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Overview
The Trenz Electronic AM0010 module is an industrial grade module based on Xilinx.
Refer to http://trenz.org/AM0010-info for the current online version of this manual and other available documentation.
Key Features
- SoC
- Device: ZU1 / ZU2 / ZU3 / ZU4 / ZU5 1)
- Engine: CG / EG / EV 1)
- Speedgrade: -1 / -2 1)
- Temperature Range: Extended / Industrial 1)
- Package: SFVC784
- RAM/Storage
- 4 GByte DDR4 SDRAM with ECC 2)
- 8 GByte e.MMC 3)
- Optional HyperFlash 4)
- 2 x 64 MByte Serial Flash 5)
- EEPROM with MAC address
- On Board
- Gigabit Ethernet Transceiver
- USB Transceiver
- OPTIGA Trust M
- CryptoAuthentication
- Oscillator
- Analog Multiplexer
- Interface
- 2 x B2B Connector (ADM6)
up to 204 PL IO
up to 22 PS MIO
- 4 GTR
- 4 GTH (with ZU4 and higher)
- ETH, USB, I2C, JTAG, ...
- 2 x B2B Connector (ADM6)
- Power
- 5 V ... 12 V power supply via B2B Connector needed.
- Dimension
- 56.4 mm x 40 mm
- Notes
1) Please, take care of the possible assembly options. Furthermore, check whether the power supply is powerful enough for your FPGA design.
2) Up to 32 GByte are possible with a maximum bandwidth of 2400 MBit/s.
3) Up to 64 GByte are possible.
4) Up to 64 MByte are possible.
5) Up to 2 x 256 MByte are possible.
Block Diagram
Main Components
- FPGA, U1
- DDR4, U2, U3, U9, U12, U14
- eMMC, U17
- Quad SPI Flash, U6, U7
- Connector, J5, J6
- Ethernet Transceiver, U8
- HyperFlash, U16
- EEPROM, U15
- OPTIGA Trust M, U27
- CryptoAuthentication, U24
- USB Transceiver, U10
- Oscillator, U13, U14, U30, U31, U32
- Analog Multiplexer, U38
- Power Supply, U5, U11, U18, U19, U20, U21, U22, U23, U28
Initial Delivery State
Storage device name | Content | Notes |
---|---|---|
DDR4 SDRAM | not programmed | |
eMMC | not programmed | |
Quad SPI Flash | not programmed | |
HyperFlash | not programmed | |
EEPROM | not programmed besides factory programmed MAC address |
Signals, Interfaces and Pins
Connectors
Connector Type | Designator | Interface | IO CNT | Notes |
---|---|---|---|---|
B2B | J5 | HP | 104 SE / 48 DIFF | |
B2B | J5 | MGT PL | 4 x MGT (RX/TX) | |
B2B | J5 | MGT PL | 2 x MGT CLK | |
B2B | J5 | HD | 24 SE / 12 DIFF | |
B2B | J6 | HP | 52 SE / 24 DIFF | |
B2B | J6 | MGT PS | 4 x MGT (RX/TX) | |
B2B | J6 | MGT PS | 2 x MGT CLK | |
B2B | J6 | HD | 24 SE / 12 DIFF | |
B2B | J6 | MIO | 2 x I2C | |
B2B | J6 | MIO | 2 x UART | |
B2B | J6 | MIO | 2 x PERST | |
B2B | J6 | MIO | SDIO | |
B2B | J6 | MIO | JTAG | |
B2B | J6 | MIO | 4 x GPIO | |
B2B | J6 | ETH | ||
B2B | J6 | USB |
Test Points
Test Point | Signal | Notes |
---|---|---|
TP1 | PROG_B# | pulled-up to V_IO_CFG |
TP2 | VTT | |
TP3 | VTT | |
TP4 | VREFA | |
TP5 | VREFA | |
TP6 | 0.85V | |
TP7 | 0.85V | |
TP8 | DDR_1V2 | |
TP9 | DDR_1V2 | |
TP10 | MGTAVCC | |
TP11 | MGTAVCC | |
TP12 | DDR_2V5 | |
TP13 | DDR_2V5 | |
TP14 | PL_VCU_0V9 | |
TP15 | PL_VCU_0V9 | |
TP16 | 1.8V | |
TP17 | 1.8V | |
TP18 | 3.3V_SEQ | |
TP19 | 3.3V_SEQ | |
TP20 | 3.3V | |
TP21 | 3.3V |
On-board Peripherals
Chip/Interface | Designator | Connected To | Notes |
---|---|---|---|
DDR4 SDRAM | U2, U3, U9, U12, U14 | SoC - PS | |
eMMC | U17 | SoC - PS | |
Quad SPI Flash | U6, U7 | SoC - PS | Booting. |
Gigabit Ethernet Transceiver | U8 | SoC - PS | |
HyperFlash | U16 | SoC - PL | |
EEPROM | U15 | SoC - PS | |
OPTIGA Trust M | U27 | SoC - PS | |
CryptoAuthentication | U24 | SoC - PS | |
USB 2 Transceiver | U10 | SoC - PS | |
Oscillator | U13 | SoC - PS | 135 MHz |
Oscillator | U14 | SoC - PS | 100 MHz |
Oscillator | U30 | ETH PHY | 25 MHz |
Oscillator | U31 | USB PHY | 24 MHz |
Oscillator | U32 | SoC | 33 MHz |
Analog Multiplexer | U38 | SoC | Voltage measuring with Xilinx internal ADC. |
Configuration and System Control Signals
Connector.Pin | Signal Name | Direction1) | Description |
---|---|---|---|
J6.A59 | V_BAT | IN | Input voltage for VCC_PSBATT |
J6.B58 | RST_M2C# | OUT | Module reset for peripheral reset |
J6.C53 | DONE | OUT | FPGA PS_DONE-signal |
J6.C54 | MODE0 | IN | Boot mode selection |
J6.C55 | MODE1 | IN | Boot mode selection |
J6.C56 | MODE2 | IN | Boot mode selection |
J6.C57 | MODE3 | IN | Boot mode selection |
J6.C58 | PS_SRST# | IN | FPGA system reset |
J6.C59 | PS_POR# | IN | Power-on-reset status |
J6.D56 | DX_P | IN | Temperature sensing diode pin |
J6.D57 | DX_N | IN | Temperature sensing diode pin |
J6.D58 | PWR_EN | IN | Power Enable |
J6.D59 | PWR_GOOD | OUT | Power good status |
1) Direction:
- IN: Input from the point of view of this board.
- OUT: Output from the point of view of this board.
Power and Power-On Sequence
Power Rails
Power Rail Name/ Schematic Name | Connector.Pin | Direction1) | Notes |
---|---|---|---|
V_MOD1 | J5.A7 / J5.A15 / J5.A47 / J5.A55 / J5.B5 / J5.B11 / J5.B17 / J5.B45 / J5.B51 / J5.B57 / J6.C5 / J6.C11 / J6.C17 / J6.D7 / J6.D15 | IN | |
1.8V | J5.C7 / J5.C15 / J6.B7 / J6.B15 | OUT | |
V_IO_W01 | J5.D3 / J5.D17 | IN | |
V_IO_W3 | J5.D40 | IN | |
V_IO_W45 | J5.D43 / J5.D57 | IN | |
V_IO_X01 | J6.A3 / J6.A17 | IN | |
V_BAT | J6.A59 | IN | |
V_IO_X3 | J6.B35 | IN | |
3.3V | J6.B59 | OUT | |
V_IO_CFG | J6.C52 | IN |
1) Direction:
- IN: Input from the point of view of this board.
- OUT: Output from the point of view of this board.
Baseboard Design Hints (needs to be updated)
Priority | Net name | Voltage Range | Pull-up/down | Description | Notes | Pin |
---|---|---|---|---|---|---|
Preparation | TDI/TCK/TDO/TMS | V_IO_CFG | - | JTAG interface. | J6.D51, J6.D52, J6.D54, J6.D55 | |
Preparation | MODE0...3 | V_IO_CFG | - | Boot mode setup. Do not float. | Hardwiring possible. Consider debug options. Boot Mode options are descriped in AMD Xilinx documentation. | J6.C54, J6.C55, J6.C56, J6.C57 |
Preparation | DX_P / DX_N | - | - | MPSoC temperature measurement. | J6.D56, J6.D57 | |
1 | V_BAT | - | - | Battery connection. When not used, tie to GND. | Battery Power Domain usage. | J6.A59 |
2 | V_MOD1 | - | - | Power supply | Main module power supply. | see table "Module Power Rails" |
3 | PWR_EN | - | PU, 3.3 V | Power enable. | (Do not tie "PWR_EN" to VDD directly. This signal could be tied to GND within this module.) | J6.D58 |
4 | 3.3V / 1.8V | - | - | Module generated voltages. | see table "Module Power Rails" | |
5 | PWR_GOOD | - | PU, 3.3 V | Power good status. | J6.D59 | |
6 | V_IO_W01 / V_IO_W45 / V_IO_X01 / V_IO_W3 / V_IO_X3 / V_IO_CFG | - | - | Module bank voltages. | see table "Module Power Rails" | |
7 | DONE | V_IO_CFG | PU, V_IO_CFG (on module) | PL configuration monitoring. | This signal states the PL configuration according to AMD Xilinx documentation. | J6.C53 |
7 | PS_SRST# | V_IO_CFG | PU, V_IO_CFG | Module reset. | This signal initiate a system reset according to AMD Xilins documentation. | J6.C58 |
8 | PS_POR# | V_IO_CFG | PU, V_IO_CFG | Power-on reset. | Needs to held at zero until all PS power supplies meet voltage requirements and the PS_CLK reference is within specification. When deasserted the PS begins the boot process. | J6.C59 |
8 | RST_M2C# | V_IO_CFG | PU, 3.3 V | Baseboard peripheral reset. | This signals resets module peripheral and can / should be used for baseboard peripheral reset. | J6.B58 |
Board to Board Connectors
- ADM6-60-01.5-L-4-2 (compatible to ADF6-60-03.5-L-4-2), (240 pins, "60" per row)
The Andromeda carriers use Samtec AcceleRate HD High-Density on top side.
- ADF6-60-03.5-L-4-2 (compatible to ADF6-60-01.5-L-4-2), (240 pins, "60" per row)
Features
- Board-to-Board Connector 240-pins, 60 contacts per row
- 0.025" (0.635 mm) pitch
- Data Rate: max 56 Gbps
- Mates with: ADM6/APF6
- Insulator Material: LCP, Black
- Contact Material: Copper Alloy
- Plating: Au or Sn over 50 µ" (1.27 µm) N
- Operating Temperature Range: -55 ºC to +125 ºC
- PCIe 5.0 capable: Yes
- Lead-Free Solderable: Yes
- RoHS Compliant: Yes
Connector Mating height
When using the same type on baseboard, the mating height is 5mm. Other mating heights are possible by using connectors with a different height
Order number | Connector on baseboard | compatible to | Mating height |
---|---|---|---|
30095 | REF-30095 | ADM6-60-01.5-L-4-2 | 5 mm |
31137 | REF-31137 | ADF6-60-03.5-L-4-2 | 5 mm |
The module can be manufactured using other connectors upon request.
Connector Speed Ratings
The AcceleRate HD High-Density connector speed rating depends on the stacking height; please see the following table:
Stacking height | Speed rating |
---|---|
5 mm | 10/ 25/ 56 Gbps |
Current Rating
Current rating of Samtec AcceleRate HD High-Density B2B connectors is 1.34 A per pin (4 pins powered)
Connector Mechanical Ratings
- Shock: 100G, 6 ms Sine
- Vibration: 7.5G random, 2 hours per axis, 3 axes total
Manufacturer Documentation
File | Modified | |
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PDF File 20200225_hsc_adm6-xx-01p5-xxx-4-a_adf6-xx-03p5-xxx-4-a.pdf | 04 03, 2022 by ED | |
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PDF File adf6.pdf | 04 03, 2022 by ED | |
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PDF File adm6.pdf | 04 03, 2022 by ED | |
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PDF File adm6-xxx-xx.x-xxx-4-x-x-xr-mkt.pdf | 04 03, 2022 by ED | |
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PDF File adm6-xxx-xx.x-xxx-x-x-x-footprint.pdf | 04 03, 2022 by ED | |
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Technical Specifications
Absolute Maximum Ratings
Power Rail Name/ Schematic Name | Description | Min | Max | Unit |
---|---|---|---|---|
V_MOD1 | Main input power supply | -0.3 | 18 | V |
V_IO_W01 | HP FPGA Bank 65 voltage | -0.500 | 2.000 | V |
V_IO_W3 | HD FPGA Bank 24 voltage | -0.500 | 3.400 | V |
V_IO_W45 | HP FPGA Bank 64 voltage | -0.500 | 2.000 | V |
V_IO_X01 | HP FPGA Bank 66 voltage | -0.500 | 2.000 | V |
V_BAT 1) | FPGA Battery Voltage | 6 | V | |
V_IO_X3 | HD FPGA Bank 24 voltage | -0.500 | 3.400 | V |
V_IO_CFG | PS FPGA Bank 501 and 503 Voltage | -0.3 | 3.630 | V |
1) It is possible to use a resistor instead of the LDO but then, consider the different min (-0.500 V) / max (2.000 V) values.
Recommended Operating Conditions
This TRM is generic for all variants. Temperature range can be differ depending on the assembly version. Voltage range is mostly the same during variants (exceptions are possible, depending on custom request)
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
- Variants of modules are described here: Article Number Information
- Modules with commercial temperature grade are equipped with components that cover at least the range of 0°C to 75°C
- Modules with extended temperature grade are equipped with components that cover at least the range of 0°C to 85°C
- Modules with industrial temperature grade are equipped with components that cover at least the range of -40°C to 85°C
- The actual operating temperature range will depend on the FPGA / SoC design / usage and cooling and other variables.
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
V_MOD1 | 4.5 | 16 | V | See TPS54A24 and FS1406 datasheets. |
V_IO_W01 | 0.950 | 1.900 | V | See FPGA datasheet. |
V_IO_W3 | 1.140 | 3.400 | V | See FPGA datasheet. |
V_IO_W45 | 0.950 | 1.900 | V | See FPGA datasheet. |
V_IO_X01 | 0.950 | 1.900 | V | See FPGA datasheet. |
V_BAT 1) | 2.0 | 5.5 | V | See AP7354D datasheet. |
V_IO_X3 | 1.140 | 3.400 | V | See FPGA datasheet. |
V_IO_CFG | 1.710 | 3.465 | V | See FPGA datasheet. |
1) Using a resistor instead of the LDO is possible which leads to different min (1.2 V) / max (1.89 V) values.
Physical Dimensions
Module size: 56.4 mm × 40 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 5 mm.
PCB thickness: 2 mm.
Currently Offered Variants
Trenz shop AM0010 overview page | |
---|---|
English page | German page |
Revision History
Hardware Revision History
Date | Revision | Changes | Documentation Link |
---|---|---|---|
- | REV01 | First Production Release | REV01 |
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
Document Change History
Date | Revision | Contributor | Description |
---|---|---|---|
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Disclaimer
Data Privacy
Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy
Document Warranty
The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.
Limitation of Liability
In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.
Copyright Notice
No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.
Technology Licenses
The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.
Environmental Protection
To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.
REACH, RoHS and WEEE
REACH
Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).
RoHS
Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.
WEEE
Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).
Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.
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