TE0729 TRM

Table of Contents

Overview

The Trenz Electronic TE0729 is an industrial-grade SoM (System on Module) based on Xilinx Zynq-7000 SoC (XC7Z020).

This SoM has following peripherals on board:

• 1 x Gbps Ethernet PHY transceiver
• 2 x 100 Mbps Ethernet PHY transceivers
• 512 MByte DDR3 Memory
• 32 MByte SPI Flash Memory
• eMMC (4 GByte in standard configuration)
•  USB PHY transceiver
• powerful switch-mode power supplies for all on-board voltages
• large number of configurable I/Os is provided via rugged high-speed stacking strips

Key Features

• Industrial-grade Xilinx Zynq-7000 (XC7Z020) SoM
• Rugged for shock and high vibration
• 2 x ARM Cortex-A9
• 1 x 10/100/1000 Mbps Ethernet transceiver PHY
• 2 x 10/100 Mbps Ethernet transceiver PHYs
• 3 x MAC-Address EEPROMs
• 16-Bit wide 512 MByte DDR3 SDRAM
• 32 MByte QSPI-Flash-Memory
• 4 GByte e-NAND-Flash-Memory (embedded eMMC Memory)
• USB 2.0 high-speed ULPI transceiver
• Plug-on module with 2 x 120-pin high-speed hermaphroditic strips
• 136 FPGA I/Os (58 LVDS pairs possible) and 6 PS MIOs available on board-to-board connectors
• On-board high-efficiency DC-DC converters
  • 4.0 A x 1.0 V power rail
  • 1.5 A x 1.5 V power rail
  • 1.5 A x 1.8 V power rail
  • 1.5 A x 2.5 V power rail
• System management
• eFUSE bit-stream encryption
• AES bit-stream encryption
• Temperature compensated RTC (real-time clock)
• User LED
• Evenly-spread supply pins for good signal integrity

Assembly options for cost or performance optimization available upon request.

Signals, Interfaces and Pins

System Controller I/O Pins

Special purpose pins used by TE0729

Boot Modes

TE0729 supports primary boot from

• JTAG
• SPI Flash
• SD Card

Boot from on-board eMMC is also supported as secondary boot (FSBL must be loaded from SPI Flash).

The boot modes are controlled by the Pins 'BOOT1' and 'BOOT2' on the board to board (B2B) connector.

JTAG

JTAG access to the Xilinx Zynq-7000 device is provided by connector J2.

Clocking

Processing System (PS) Peripherals

Default MIO mapping:

I2C Interface

The on-board I2C components are connected to MIO10 and MIO11 and configured as I2C0 by default.

I2C addresses for on-board components:

B2B I/O

Number of I/O's connected to the SoC's I/O bank and B2B connector:

For detailed information about the pin out, please refer to the Master Pinout Table.

Peripherals

LED's

 There are 3 LED's on TE0729:

Ethernet

 The TE0729 is equipped with a Marvell Alaska 88E1512 Gigabit Ethernet PHY (U3). The Ethernet PHY RGMII Interface is connected to the Zynq Ethernet0 PS GEM0. The I/O Voltage is fixed at 1.8V for HSTL signaling. 

SGMII (SFP copper or fiber) can be used directly with the Ethernet PHY, as the SGMII pins are available on the B2B connector J2.

The reference clock input of the PHY is supplied from an on board 25MHz oscillator (U10).

PHY connection:

USB

The USB PHY USB3320 from Microchip is used on the TE0729. The ULPI interface is connected to the Zynq PS USB0. The I/O Voltage is fixed at 1.8V.

The reference clock input of the PHY is supplied from an on board 52MHz oscillator (U12).  

PHY connection:

The schematic for the USB connector and required components is different depending on the USB usage. USB standard A or B connectors can be used for Host or Device modes. A Mini USB connector can be used for USB Device mode. A USB Micro connector can be used for Device mode, OTG Mode or Host Mode.

RTC

An Intersil temperature compensated real time clock IC ISL12020MIRZ is used for timekeeping (U22). Battery voltage must be supplied to the module from the main board.

Battery backed registers are accessed at I2C slave address ???.

General purpose RAM is accessed at I2C slave address ???.

This RTC IC is supported in Linux so it can be used as hwclock device.

MAC-Address EEPROMs

Three Microchip 24AA025E48 EEPROMs (U8, U9, U20) are used on the TE0729. They contain globally unique 48-bit node addresses, that are compatible with EUI-48(TM) and EUI-64(TM). The devices are organized as two blocks of 128 x 8-bit memory. One of those blocks stores the 48-bit node address and is write protected, the other block is available for application use. It is accessible through the I2C slave address 0x50 for MAC-Address1 (U8), 0x81 for MAC-Address1 (U9), 0x82 for MAC-Address1 (U20).

Power

For startup, a power supply with minimum current capability of 3A is recommended.

VIN and 3.3VIN can be connected to the same source (3.3 V).

Power Supplies

Bank Voltages

Initial Delivery state

Hardware Revision History

Technical Specification

Absolute Maximum Ratings

Recommended Operating Conditions

Physical Dimensions

• Module size: 50 mm × 40 mm.  Please download the assembly diagram for exact numbers.

• Mating height with standard connectors: 8mm

• PCB thickness: 1.6mm

• Highest part on PCB: approx. 2.5?? mm. Please download the step model for exact numbers.

All dimensions are shown in mm.

Temperature Ranges

Commercial grade modules

All parts are at least commercial temperature range of 0°C to +70°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Industrial grade modules

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Weight

Document Chance History

Disclaimer

Document Warranty

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Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

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WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment.

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