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Template Revision 2.4

  • Module: TRM Name always "TE Series Name" +TRM
    Example: "TE0728 TRM"
  • Carrier: TRM Name usually "TEB Series Name" +TRM
    Example: "TEB0728 TRM"


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Important General Note:

  • If some section is configurable and depends on Firmware, please refer to the addition page (for example CPLD). If not available, add note, that this part is configurable
  • Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro

    • Use "Scroll Title" macro for pictures and table labels. Figure number must be set manually at the moment (automatically enumeration is planned by scrollPDF)
      • Figure template:

        Scroll Title
        anchorFigure_anchorname
        titleText


        Scroll Ignore

        Create DrawIO object here: Attention if you copy from other page, objects are only linked.


        Scroll Only

        image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed



      • Table template:

        • Layout macro can be use for landscape of large tables

      • Scroll Title
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        titleText

        Scroll Table Layout
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        ExampleComment
        12



    • The anchors of the Scroll Title should be named consistant across TRMs. A incomplete list of examples is given below

      • <type>_<main section>_<name>

        • type: Figure, Table
        • main section:
          • "OV" for Overview
          • "SIP" for Signal Interfaces and Pins,
          • "OBP" for On board Peripherals,
          • "PWR" for Power and Power-On Sequence,
          • "B2B" for Board to Board Connector,
          • "TS" for Technical Specification
          • "VCP" for Variants Currently in Production
          •  "RH" for Revision History
        • name: custom, some fix names, see below
      • Fix names:
        • "Figure_OV_BD" for Block Diagram

        • "Figure_OV_MC" for Main Components

        • "Table_OV_IDS" for Initial Delivery State

        • "Table_PWR_PC" for Power Consumption

        • "Figure_PWR_PD" for Power Distribution
        • "Figure_PWR_PS" for Power Sequence
        • "Figure_PWR_PM" for Power Monitoring
        • "Table_PWR_PR" for Power Rails
        • "Table_PWR_BV" for Bank Voltages
        • "Table_TS_AMR" for Absolute_Maximum_Ratings

        • "Table_TS_ROC" for Recommended_Operating_Conditions

        • "Figure_TS_PD" for Physical_Dimensions
        • "Table_VCP_SO" for TE_Shop_Overview
        • "Table_RH_HRH" for Hardware_Revision_History

        • "Figure_RH_HRN" for Hardware_Revision_Number
        • "Table_RH_DCH" for Document_Change_History
    • Use Anchor in the document: add link macro and add "#<anchorname>
    • Refer to Anchror from external : <page url>#<pagename without space characters>-<anchorname>



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-----------------------------------------------------------------------


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Note for Download Link of the Scroll ignore macro:


Scroll Ignore

Download PDF version of this document.


Scroll pdf ignore

Table of Contents

Table of Contents

Overview

The carrier board TEB0745 was especially designed and developed for the use of Trenz Electronic module TE0745. 

Refer to http://trenz.org/teb0745-info for the current online version of this manual and other available documentation.

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Notes :

Key Features

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Note:
Use 'Key Features' description in shoping page, for example: https://shop.trenz-electronic.de/de/TE0728-04-1Q-SoC-Micromodul-mit-Xilinx-Automotive-Zynq-7020-512-MByte-DDR3L-6-x-6-cm

  • Module: 
    • Trenz Electronic Module TE0745
    • Temperature: -40 to 85 °C
  • On Board:
    • 24V power supply terminal
    • 1 x EMI Network Filter
    • 3 x Variable Step Down Regulator Module (VDRM) with head sink
    • 2 x Synchronous Buck Regulator
    • 2 x Button (User / Reset)
    • 2 x LED (Green)
  • Interfaces:
    • 1 x XMOD (TE0790) Pin Header (JTAG / UART)
    • 1 x Pin Header (JTAG)
    • 1 x microSD connector
    • 1 x RJ45 Ethernet connector
    • 1 x USB Host Connector
    • 8 x SFP-Connector
    • 6 x Pin Header 50 pol. (FPGA Bank I/O's and Power)
    • 6 x Pin Header 12 pol. (FPGA Bank I/O's and Power)
    • 1 x battery holder
    • 2 x DIP Switch Array (VCC_HR_B / Modi)
  • Dimension: 200 mm x 231 mm

Block Diagram

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add drawIO object here.

Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .



Scroll Title
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titleTEB0745 block diagram


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Main Components

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Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


Note

For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .



Scroll Title
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titleTEB0745 main components


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  1. SFP+ Connector, J4 J6 J8 J10 J13 J15 J18 J20
  2. Board to Board Connector (B2B), J1 J2 J3
  3. RJ45 Gigabit Ethernet connector, J22
  4. SD card connector, J16
  5. USB connector, J41
  6. Push Button, S2 S3
  7. SDIO port expander, U15
  8. Power distribution switch, U4
  9. Battery holder, B1
  10. Mag I3C power, U26 U12 U5
  11. Push bottun switch, S1 S4
  12. Buck regulator, U6 U7
  13. I2C EEPROM, U33
  14. Low voltage chanel I2C switch, U16
  15. Overvoltage, undervoltage, reversesupply protection controller, U13
  16. EMI suppression filter, U29
  17. JTAG interface, J12
  18. Power jack, J31
  19. 8bit IO expandor for I2C bus, U18 U25
  20. Pin Headers J23...26 (Not Assembled)
  21. Pin Headers J27-J28-J32-J36 (Not Assembled)
  22. Pin Headers J37...40 (Not Assembled)

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty


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titleInitial delivery state of programmable devices on the module

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Storage device name

Content

Notes

EEPROMNot Programmed



Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.


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titleBoot process.

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MODE Signal State

ConnectB2BStatusBoot Mode

BOOTMODE

S1J2-133OpenQSPI
ShortSD Card



Scroll Title
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titleReset process.

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Type

ConnectionB2BNote
Main Module Reset (RST_IN_N)Button S2 or J12-11 XMOD connector (Default XMOD Button)J2-131Low Active Reset


Signals, Interfaces and Pins

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

Scroll Title
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titleGeneral PL I/O to B2B connectors information

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B2B ConnectorInterfacesNumber of I/ONotes
J1

User I/O

48 singel ended, 24 Differential

2 singel ended

Connected to Bank 13

48 singel ended, 24 Differential

2 singel ended

Connected to Bank 12
JTAG Interface5 single endedTCK, TDI, TMS, TDO, JTAG_EN
SFP+ Connector8 DiffSPF4....7_RX_N/P , SPF4....7_TX_N/P
J2

Ethernet PHY4 Differential
2 single endedPHY_LED0...1
USB1 DifferentialOTG_N/P
Control Signals3 single endedPS_SRST, BOOTMODE, RST_IN_N
Power Control Signal2 single endedPWR_PS_OK, PWR_PL_OK
I2C Bus2 single endedI2C_SDA, I2C_SCL
User I/O4 single endedMIO12...15

J3


User I/O6 Single endedMIO46...51
SD Card Connector6 Single endedSD_CLK, SD_CMD, SD_DAT0...3 (MIO40...45)
SFP+ Connector8 DifferentialSPF0....3_RX_N/P , SPF0....3_TX_N/P


JTAG Interface

JTAG access to the TEB0745 SoM is available through B2B connector JB1 and JB2. JTAG_EN is connected to J1-138, JTAG_EN can be activated through DIP Switch S1-2.

Scroll Title
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titleJTAG pins connection

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Designator

Connected to

B2B Pin

XMOD Header JB1Note
AMIO15J2-129JB1-3UART TX - Input to the module
BMIO14J2-127JB1-7UART RX - Output of the module
CTCKJ1-143JB1-4JTAG interface signal
DTDOJ1-145JB1-8JTAG interface signal
FTDIJ1-142JB1-10JTAG interface signal
HTMSJ1-144JB1-12

JTAG interface signal

GRST_IN_NJ2-131JB1-11RESET will be connected to Push Button on JTAG Programmer


I2C Addresses

Scroll Title
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titleI2C Address

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I2C DeviceI2C AddressDesignatorNotes
I2C_EXP0x72U16SFP 0-9
EEPROM0x51U33
I/O EXP0x20...27U18...25


SD Card Socket

Power supply voltage for SD card holder is 3.3V.

Scroll Title
anchorTable_OBP_SDcard
titleSD card interface MIOs and pins

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SignalsConnected toB2BNotes
SD_CLKMIO40J3-150
SD_CMDMIO41J3-152
SD_DAT0MIO42J3-154
SD_DAT1MIO43J3-156
SD_DAT2MIO44J3-158
SD_DAT3MIO45J3-160


RJ45 Connector

Ethernet Socket is connected to Board to Board (B2B)  JM2.

Scroll Title
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titleLAN Transformer

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SignalB2BNotes
PHY_MDIO0_PJ2-120
PHY_MDIO_NJ2-122
PHY_MDIO1_PJ2-126
PHY_MDIO1_NJ2-128
PHY_MDIO2_PJ2-132
PHY_MDIO2_NJ2-134
PHY_MDIO3_PJ2-138
PHY_MDIO3_NJ2-140
PHY_LED0J2-144
PHY_LED1J2-146


Test Points

Scroll Title
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titleTest Points Information

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Test Point

Signals

B2B Connector

Notes
TP 15V-
TP 2VBAT_INJ1-146
TP 3VCCIO18VJ2- J3
TP 4VCC_HR_BJ1
TP 5-9GND-
TP 10PS_1.8VJ2
TP 11VCC_HR_BJ1
TP 123.3VJ1- J2
TP 13--
TP 14--
TP 15PWR_PL_OKJ2- 135
TP 16PWR_PS_OKJ2-139
TP 1724V_FUSED-
TP 183.3V_SFP-


On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs


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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection


Scroll Title
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titleOn board peripherals

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Chip/InterfaceDesignatorNotes
EEPROMU33

DIP Switches

S1, S4
Push ButtonsS2, S3
LEDsD1, D5


EEPROM

Scroll Title
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titleI2C EEPROM interface MIOs and pins

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MIO PinSchematicB2BNotes
MIO10I2C_SCLJ2-119
MIO11I2C_SDAJ2-121



Scroll Title
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titleI2C address for EEPROM

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I2C AddressDesignatorNotes
0x51U33


DIP Switches

There are two DIP Switches S1,S4.

Scroll Title
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titleDIP Switch S1

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DesignatorConnected toB2BNote
S1-ABootModeJ2-133
S1-BJTAG_ENJ1-148
S1-C-

S1-DPS_SWJ2-123


VCC_HR_B voltage can be selected using DIP Switch S4 .

Scroll Title
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titleDIP Switch S4

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S4-1S4-2S4-3S4-4Power VCC_HR_BNotes
OFFOFFOFFN.C.1,8V
OFFOFFONN.C.1,5V
OFFONOFFN.C.3,3V
OFFONONN.C.2,5V
ONOFFOFFN.C.0,8V
ONOFFONN.C.Do not use
ONONOFFN.C.1,25V
ONONONN.C.1,2V


Push Buttons

There are two push buttons S2, S3.

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titleOn-board push button =s

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DesignatorConnected toB2BActive LevelNote
S3USR_BTNJ3-153Active high
S2RST_IN_NJ2-131Active highGeneral Reset


LEDs

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titleOn-board LEDs

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DesignatorSchematicColorB2BConnected toNote
D1LED1GreenJ3-149MIO48
D5LED2GreenJ3-151MIO49


Power and Power-On Sequence

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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit


Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


Power Supply

Power supply with minimum current capability of 2.5 A for system startup is recommended.

Power Consumption

Scroll Title
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titlePower Consumption

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Power Input VoltageTypical Current
24VTBD*
VBATTBD*


* TBD - To Be Determined

Power Distribution Dependencies

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titlePower Distribution


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Power-On Sequence

Scroll Title
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titlePower Sequency


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Power Rails

Scroll Title
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titleModule power rails.

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B2BVCC / VCCIODirectionNotes
JB13.3VINPL_VIN
VCC_HR_BINVCCIO_12, VCCIO_13
JB2VCCIO18VINVCCIO_34, VCCIO_35
PS_1.8VOUTPWR_OUT
3.3VINPS_3.3V

JB3

VCCIO18VINPWR_IN_VCCIO_33


Board to Board Connectors

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  • This section is optional and only for modules.
  • use "include page" macro and link to the general B2B connector page of the module series,

    For example: 6 x 6 SoM LSHM B2B Connectors

Include Page
PD:5.2 x 7.6 SoM ST5 and SS5 B2B Connectors
PD:5.2 x 7.6 SoM ST5 and SS5 B2B Connectors

Technical Specifications

Absolute Maximum Ratings

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titlePS absolute maximum ratings

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SymbolsMinMaxUnitNote
VIN Supply Voltage024V
Storage Temperatur-25+85°C


Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution.

Scroll Title
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titleRecommended operating conditions.

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ParameterMinMaxUnitsReference Document
VIN Supply Voltage2424V
Operating Temperatur-40+85°C


Physical Dimensions

  • Module size: 200 mm x 231 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 3.5 mm.

  • PCB thickness: 1.6 mm.
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In 'Physical Dimension' section, top and button view of moduloe must be insterted, information regarding physical dimention can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part)for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .



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titlePhysical dimensions drawing

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scroll-htmltrue


Currently Offered Variants 

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Set correct link to the shop page overview table of the product on English and German.

Example for TE0728:

ENG Page: https://shop.trenz-electronic.de/en/Products/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

DEU Page: https://shop.trenz-electronic.de/de/Produkte/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

if not available, set.


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titleTrenz Electronic Shop Overview

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Trenz shop TE0745 overview page
English pageGerman page


Revision History

Hardware Revision History

Scroll Title
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titleHardware Revision History

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DateRevisionChangesDocumentation Link
2018-12-0602a
  • Resistors R14 and R15 was replaced by 953R (was 5K1)
  • Resistor R5 was replaced by 5K1, R8 by 953R (was 9K09 and 1K69 respectively)
REV02-A
2018-10-1902
  • U16 I2C expander: address set to 0x72
  • U33 EEPROM: address set to 0x51. Added variant to set address 0x52.
  • Changed power up sequence: 24V_FUSED -> 3.3V (Module power up) -> 5V -> VCCIO18, VCC_HR_B, 3.3V_SFP
  • Fixed PCB patch: U6 pin 18 connected to 5V, pin 19 connected to GND.
  • JTAG connector J30 VREF (pin2) and XMOD VIO (pin 6) connected to 3.3V. XMOD IO A, B, E, G connected to module MIO via level translator U8.
  • Pull-up for BOOTMODE and PS_SW (DIP switch S1), RST_IN_N and USR_BTN (front panel buttons S2, S3) changed from VCCIO18 to PS_1.8V; JTAG_EN connected to 3.3V via DIP switch (S1).
  • Added switch S4 for selecting of output voltage of DCDC U7 (VCC_HR_B, HR banks VCCO)
REV02
2016-05-2501-REV01


Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Scroll Title
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titleBoard hardware revision number.


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Document Change History

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  • Note this list must be only updated, if the document is online on public doc!
  • It's semi automatically, so do following
    • Add new row below first

    • Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template

    • Metadata is only used of compatibility of older exports


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titleDocument change history.

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DateRevisionContributorDescription

Page info
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typeFlat

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Page info
infoTypeModified by
typeFlat
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  • Technical Specificationss Update

--

all

Page info
infoTypeModified users
typeFlat
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  • --


Disclaimer

Include Page
IN:Legal Notices
IN:Legal Notices