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Table of Contents

Table of Contents

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The Trenz Electronic TE0821 -01-3BI21FA is a powerful 4 x 5 cm MPSoC module integrated with a Xilinx Zynq UltraScale+ ZU3EGMPSoC. In addition, the module is equipped with a 2 2x 1 GB DDR4 SDRAM chip, 4Gb up to 128 Gb eMMC chip,  2x 64 MB flash memory for configuration and data storage, as well as powerful switching power supplies for all required voltages. . The module is equipped with a Lattice Mach XO2 CPLD for system controlling. 3x Robust high-speed connectors provide a large number of inputs and outputs.This module is pin compatible with Trenz Electronic TE0820 MPSoC modules (JM2 pin 100 is not connected).

The highly integrated modules are smaller than a credit card and are offered in several variants at an affordable price-performance ratio. Modules with a 4 x 5 cm form factor are completely mechanically and largely electrically compatible with each other.

All components cover at least the industrial temperature range from -40 ° C to + 85 ° C. The temperature range in which the module can be used depends on the customer design and the selected cooling. Please contact us for special solutions.

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension


  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2 ...ZU5, *
    • Engine:  EG, CG, EV, *
    • Speed: -1, -1L, -2, -2L, 3, *, **
    • Temperature: I, E, *, **Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784I
    • ZU3EG, 784 Pin Packages
    • Application Processor: Quad-Core ARM Cortex-A53 MPCore
    • Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
    • Graphics Processor: Mali-400 MP2
  • RAM/Storage
    • 2 GByte 2x  DDR4 SDRAM, 32-Bit databus-width
    • 128 MByte QSPI boot Flash in dual parallel mode
      • Data Width: 16 Bit
      • Size: 8 Gb, *
      • Speed: 2400 Mbps, ***
    • 2x QSPI boot Flash in dual parallel mode
      • Data Width: 8 Bit
      • Size: 512 Mb Gb, *
    • 1x e.MMC Memory
      • Data Width: 16 Bit
      • Size: 8 Gb, *
      8 GByte e.MMC Memory (up to 64 GByte)
    • MAC address serial EEPROM with EUI-48 node identity
  • On Board
    • Graphic Processing Unit (GPU) :Mali-400 MP2
    • Lattice MachXO2 CPLD
    • Programmable Clock Generator
    • Hi-speed USB2 ULPI Transceiver
    • 4x LEDS
  • Interface
    • 1 Gbps RGMII Ethernet interface
    • Hi-speed USB2 ULPI transceiver with full OTG support
    • Graphic Processor Mali-400 MP2, *
    • 156 x High Performance (HP) und 96 x High Density PL I/Os
    • 4 x serial PS GTR transceivers
      • PCI Express interface
    Interface
    • PCI Express interface version 2.1 compliant
      • SATA 3.1
      specification compliant
      • interface
      • DisplayPort

      source-only
      • interface with video resolution up to 4k x 2k

      • 2x USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
    • 1 GB/s serial GMII interface
    • Hi-speed USB2 ULPI transceiver with full OTG support
    • 34 x High Performance und 96 x High Density PL I/Os
    • 14 x PS MIOs (6 of the MIOs intended for SD card interface in default configuration)
  • Power
    • All power regulators on board
  • Dimension
    • 40 x 50 mm
  • Note
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination4 x serial PS GTR transceivers
    • Rugged for shock and high vibration
  • Power
    • All power supplies on board
  • Dimension
    • 40 x 50 mm

Block Diagram

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titleTE0821 block diagram


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Main Components

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  1. Xilinx Zynq ZYNQ UltraScale+ XCZU3EGMPSoC, U1
  2. Red LED (ERR_OUT), D3
  3. Green LED (ERR_STATUS), D4
  4. Red LED (DONE), D1
  5. 10/100/1000 Mbps energy efficient ethernet transceiverEnergy Efficient Ethernet Transceiver, U8
  6. 8Gb DDR4, U2-U3
  7. 512 Mbit QSPI flash memory, U7-U17
  8. Green User LED, D2
  9. B2B connector Samtec B2B connector Samtec Razor Beam, JM1
  10. Programmable clock generator, U10
  11. USB2.0 Transceiver,  U18
  12. B2B connector Samtec Razor Beam, JM3
  13. B2B connector Samtec Razor Beam, JM2
  14. 8 GByte eMMC memory, U6
  15. Lattice Semiconductor MachXO2 System Controller CPLD, U21

Additional assembly options are available for cost or performance optimization upon request.

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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titleInitial delivery state of programmable devices on the module

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Storage device name

Content

Notes

Dual QSPI Flash Memory

Not programmed


eMMC Memory

Not programmed


DDR4 SDRAMNot programmed
Programmable Clock GeneratorNot programmed
CPLD (LCMXO2-256HC)SC0820-02 QSPI FirmwareProgrammedTE0821 CPLD


Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.

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titleBoot process.

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MODE Pin

Boot Mode
LowHigh

QSPI*

HighLowSD Card*


*changable also with other CPLD Firmware: TE0821 CPLD.


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titleReset process.

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Signal

B2BI/ONote

EN

JM1-28InputCPLD Enable Pin


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titleGeneral PL I/O to B2B connectors information

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FPGA BankTypeB2B ConnectorI/O Signal CountVoltage LevelNotes
24HDJM224x I/O, 12x  LVDS PairsVariable Max voltage 3.3V
25HDJM1

24x I/O, 12x  LVDS Pairs

Variable Max voltage 3.3V
26HDJM124x I/O, 12x  LVDS PairsVariable Max voltage 3.3V
44HDJM224x I/O, 12x  LVDS PairsVariableMax voltage 3.3V
65

HP

JM2

18x I/O, 9x LVDS Pairs

VariableMax voltage 1.8V

65

HP

JM3

16x I/O, 8x LVDS Pairs

Variable

Max voltage 1.8V
505GTRJM316x I/O, 8x LVDS Pairs-4x lanes
505GTR CLKJM31x Diff Clock-

501

MIO

JM1

15 I/O

3.3V



For detailed information about the pin-out, please refer to the Pin-out table.

JTAG Interface

JTAG access to the Xilinx Zynq UltraScale+ is applicable by using Lattice MachXO CPLD  through B2B connector JM2.

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There are 4x MGT Lanes connected to FPGA Bank 505-GTR. The Xilinx Zynq UltraScale+ device used on the TE0821 module has 4 GTR transceivers. All 4 are wired directly to B2B connector JM3. MGT (Multi Gigabit Transceiver) lane consists of one transmit and one receive (TX/RX) differential pairs, four signals total per one MGT lane. Following table lists lane number, FPGA bank number, transceiver type, signal schematic name, board-to-board pin connection and FPGA pins connection:

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Lane

SchematicB2BNote
0
  • B505_RX0_P
  • B505_RX0_N
  • B505_TX0_P
  • B505_TX0_N
  • JM3-26
  • JM3-28
  • JM3-25
  • JM3-27

1
  • B505_RX1_P
  • B505_RX1_N
  • B505_TX1_P
  • B505_TX1_N
  • JM3-20
  • JM3-22
  • JM3-19
  • JM3-21

2
  • B505_RX2_P
  • B505_RX2_N
  • B505_TX2_P
  • B505_TX2_N
  • JM3-14
  • JM3-16
  • JM3-13
  • JM3-15

3
  • B505_RX2_P
  • B505_RX2_N
  • B505_TX2_P
  • B505_TX2_N
  • JM3-8
  • JM3-10
  • JM3-7
  • JM3-9


Gigabit Ethernet

On-board Gigabit Ethernet PHY is provided with Marvell Alaska 88E1512 chip. The Ethernet PHY RGMII interface is connected to the Zynq Ethernet0 PS GEM0. I/O voltage is fixed at 1.8V for HSTL signaling. SGMII (SFP copper or fiber) can be used directly with the Ethernet PHY, as the SGMII pins are available on the B2B connector JM3. The reference clock input of the PHY is supplied from an on-board 25MHz oscillator (U11), the 125MHz output clock is left unconnected.

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titleGigaBit Ethernet connection

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PinSchematicConnected toNote
MDIP0...3

PHY_MDI0...3

B2B, JM1


MDC

ETH_MDC

MIO76


MDIOETH_MDIOMIO77
S_INS_INB2B, JM3
S_OUTS_OUTB2B, JM3
TXD0..3ETH_TXD0...3MIO65...68
TX_CTRLETH_TXCTLMIO69
TX_CLKETH_TXCKMIO64
RXD0...3ETH_RXD0...3MIO71...74
RX_CTRLETH_RXCTLMIO75
RX_CLKETH_RXCKMIO70
LED0...2PHY_LED0...2FPGA Bank 66
RESETnETH_RSTMIO24

MIO Pins



System Controller CPLD

Special purpose pins are connected to System Controller CPLD and have following default configuration:

you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

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titleSystem Controller CPLD special purpose pins

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MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI
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titleMIOs pins

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MIO
Pin Name
Connected to
Mode
B2B
Function
Notes
0...5QSPI Flash, U7-SPI Flash
7...12QSPI Flash, U17-SPI Flash
13...23eMMC, U6
24ETH Transceiver, U8-ETH_RST
25USB2.0 Transceiver, U18-OTG_RST
26...33User MIOJM1
34...37N.C-N.C
38...39EEPROM, U25-I2C_SDA/SCL
40...45N.CN.C46...51SD CardJM152...63USB2.0 Transceiver, U18-63...77Ethernet Transceiver, U8-

Test Points

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Default Configuration
EN1InputPower Enable

No hard wired function on PCB. When forced low, PGOOD goes low without effect on power management

PGOODOutputPower GoodOnly indirect used for power status, see CPLD description
NOSEQ--No used for Power sequencing, see CPLD description
RESINInputReset

Active low reset, gated to POR_B

JTAGENInputJTAG SelectLow for normal operation, high for CPLD JTAG access


Please check the entire information at TE0821 CPLD.

USB Interface

USB PHY is provided by Microchip USB3320. The ULPI interface is connected to the Zynq PS USB0. I/O voltage is fixed at 1.8V. Reference clock input for the USB PHY is supplied by the on-board 52.00 MHz oscillator (U14). 

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 PHY PinZYNQ PinB2B NameNotes
ULPIMIO52..63-Zynq USB0 MIO pins are connected to the USB PHY.
REFCLK--52.00 MHz from on-board oscillator (U14).
REFSEL[0..2]--Reference clock frequency select, all set to GND selects 52.00 MHz.
RESETBMIO25-Active low reset.
CLKOUTMIO52-Connected to 1.8V, selects reference clock operation mode.
DP, DM-OTG_D_P, OTG_D_NUSB data lines routed to B2B connector JM3 pins 47 and 49.
CPEN-VBUS_V_ENExternal USB power switch active high enable signal, routed to JM3 pin 17.
VBUS-USB_VBUSConnect to USB VBUS via a series of resistors, see reference schematics, routed to JM3 pin 55.
ID-OTG_IDFor an A-device connect to ground, for a B-device left floating. routed from JM3 pin 23.


I2C Interface

On-board I2C devices are connected to MIO38 (SCL) and MIO39 (SDA) which are configured as I2C0 by default. Addresses for on-board I2C slave devices are listed in the table below:

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I2C DeviceI2C AddressNotes

Si5338A PLL

0x70-
EEPROM0x50-


MIO Pins

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titleTest Points Information

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3, SPI_SCK

J2QSPI
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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection



Designator
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titleOn board peripheralsMIOs pins

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MIO PinConnected toB2B
Chip/Interface
Notes
0...5QSPI Flash
, U7
, U17
EEPROM
-
U25DDR4 SDRAMU2,U3OscillatorsU32, U14, U11CPLDU21LEDsD1...3

Quad SPI Flash Memory

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

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anchorTable_OBP_SPI
titleQuad SPI interface MIOs and pins
SPI Flash
7...12QSPI Flash, U17-SPI Flash
13...23eMMC, U6

24ETH Transceiver, U8-ETH_RST
25USB2.0 Transceiver, U18-OTG_RST
26...33User MIOJM1
34...37N.C-N.C
38...39EEPROM, U25-I2C_SDA/SCL
40...45N.C
N.C
46...51SD CardJM1
52...63USB2.0 Transceiver, U18-
63...77Ethernet Transceiver, U8-


Test Points

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test PointSignalB2BNotes
10PWR_PL_OKJ2-120

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SCL
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MIO PinSchematicU25 PinNotes
MIO39I2C_SDASDAMIO38I2C_SCL



Designator
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Test PointSignalConnected to
MIO PinI2C Address
Notes
MIO38...390x50U25