänge)
    • 1 x SFP+ Connectors
  • Power:
    • 1 x LDO Regulator
  • Dimension: 30 mm x 40 mm

Block Diagram

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Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .



Scroll Title
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titleTEBA0714 block diagram


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Main Components

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Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


Note

For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .



Scroll Title
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titleTEBA0714 main components


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  1. 6-pin header J26 for selecting PL-bank I/O voltage
  2. 6-pin header J27 for selecting XMOD/JTAG VCCIO
  3. Samtec Razor Beam™ LSHM-150 B2B connector, JM1
  4. Samtec Razor Beam™ LSHM-150 B2B connector, JM2
  5. XMOD header, JX1
  6. Voltage Regulator, U1
  7. User Red LED D2
  8. User Green LED D1 (red)
  9. SFP+ Connector, J1
  10. Red LED D3, indicating FPGA's 'Programming DONE'-signal
  11. 50-pin header solder pads J20 for access to SoM's PL I/O-banks (LVDS pairs possible)
  12. 16-pin header solder pads J3, JTAG/UART header with ADC and MGT clock input
  13. 10-pin header solder pads J4 for access to SoM's PL I/O-banks (LVDS pairs possible)
  14. 50-pin header solder pads J17 for access to SoM's PL I/O-banks (LVDS pairs possible)

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

  • VCCIO voltage selection jumpers are all set to 1.8 V.
  • Pin headers (not soldered to the board, but included in the package as separate component)
Scroll Title
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titleInitial delivery state of programmable devices on the module

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Storage device name

Content

Notes

---

---

---


Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.


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titleBoot process.

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Signal

MODE Signal State

Boot ModeNote
BOOTMODE

high or open

Master SPI, x4 Mode


low or ground

Slave Selects MAP





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titleReset process.

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Signal

B2BSignal StateNote

PROG_B

JM1-94Active LowClear FPGA configuration (falling edge) and initiate a new configuration sequenz (next rising edge).


Signals, Interfaces and Pins

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

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titleGeneral PL I/O to B2B connectors information

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B2B ConnectorInterfaceNumber of I/ONotes
JM1



User I/O52 Single ended, 27 Differential-
MGT lanes4 Differential, 2 lanes
MGT reference clock input2 Single ended, 1 Differential
JTAG4 Single ended
SoM control signals2 Single ended'PROG_B', 'DONE'
JM2User I/O36 Single ended or 18 differential-
SFP+ Interface control signals8 Single ended
QSPI interface6 Single ended
UART interface2 Single ended
User LEDs2 Single endedRed, Green
SoM control signals1 Single ended'BOOTMODE'


JTAG Interface BAse

JTAG access to the mounted SoM is provided through B2B connector JM1 and JM2 and is also routed to the XMOD JTAG/UART header JX1.

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titleJTAG pins connection

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XMOD Header Pin

B2B ConnectorConnected toNote
AJM2-97B14_L25UART Transfer
BJM2-99B14_L0UART Receive
EJM2-100BOOTMODE
GJM1-94PROG_B
CJM1-90TCK
DJM1-86TDI
FJM1-88TDO
HJM1-92TMS
3.3VJM1-97,993.3V
VIOJM2-53V_CFG


SFP+ Connector

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titleSFP+ Connector Information

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PinConnected toNotes
VCCR3.3V
VCCT3.3V
VREFGND
TD+/TD-MGT TXMGT Lane
RD+/RD-MGT RXMGT Lane
TX/FAULTSFP0_TX_FAULSFP_CTRL
TX/DISABLESFP0_TX_DISSFP_CTRL
MOD-DEF2SFP0_SDASFP_CTRL
MOD-DEF1SFP0_SCLSFP_CTRL
MOD-DEF0SFP0_MT_DEF0SFP_CTRL
RS0/RS1SFP0_RS0_1SFP_CTRL
LOSSFP0_LOSSFP_CTRL


SMT Pin Header

There are two SMT Pin Headers, J25-J26.

Scroll Title
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titleSMD Connector Information

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SMT Pin HeaderPinConnected toNotes
J26


1,3,5VCCIO34
21.8V
42.5V
63.3V_OUT
J27


1,3,5V_CFG
21.8V
4V_CFG0
63.3V_OUT


On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs


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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection


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Chip/InterfaceDesignatorNotes
LEDsD1...3


LEDs

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DesignatorColorConnected toActive LevelNote
D1GreenGLEDActive Low
D2RedRLEDActive High
D3RedDONEActive High


Power and Power-On Sequence

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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit


Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


Power Supply

Power supply with minimum current capability of 3A for system startup is recommended.

The on-board voltages of the carrier board will be powered up with an external power-supply with nominal voltage of 3.3V.

Power Consumption

Scroll Title
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titlePower Consumption

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Power Input PinTypical Current
VIN3.3V


* TBD - To Be Determined

Power Distribution Dependencies

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titlePower Distribution


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Power-On Sequence

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Power Rails

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titleModule power rails.

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Power Rail Name

B2B Connector

JM1 Pin

B2B Connector

JM2 Pin

DirectionNotes
3.3V99,97-Input
1.8V-18Input
3.3V_OUT8354Output
VCCIO3461-Input

V_CFG0

53-Input


Board to Board Connectors

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  • This section is optional and only for modules.
  • use "include page" macro and link to the general B2B connector page of the module series,

    For example: 6 x 6 SoM LSHM B2B Connectors

    Include Page
    PD:6 x 6 SoM LSHM B2B Connectors
    PD:6 x 6 SoM LSHM B2B Connectors

TEBA0714 carrier use two  Samtec Razor Beam LSHM Connectors on the bottom side.

Include Page
PD:4 x 5 SoM LSHM B2B Connectors
PD:4 x 5 SoM LSHM B2B Connectors

Technical Specifications

Absolute Maximum Ratings

Scroll Title
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titlePS absolute maximum ratings

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SymbolsDescriptionMinMaxUnit
VINInput Supply Voltage3.1353.465V
T_STRStorage Temperature-4085°C


Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

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titleRecommended operating conditions.

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ParameterMinMaxUnitsReference Document
VIN3.1353.465V3.3V Nominal Power Supply
T_OPR-4080°C


Physical Dimensions

  • Module size: 46 mm × 75 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: ? mm.

PCB thickness: 1.64 mm.

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In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .



Scroll Title
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titlePhysical Dimension


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Currently Offered Variants 

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Set correct link to the shop page overview table of the product on English and German.

Example for TE0728:

    ENG Page: https://shop.trenz-electronic.de/en/Products/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

    DEU Page: https://shop.trenz-electronic.de/de/Produkte/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

For Baseboards or modules, where no overview page is available (and revision number is coded in the direct link) use shop search link, e.g. TE0706:

    ENG Page: https://shop.trenz-electronic.de/en/search?sSearch=TE0706

   DEU Page: https://shop.trenz-electronic.de/de/search?sSearch=TE0706


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titleTrenz Electronic Shop Overview

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Trenz shop TEBA0714 overview page
English pageGerman page


Revision History

Hardware Revision History

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Set correct links to download  arrier, e.g. TE0706 REV02:

  TE0706-02  ->   https://shop.trenz-electronic.de/Download/?path=Trenz_Electronic/Modules_and_Module_Carriers/4x5/4x5_Carriers/TE0706/REV02/Documents

Note:

  • Date format:  YYYY-MM-DD


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titleHardware Revision History

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DateRevisionChangesDocumentation Link
2016-06-1501Initial ReleaseREV01


Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Scroll Title
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titleBoard hardware revision number.


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Document Change History

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  • Note this list must be only updated, if the document is online on public doc!
  • It's semi automatically, so do following
    • Add new row below first

    • Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template

    • Metadata is only used of compatibility of older exports


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titleDocument change history.

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Page info
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Page info
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  • Initial Release

--

all

Page info
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  • --


Disclaimer

Include Page
IN:Legal Notices
IN:Legal Notices