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Some sources are available: TE0821 Resources

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Template Revision 2.12

  • Module: TRM Name always "TE Series Name" +TRM
    Example: "TE0728 TRM"
  • Carrier: TRM Name usually "TEB Series Name" +TRM
    Example: "TEB0728 TRM"

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Table of Contents

Table of Contents

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The Trenz Electronic TE0821 -01-3BI21FA is a powerful 4 x 5 cm MPSoC module integrated with a Xilinx Zynq UltraScale+ ZU3EGMPSoC. In addition, the module is equipped with a 2 2x 1 GB DDR4 SDRAM chip, 4Gb up to 128 Gb eMMC chip,  2x 64 MB flash memory for configuration and data storage, as well as powerful switching power supplies for all required voltages. . The module is equipped with a Lattice Mach XO2 CPLD for system controlling. 3x Robust high-speed connectors provide a large number of inputs and outputs.This module is pin compatible with Trenz Electronic TE0820 MPSoC modules (JM2 pin 100 is not connected).

The highly integrated modules are smaller than a credit card and are offered in several variants at an affordable price-performance ratio. Modules with a 4 x 5 cm form factor are completely mechanically and largely electrically compatible with each other.

All components cover at least the industrial temperature range from -40 ° C to + 85 ° C. The temperature range in which the module can be used depends on the customer design and the selected cooling. Please contact us for special solutions.

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension


  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2 ...ZU5, *
    • Engine:  EG, CG, EV, *
    • Speed: -1, -1L, -2, -2L, 3, *, **
    • Temperature: I, E, *, **Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784I
    • ZU3EG, 784 Pin Packages
    • Application Processor: Quad-Core ARM Cortex-A53 MPCore
    • Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
    • Graphics Processor: Mali-400 MP2
  • RAM/Storage
    • 2 GByte 2x  DDR4 SDRAM, 32-Bit databus-width
      • Data Width: 16 Bit
      • Size: 8 Gb, *
      • Speed: 2400 Mbps, ***
    • 2x 128 MByte QSPI boot Flash in dual parallel mode
      • Data Width: 8 Bit
      • Size: 512 Mb Gb, *
    • 1x e.MMC Memory
      • Data Width: 16 Bit
      • Size: 8 Gb, *
      8 GByte e.MMC Memory (up to 64 GByte)
    • MAC address serial EEPROM with EUI-48 node identity
  • On Board
    • Graphic Processing Unit (GPU) :Mali-400 MP2

    • Lattice MachXO2 CPLD
    • Programmable Clock Generator
    • Hi-speed USB2 ULPI Transceiver
    • 4x LEDS
  • Interface
    • 1 Gbps RGMII Ethernet interface
    • Hi-speed USB2 ULPI transceiver with full OTG support
    • Graphic Processor Mali-400 MP2, *
    • 156 x High Performance (HP) und 96 x High Density PL I/Os
    • 4 x serial PS GTR transceivers
      • PCI Express interface
    Interface
    • PCI Express interface version 2.1 compliant
      • SATA 3.1
      specification compliant
      • interface
      • DisplayPort

      source-only
      • interface with video resolution up to 4k x 2k

      • 2x USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
    • 1 GB/s serial GMII interface
    • Hi-speed USB2 ULPI transceiver with full OTG support
    • 34 x High Performance und 96 x High Density PL I/Os
    • 14 x PS MIOs (6 of the MIOs intended for SD card interface in default configuration)
  • Power
    • All power regulators on board
  • Dimension
    • 40 x 50 mm
  • Note
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination4 x serial PS GTR transceivers
    • Rugged for shock and high vibration
  • Power
    • All power supplies on board
  • Dimension
    • 40 x 50 mm

Block Diagram

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Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


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titleTE0821 block diagram


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Main Components

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titleTE0821 main components


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Image Modified


  1. Xilinx Zynq ZYNQ UltraScale+ XCZU3EGMPSoC, U1
  2. Red LED (ERR_OUT), D3
  3. Green LED (ERR_STATUS), D4
  4. Red LED (DONE), D1
  5. GigaBit 10/100/1000 Mbps Energy Efficient Ethernet Transceiver, U8
  6. 8Gb DDR4, U2-U3
  7. 512 Mb SPI FlashMbit QSPI flash memory, U7-U17
  8. Green User LED, D2
  9. B2B connector Samtec Razor Beam, JM1
  10. Programmable clock generator, U10Board to Board Connector, JM1
  11. USB2.0 Transceiver,  U18
  12. Board to Board ConnectorB2B connector Samtec Razor Beam, JM3Board to Board Connector
  13. B2B connector Samtec Razor Beam, JM2
  14. 8 GByte eMMC , U17memory, U6
  15. Lattice Semiconductor MachXO2 System Controller CPLD, U21

Additional assembly options are available for cost or performance optimization upon request.

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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titleInitial delivery state of programmable devices on the module

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Storage device name

Content

Notes

SPI Dual QSPI Flash OTP AreaMemory

Not programmed

Except serial number programmed by flash vendor.

SPI Flash Quad Enable bit

Programmed

-


SPI Flash main arrayeMMC Memory

Not programmed


-DDR4 SDRAM

eFUSE USER

Not programmed-

eFUSE Security

Not programmed

-

Si5338 OTP NVMProgrammable Clock GeneratorNot programmed-
CPLD (LCMXO2-256HC)SC0820-02 QSPI FirmwareProgrammedTE0821 CPLDSee Boot Process section.


Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.

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titleBoot process.

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MODE Pin

Boot Mode
LowHigh

QSPI*

HighLowSD Card*


*changable also with other CPLD Firmware: TE0821 CPLD.


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titleReset process.

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Signal

B2BI/ONote

Signals, Interfaces and Pins

EN

JM1-28InputCPLD Enable Pin



Signals, Interfaces and Pins

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

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User
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FPGA BankTypeB2B Connector
I/O Signal Count
I/O Signal CountVoltage LevelNotes
64
24
HP
HDJM2

48

24x I/O, 12x  LVDS PairsVariable Max voltage
1
3.
8V
3V
64
25
HP
HD

JM2

2

JM1

24x I/O, 12x  LVDS Pairs

Variable 
User
Max voltage
1
3.
8V
3V
65
26
HP
HD

JM2

18

JM124x I/O, 12x  LVDS PairsVariable 
User
Max voltage
1
3.
8V
3V
65
44
HP
HD

JM3

16

JM224x I/O, 12x  LVDS PairsVariable
User
Max voltage
1
3.
8V
3V
66
65

HP

JM1

48

JM2

18x I/O, 9x LVDS Pairs

Variable
User
Max voltage 1.8V

65

500

HP

MIOJM181.8V-

JM3

16x I/O, 8x LVDS Pairs

Variable

Max voltage 1.8V

501

MIO

JM1

6

3.3V

-
505GTRJM3
4 lanes
16x I/O, 8x LVDS Pairs-
-
4x lanes
505GTR CLKJM3
1 differential input
1x Diff Clock-

-


501

MIO

JM1

15 I/O

3.3V



For detailed information about the pin-out, please refer to the Pin-out table.

JTAG Interface

JTAG access to the TExxxx SoM Xilinx Zynq UltraScale+ is applicable by using Lattice MachXO CPLD  through B2B connector JMXJM2.

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JTAG Signal

B2B Connector

Note
TMSJM2-93
TDIJM2-95
TDOJM2-97
TCKJM2-99 

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JTAGEN

...

JM1-89Pulled Low: Xilinx Zynq UltraScale+ MPSoC
Pulled High: Lattice MachXO CPLD


MGT Lanes

There are 4x MGT Lanes connected to FPGA Bank 505-GTR. The Xilinx Zynq UltraScale+ device used on the TE0821 module has 4 GTR transceivers. All 4 are wired directly to B2B connector JM3. MGT (Multi Gigabit Transceiver) lane consists of one transmit and one receive (TX/RX) differential pairs, four signals total per one MGT lane. Following table lists lane number, FPGA bank number, transceiver type, signal schematic name, board-to-board pin connection and FPGA pins connection:

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MIO Pins

you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

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MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI
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MIO Pin

Lane

Connected to
SchematicB2B
Notes
Note

Test Points

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

0
  • B505_RX0_P
  • B505_RX0_N
  • B505_TX0_P
  • B505_TX0_N
  • JM3-26
  • JM3-28
  • JM3-25
  • JM3-27

1
  • B505_RX1_P
  • B505_RX1_N
  • B505_TX1_P
  • B505_TX1_N
  • JM3-20
  • JM3-22
  • JM3-19
  • JM3-21

2
  • B505_RX2_P
  • B505_RX2_N
  • B505_TX2_P
  • B505_TX2_N
  • JM3-14
  • JM3-16
  • JM3-13
  • JM3-15

3
  • B505_RX2_P
  • B505_RX2_N
  • B505_TX2_P
  • B505_TX2_N
  • JM3-8
  • JM3-10
  • JM3-7
  • JM3-9


Gigabit Ethernet

On-board Gigabit Ethernet PHY is provided with Marvell Alaska 88E1512 chip. The Ethernet PHY RGMII interface is connected to the Zynq Ethernet0 PS GEM0. I/O voltage is fixed at 1.8V for HSTL signaling. SGMII (SFP copper or fiber) can be used directly with the Ethernet PHY, as the SGMII pins are available on the B2B connector JM3. The reference clock input of the PHY is supplied from an on-board 25MHz oscillator (U11), the 125MHz output clock is left unconnected.

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titleGigaBit Ethernet connection

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titleTest Points Information

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On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs
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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection

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Chip/Interface
Pin
Designator
Schematic
Notes

Quad SPI Flash Memory

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

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titleQuad SPI interface MIOs and pins
Connected toNote
MDIP0...3

PHY_MDI0...3

B2B, JM1


MDC

ETH_MDC

MIO76


MDIOETH_MDIOMIO77
S_INS_INB2B, JM3
S_OUTS_OUTB2B, JM3
TXD0..3ETH_TXD0...3MIO65...68
TX_CTRLETH_TXCTLMIO69
TX_CLKETH_TXCKMIO64
RXD0...3ETH_RXD0...3MIO71...74
RX_CTRLETH_RXCTLMIO75
RX_CLKETH_RXCKMIO70
LED0...2PHY_LED0...2FPGA Bank 66
RESETnETH_RSTMIO24


System Controller CPLD

Special purpose pins are connected to System Controller CPLD and have following default configuration:

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Pin NameModeFunctionDefault Configuration
EN1InputPower Enable

No hard wired function on PCB. When forced low, PGOOD goes low without effect on power management

PGOODOutputPower GoodOnly indirect used for power status, see CPLD description
NOSEQ--No used for Power sequencing, see CPLD description
RESINInputReset

Active low reset, gated to POR_B

JTAGENInputJTAG SelectLow for normal operation, high for CPLD JTAG access


Please check the entire information at TE0821 CPLD.

USB Interface

USB PHY is provided by Microchip USB3320. The ULPI interface is connected to the Zynq PS USB0. I/O voltage is fixed at 1.8V. Reference clock input for the USB PHY is supplied by the on-board 52.00 MHz oscillator (U14). 

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 PHY PinZYNQ PinB2B NameNotes
ULPIMIO52..63-Zynq USB0 MIO pins are connected to the USB PHY.
REFCLK--52.00 MHz from on-board oscillator (U14).
REFSEL[0..2]--Reference clock frequency select, all set to GND selects 52.00 MHz.
RESETBMIO25-Active low reset.
CLKOUTMIO52-Connected to 1.8V, selects reference clock operation mode.
DP, DM-OTG_D_P, OTG_D_NUSB data lines routed to B2B connector JM3 pins 47 and 49.
CPEN-VBUS_V_ENExternal USB power switch active high enable signal, routed to JM3 pin 17.
VBUS-USB_VBUSConnect to USB VBUS via a series of resistors, see reference schematics, routed to JM3 pin 55.
ID-OTG_IDFor an A-device connect to ground, for a B-device left floating. routed from JM3 pin 23.


I2C Interface

On-board I2C devices are connected to MIO38 (SCL) and MIO39 (SDA) which are configured as I2C0 by default. Addresses for on-board I2C slave devices are listed in the table below:

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I2C DeviceI2C AddressNotes

Si5338A PLL

0x70-
EEPROM0x50-


MIO Pins

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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3, SPI_SCK

J2QSPI



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MIO PinConnected toB2BNotes
0...5QSPI Flash, U7-SPI Flash
7...12QSPI Flash, U17-SPI Flash
13...23eMMC, U6

24ETH Transceiver, U8-ETH_RST
25USB2.0 Transceiver, U18-OTG_RST
26...33User MIOJM1
34...37N.C-N.C
38...39EEPROM, U25-I2C_SDA/SCL
40...45N.C
N.C
46...51SD CardJM1
52...63USB2.0 Transceiver, U18-
63...77Ethernet Transceiver, U8-


Test Points

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test PointSignalB2BNotes
10PWR_PL_OKJ2-120



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Test PointSignalConnected toNotes
1I2C_SCLEEPROM, U25
2I2C_SDAEEPROM, U25
3SRST_BFPGA Bank 503PSCONFIG
4PS_CLKFPGA Bank 503PSCONFIG
5PROG_BFPGA Bank 503PSCONFIG
6INIT_BFPGA Bank 503PSCONFIG
7DONERed LED, D1
8PS_LP0V85Voltage Regulator, U12
9DDR_2V5Voltage Regulator, U4
10PS_AVCCVoltage Regulator, U9
11DDR_1V2Voltage Regulator, U15
12PS_AVTTVoltage Regulator, U13
13PS_FP0V85Voltage Regulator, U26
14POR_BVoltage Translator, U19
15PS_PLLVoltage Regulator, U23
16PL_VCCINTVoltage Regulator, U5


On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs


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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection


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Quad SPI Flash Memory

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

The TE0821 is equipped with dual Flash Memory, U7, U17.  Two quad SPI compatible serial bus flash MT25QU512ABB8E12-0SIT memory chips are provided for FPGA configuration file storage. After configuration completes the remaining free memory can be used for application data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths to be used. The maximum data transfer rate depends on the bus width and clock frequency.

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PinSchematicNotes
U7 PinU17 Pin
nCSMIO5MIO7
CLKMIO0MIO12
DI/IO0MIO4MIO8
DO/IO1MIO1MIO9
nHOLD/IO3MIO3MIO11
WP/IO2MIO2MIO10


EEPROM

There is a 2Kb EEPROM provided on the module TE0821.

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MIO PinSchematicU25 PinNotes
MIO39I2C_SDASDA
MIO38I2C_SCLSCL



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MIO PinI2C AddressDesignatorNotes
MIO38...390x50U25


LEDs

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DesignatorColorConnected toActive LevelNote
D1RedDONELow
D2GreenUSR_LEDHigh
D3RedERR_OUTHigh
D4GreenERR_STATUSHigh


DDR4 SDRAM

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE0821 SoM has dual 8 Gb volatile DDR4 SDRAM IC for storing user application code and data.

  • Part number: K4A8G165WB-BIRC
  • Supply voltage: 1.2V
  • Speed: 2400 Mbps
  • Temperature: -40 ~ 95 °C

System Controller CPLD

The System Controller CPLD (U21) is provided by Lattice Semiconductor LCMXO2-256HC (MachXO2 product family). It is the central system management unit with module specific firmware installed to monitor and control various signals of the FPGA, on-board peripherals, I/O interfaces and module as a whole.

See also TE0821 System Controller CPLD page

GigaBit Ethernet

On-board Gigabit Ethernet PHY (U8) is provided with Marvell Alaska 88E1512 IC (U8). The Ethernet PHY RGMII interface is connected to the ZynqMP Ethernet3 PS GEM3. I/O voltage is fixed at 1.8V for HSTL signaling. The reference clock input of the PHY is supplied from an on-board 25.00 MHz oscillator (U11).

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titleEthernet PHY to Zynq SoC connections

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PinSchematicConnected toNote
MDIP0...3

PHY_MDI0...3

B2B, JM1


MDC

ETH_MDC

MIO76


MDIOETH_MDIOMIO77
S_INS_INB2B, JM3
S_OUTS_OUTB2B, JM3
TXD0..3ETH_TXD0...3MIO65...68
TX_CTRLETH_TXCTLMIO69
TX_CLKETH_TXCKMIO64
RXD0...3ETH_RXD0...3MIO71...74
RX_CTRLETH_RXCTLMIO75
RX_CLKETH_RXCKMIO70
LED0...2PHY_LED0...2FPGA Bank 66
RESETnETH_RSTMIO24


USB2.0 Transceiver

Hi-speed USB ULPI PHY (U18) is provided with USB3320 from Microchip. The ULPI interface is connected to the Zynq PS USB0 via MIO52..63, bank 502. The I/O voltage is fixed at 1.8V and PHY reference clock input is supplied from the on-board 52.00 MHz oscillator (U14).

eMMC Flash Memory

eMMC Flash memory device(U6) is connected to the ZynqMP PS MIO bank 500 pins MIO13..MIO23. eMMC chips IS21ES08G-JCLI (FLASH - NAND Speicher-IC (64 Gb x 1) MMC ) is used.

Clock Sources

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titleOsillators

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DesignatorDescriptionFrequencyNote
U11MEMS Oscillator25 MHz
U14MEMS Oscillator52 MHz
U32MEMS Oscillator80 MHz


Programmable Clock Generator

There is a Silicon Labs I2C programmable clock generator Si5338A (U10) chip on the module. It's output frequencies can be programmed using the I2C bus address 0x70 or 0x71. Default address is 0x70, IN4/I2C_LSB pin must be set to high for address 0x71.

A 25.00 MHz oscillator is connected to the pin IN3 and is used to generate the output clocks. The oscillator has its output enable pin permanently connected to 1.8V power rail, thus making output frequency available as soon as 1.8V is present. Three of the Si5338 clock outputs are connected to the FPGA. One is connected to a logic bank and the other two are connected to the GTR banks.

Once running, the frequency and other parameters can be changed by programming the device using the I2C bus connected between the FPGA (master) and clock generator (slave). For this, proper I2C bus logic has to be implemented in FPGA.

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MIO38
Scroll Title
anchorTable_OBP_EEPPCLK
titleI2C EEPROM interface MIOs and pinsProgrammable Clock Generator Inputs and Outputs

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U25 PinSignalConnected toDirectionNote

IN0..1

CLK_INJM3IN
IN2CLK_25MOscillator, U11IN
SCL
MIO PinSchematicU25 PinNotes
MIO39I2C_SDASDA
I2C_SCL
SCL
Scroll Title
anchorTable_OBP_I2C_EEPROM
titleI2C address for EEPROM
Scroll Table LayoutorientationportraitsortDirectionASCrepeatTableHeadersdefaultstylewidthssortByColumn1sortEnabledfalsecellHighlightingtrueMIO PinI2C AddressDesignatorNotesMIO38...390x50U25

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EEPROM,U25INOUT
SDAI2C_SDAEEPROM,U25INOUT
CLK0CLK0JM3OUT
CLK1B505_CLK3FPGA Bank 505IN
CLK2B505_CLK1FPGA Bank 505IN
CLK3CLK3_N
IN


Power and Power-On Sequence

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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit


Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


Power Supply

Power supply with minimum current capability of 3 A for system startup is recommended.

Power Consumption

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titleOn-board LEDsPower Consumption

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DesignatorColorConnected toActive LevelNote
D1RedDONEHighD2GreenERR_STATUSHighD3RedERR_OUTHigh

DDR3 SDRAM

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE0821 SoM has 8 Gb volatile DDR4 SDRAM IC for storing user application code and data.

  • Part number: K4A8G165WB-BIRC
  • Supply voltage: 1.2V
  • Speed: 2400 mbps
  • Temperature: -40 ~ 95 °C

Ethernet

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anchorTable_OBP_ETH
titleEthernet PHY to Zynq SoC connections
Power Input PinTypical Current
VINTBD*
3.3VINTBD*


* TBD - To Be Determined

Power Distribution Dependencies

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titlePower Distribution


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Power-On Sequence

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titleOsillatorsPower Sequency


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DesignatorDescriptionFrequencyNote
U11MEMS Oscillator25 MHzU14MEMS Oscillator25 MHz

Programmable Clock Generator

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Power Rails

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titleProgrammable Clock Generator Inputs and OutputsModule power rails.

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U?? Pin
SignalConnected toDirectionNote

IN0

IN1IN2IN3

XAXB

SCLKSDAOUT0OUT1OUT2OUT3OUT4OUT5OUT6OUT7OUT8/OUT9

Power and Power-On Sequence

...

hiddentrue
idComments

In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit
Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .

cellHighlightingtrue

Power Rail Name

B2B JM1 Pin

B2B JM2 Pin

B2B JM3 Pin

Direction

Notes
VIN

1, 3, 5

2, 4, 6, 8-InputSupply voltage from the carrier board
3.3V-10, 12-OutputInternal 3.3V voltage level
VCCO_HD25_269,11
-Input0 to 3.3V Voltage
3.3VIN13, 15--InputSupply voltage from the carrier board
1.8V39--OutputInternal 1.8V voltage level
JTAG VREF-91-OutputJTAG reference voltage.
Attention: Net name on schematic is "3.3VIN"
VCCO_HD24_44-7, 9-Input0 to 3.3V Voltage
VCCO_65-5-Input0 to 1.8V Voltage
PSBATT79--Input1.2 to 1.5V Voltage


Bank Voltages

Power Supply

Power supply with minimum current capability of xx A for system startup is recommended.

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titlePower ConsumptionZynq SoC bank voltages.

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Power Input PinTypical Current
VINTBD*

* TBD - To Be Determined

Power Distribution Dependencies

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titlePower Distribution

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Power-On Sequence

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titlePower Sequency

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Voltage Monitor Circuit

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titleVoltage Monitor Circuit
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FPGA BankSchematicVoltageNote
Bank 24 HDVCCO_HD24_44Variable Max voltage 3.3V
Bank 25 HDVCCO_HD25_26Variable Max voltage 3.3V
Bank 26 HDVCCO_HD25_26Variable Max voltage 3.3V
Bank 44 HDVCCO_HD24_44VariableMax voltage 3.3V
Bank 64 HPVCCO_64N.CNot Connected
Bank 65 HP

VCCO_65

VariableMax voltage 1.8V
Bank 66 HPVCCO_661.8V
Bank 500 PSMIOVCCO_PSIO0_5001.8V

Bank 501 PSMIO

VCCO_PSIO1_501

3.3V


Bank 502 PSMIOVCCO_PSIO2_5021.8V
Bank 503 PSCONFIGVCCO_PSIO3_5031.8V
Bank 504 PSDDRDDR_1V21.2V



Board to Board Connectors

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  • This section is optional and only for modules.
  • use "include page" macro and link to the general B2B connector page of the module series,

    For example: 6 x 6 SoM LSHM B2B Connectors

    Include Page
    6 x 6 SoM LSHM B2B Connectors
    6 x 6 SoM LSHM B2B Connectors

Include Page
4 x 5 SoM LSHM B2B Connectors
4 x 5 SoM LSHM B2B Connectors

Technical Specifications

Absolute Maximum Ratings

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titleModule power rails.PS absolute maximum ratings

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Power Rail Name

B2B Connector

JM1 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

DirectionNotes

Bank Voltages

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anchorTable_PWR_BV
titleZynq SoC bank voltages.

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Bank          

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Voltage

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DescriptionMinMaxUnitNotes

VIN supply voltage

-0.3

7

V

See EN6347QI and TPS82085SIL datasheets
3.3VIN supply voltage-0.13.630VXilinx DS925 and TPS27082L datasheet
PS I/O supply voltage, VCCO_PSIO-0.53.630VXilinx document DS925
PS I/O input voltage-0.5VCCO_PSIO + 0.55VXilinx document DS925
HP I/O bank supply voltage, VCCO-0.52.0VXilinx document DS925
HP I/O bank input voltage-0.55VCCO + 0.55VXilinx document DS925
HD I/O bank supply voltage, VCCO-0.53.4VXilinx document DS925
HD I/O bank input voltage-0.55VCCO + 0.55VXilinx document DS925
PS GTR reference clocks absolute input voltage-0.51.1VXilinx document DS925
PS GTR absolute input voltage-0.51.1VXilinx document DS925

Voltage on SC CPLD pins

-0.5

3.75

V

Lattice Semiconductor MachXO2 datasheet

Storage temperature

-40

+85

°C

See eMMC datasheet


Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

use "include page" macro and link to the general B2B connector page of the module series,

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Technical Specifications

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Description
Scroll Title
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titlePS absolute maximum ratingsRecommended operating conditions.

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Symbols
ParameterMinMax
UnitVV