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The Trenz Electronic TE0841 is a 4 x 5 cm SoM integrating AMD Kintex UltraScale, QSPI Flash for configuration and operation, DDR4 SDRAM and powerful switch-mode power supplies for all on-board voltages.
Numerous configurable I/Os are provided via B2B connectors. All Trenz Electronic 4 x 5 cm SoMs are mechanically compatible.
Refer to http://trenz.org/te0841-info for current online available documentation.
Storage device name | Content | Notes |
|---|---|---|
SPI Flash Memory | Not programmed | |
DDR4 SDRAM | Not programmed | |
System Controller | Firmware | Refer to TE0841 CPLD Firmware / TE0841 CPLD for more information. |
Programmable Clock Generator | Programmed | Refer to Programmable Clock Generator for more information. |
The programmable Clock Generator (Si5338A) is used to generate four different clocks from 25 MHz oscillator connected to pin IN3.
The Si5338 output frequency clocks are programmable by FPGA via I2C bus. Refer to TE0841 Reference Designs for more information.
| Clock Generator | CLK Output I Net Name I Destination Device.Pin | Default frequency in MHz | Notes |
|---|---|---|---|
| Input | IN3 | U3.3 | 25 | |
| Output | CLK0A/B | CLK1_P/N | U1C.R23 / U1C.P23 | 100 | Not programmed in SoM REV01. |
| CLK1A/B | CLK2_P/N | MGT_CLK1_P/N | U1K.V6 / U1K.V5 | 125 | ||
| CLK2B/B | CLK3_P/N | MGT_CLK3_P/N | U1K.AB6 / U1K.AB5 | 156.25 | ||
| CLK3A/B | CLK0_P/N | U1C.T24 / U1C.T25 | 156.25 | Not programmed in SoM REV01. |
Connector Type | Designator | Interface | IO count | Notes |
|---|---|---|---|---|
B2B | JM1 | MGT | 3x MGT (TX/RX) | |
B2B | JM3 | MGT | 5x MGT (TX/RX) | |
B2B | JM3 | MGT CLK | 2x DIFF | |
B2B | JM1 | IO HR | 48x SE / 24x DIFF | Bank 64 |
B2B | JM1 | IO HR | 8x SE / 1x DIFF | Bank 65 |
B2B | JM3 | IO HR | 4x SE / 2x DIFF | Bank 65 |
B2B | JM3 | IO HP | 16x SE / 8x DIFF | Bank 66 |
B2B | JM2 | IO HP | 50x SE / 24x DIFF | Bank 67 |
B2B | JM2 | IO HP | 18x SE / 9x DIFF | Bank 68 |
Test Point | Top | Bottom | Signal | Notes |
|---|---|---|---|---|
TP1 | x | PLL_SCL | ||
TP2 | x | PLL_SDA | ||
TP3 | x | 3.3VIN | ||
TP4 | x | PL_1V8 | ||
TP5 | x | B64_VCO | ||
TP6 | x | B66_VCO | ||
TP7 | x | B67_VCO | ||
TP8 | x | B68_VCO | ||
TP9 | x | VBAT_IN | ||
TP10 | x | VBATT | ||
TP11 | x | MGTAUX | ||
TP12 | x | GND | ||
TP13 | x | PROG_B | ||
TP14 | x | DONE | ||
TP15 | x | INIT_B | ||
TP16 | x | GND | ||
TP17 | x | PLL_SCL | ||
TP18 | x | PLL_SDA | ||
TP19 | x | PL_GT_1V42 | ||
TP20 | x | PL_GT_1V2 | ||
TP21 | x | DDR_2V5 | ||
TP22 | x | DDR_1V2 | ||
TP23 | x | 0.95V | ||
TP24 | x | MGTAVCC | ||
TP25 | x | MGTAVTT | ||
TP26 | x | VBATT | ||
TP27 | x | MGTAUX | ||
TP28 | x | AVCC | ||
TP29 | x | PROG_B | ||
TP30 | x | DONE | ||
TP31 | x | INIT_B | ||
TP32 | x | GND | ||
TP33 | x | PG_ALL | ||
TP34 | x | A_DDR4-TEN | ||
TP35 | x | VREFA | ||
TP36 | x | VREFA2 | ||
TP37 | x | B_DDR4-TEN |
Chip/Interface | Designator | Connected to | Notes |
|---|---|---|---|
FPGA | U1 |
| |
DDR4 SDRAM | U4 / U5 |
| |
QSPI Flash | U6 |
| |
Clock Generator | U2 |
| |
System Controller | U18 |
| Refer to TE0841 CPLD Firmware / TE0841 CPLD for more information. |
Oscillator | U3 |
| 25 MHz |
Oscillator | U11 |
| 200 MHz |
Oscillator | U20 |
| 25 MHz |
Signal Name | Connector.Pin | Direction 1) | Description |
|---|---|---|---|
| SC1 | JM1.32 | - | System Controller Signal 1. Firmware dependent 2) |
| SC2 | JM1.30 | INOUT | PGOOD Pin. Firmware dependent 2) |
| SC3 | JM1.28 | IN | Power Enable Pin. Firmware dependent 2) |
| SC4 | JM1.7 | - | System Controller Signal 4. Firmware dependent 2) |
I2C (SDA / SCL) | JM1.93 / JM1.95 | Signal dependent | FPGA design dependent 3) |
JTAGMODE | JM1.89 | IN | Select JTAG access between FPGA or System Controller. Firmware dependent 2) |
nRST_SC0 | JM2.18 | IN | SoM reset. Firmware dependent 2) |
JTAG (TMS / TDI / TDO / TCK) | JM2.93 / JM2.95 / JM2.97 / JM2.99 | Signal dependent |
1) Direction:
IN: Input from the point of view of this board.
OUT: Output from the point of view of this board.
2) Refer to TE0841 CPLD Firmware / TE0841 CPLD for more information.
3) Refer to TE0841 Reference Designs for more information.
Power Rail Name / Schematic Name | Connector.Pin | Direction 1) | Notes |
|---|---|---|---|
VIN | JM1.1 / JM1.3 / JM1.5 | IN | Main SoM supply |
3.3VIN | JM1.13 / JM1.15 | IN | Management supply |
3.3V | JM2.10 / JM2.12 / JM2.91 | OUT | Output to power external IO |
PL_1V8 | JM1.39 | OUT | Output to power external IO |
B64_VCO | JM1.9 / JM1.11 | IN | Bank 64 IO power supply |
B66_VCO | JM2.1 / JM2.3 | IN | Bank 66 IO power supply |
B67_VCO | JM2.7 / JM2.9 | IN | Bank 67 IO power supply |
B68_VCO | JM2.5 | IN | Bank 68 IO power supply |
VBAT_IN | JM1.79 | IN | Backup batterie power supply |
1) Direction:
| Sequence | Net name | Recommended Voltage Range | Pull-up/down | Description | Notes |
|---|---|---|---|---|---|
| 0 | - | - | - | Configuration SoM signal setup. | |
| 1 | 3.3VIN | 3.3 V ±5 % | - | Apply Management supply. | |
VIN | 3.3 V -3 % / +5 % | - | Apply main SoM supply. | ||
| 5.0 V ±5 % | - | ||||
| 2 | SC3 1) | - | - | Enable SoM system. | |
| 3 | SC2 1) | - | - | PGOOD signal shows that bank voltages can be supplied. | The SoMs internal power-on sequence is complete when these voltages reach their nominal values. |
| 4 | B64_VCO | 1.14 V to 3.4 V | - | Apply FPGA bank IO supplies. | |
B66_VCO | 0.95 V to 1.89 V | - | |||
B67_VCO | 0.95 V to 1.89 V | - | |||
B68_VCO | 0.95 V to 1.89 V | - |
1) Firmware dependent signal. Refer to TE0841 CPLD Firmware / TE0841 CPLD for more information.
These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.
4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.
When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height
| Order number | Connector on baseboard | compatible to | Mating height |
|---|---|---|---|
| 23836 | REF-189016-01 | LSHM-150-02.5-L-DV-A-S-K-TR | 6.5 mm |
| LSHM-150-03.0-L-DV-A-S-K-TR | LSHM-150-03.0-L-DV-A-S-K-TR | 7.0 mm | |
| 23838 | REF-189016-02 | LSHM-150-04.0-L-DV-A-S-K-TR | 8.0 mm |
| LSHM-150-06.0-L-DV-A-S-K-TR | LSHM-150-06.0-L-DV-A-S-K-TR | 10.0mm | |
| 26125 | REF-189017-01 | LSHM-130-02.5-L-DV-A-S-K-TR | 6.5 mm |
| LSHM-130-03.0-L-DV-A-S-K-TR | LSHM-130-03.0-L-DV-A-S-K-TR | 7.0 mm | |
| 24903 | REF-189017-02 | LSHM-130-04.0-L-DV-A-S-K-TR | 8.0 mm |
| LSHM-130-06.0-L-DV-A-S-K-TR | LSHM-130-06.0-L-DV-A-S-K-TR | 10.0mm |
The module can be manufactured using other connectors upon request.
The LSHM connector speed rating depends on the stacking height; please see the following table:
| Stacking height | Speed rating |
|---|---|
| 12 mm, Single-Ended | 7.5 GHz / 15 Gbps |
| 12 mm, Differential | 6.5 GHz / 13 Gbps |
| 5 mm, Single-Ended | 11.5 GHz / 23 Gbps |
| 5 mm, Differential | 7.0 GHz / 14 Gbps |
Current rating of Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).
| File | Modified | |
|---|---|---|
| PDF File hsc-report_lshm-lshm-05mm_web.pdf High speed test report | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File lshm_dv.pdf LSHM catalog page | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf Recommended layout and stencil drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf Technical drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File REF-189016-01.pdf Technical Drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File REF-189016-02.pdf Technical Drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File REF-189017-01.pdf Technical Drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File REF-189017-02.pdf Technical Drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File TC0923--2523_report_Rev_2_qua.pdf Design qualification test report | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File tc0929--2611_qua(1).pdf Shock and vibration report | Apr 07, 2016 by Thorsten Trenz | |
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Power Rail Name/ Schematic Name | Description | Min | Max | Unit |
|---|---|---|---|---|
VIN | Main SoM supply | -0.3 | 6.0 | V |
3.3VIN | Management supply | -0.3 | 3.4 | V |
B64_VCO | Bank 64 IO supply | -0.5 | 3.4 | V |
B66_VCO | Bank 66 IO supply | -0.5 | 2.0 | V |
B67_VCO | Bank 67 IO supply | -0.5 | 2.0 | V |
B68_VCO | Bank 68 IO supply | -0.5 | 2.0 | V |
VBAT_IN | Backup battery supply | -0.3 | 6.0 | V |
*) Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Condition". Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.
Trenz Electronic classifies modules into temperature range categories by subsumption of its component data (PCB, ICs, connectors, passive components). The temperature ranges are values for ambient air temperature and do not reflect the junction temperature of individual components.
The categories are:
Modules with commercial (C) temperature grade are equipped with components that cover at least the ambient temperature range of 0 °C to 70 °C.
Modules with extended (E) temperature grade are equipped with components that cover at least the ambient temperature range of 0 °C to 85 °C.
Modules with industrial (I) temperature grade are equipped with components that cover at least the ambient temperature range of -40 °C to 85 °C.
These categories do not take into account the entire custom system consisting of:
Customer SoC design. The allowed main SoC temperature range is specified from the vendor by junction temperature using corresponding classes (C, E, I). See vendor documentation.
Cooling solution, active and or passive cooling.
Climate or environmental conditions besides ambient temperature range.
Module orientation, neighbouring assemblies, neither other heat sources nor the SoC as heat source to other components.
Classification of the module can be locked up here: Article Number Information i.e.: TExxxx-xx-xx'I'xx, the 'I' indicates that all components are at least in Industrial temperature class.
The temperature of individual components should not exceed the specified range due to self-heating or heating by adjacent components. The actual operating temperature range will depend on the customer design, usage, environment and cooling solution. Consult Cooling Solutions for more information.
The following table aims to be generic for all variants. The voltage ranges are consistent across assembly variants, but exceptions are possible (custom request).
Module size: 40 mm × 50 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 8 mm.
| Trenz shop TE0841 overview page* | |
|---|---|
| English page | German page |
*) Module article name encoding table: Ultrascale+ and Ultrascale Kintex, Artix and Spartan based modules
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
| Date | Revision | Changes | Documentation Link |
|---|---|---|---|
| 2024-05 | 03 |
| |
| 2018-05 | 02 |
| |
| 2015-12 | 01 | 1. Initial revision 2. U1: changed schematic symbol. Next pins swapped to match same polarity order:
3. Net names changed (no electrical changes):
JM3: swapped signals B64_L6:
| REV01 |
Date | Revision | Contributors | Description |
|---|---|---|---|
| |||
2024-06-13 | v.72 | John Hartfiel |
|
2019-12-10 | v.71 | John Hartfiel |
|
| 2018-08-07 | v.69 | Ali Naseri |
|
| 2018-07-13 | v.68 | Ali Naseri |
|
2018-07-10 | v.58 | John Hartfiel |
|
2018-03-13 | v.57 | Jan Kumann, Ali Naseri |
|
| -- | all |
|
Table 18: Document change history
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