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Table of Contents

Overview

The Trenz Electronic TE0729 is an industrial-grade SoM (System on Module) based on Xilinx Zynq-7000 SoC (XC7Z020).

This SoM has following peripherals on board:

  • 1 x Gbps Ethernet PHY transceiver
  • 2 x 100 Mbps Ethernet PHY transceivers
  • 512 MByte DDR3 Memory
  • 32 MByte SPI Flash Memory
  • eMMC (4 GByte in standard configuration)
  •  USB PHY transceiver
  • powerful switch-mode power supplies for all on-board voltages
  • large number of configurable I/Os is provided via rugged high-speed stacking strips

Key Features

  • Industrial-grade Xilinx Zynq-7000 (XC7Z020) SoM
  • Rugged for shock and high vibration
  • 2 x ARM Cortex-A9
  • 1 x 10/100/1000 Mbps Ethernet transceiver PHY
  • 2 x 10/100 Mbps Ethernet transceiver PHYs
  • 3 x MAC-Address EEPROMs
  • 16-Bit wide 512 MByte DDR3 SDRAM
  • 32 MByte QSPI-Flash-Memory
  • 4 GByte e-NAND-Flash-Memory (embedded eMMC Memory)
  • USB 2.0 high-speed ULPI transceiver
  • Plug-on module with 2 x 120-pin high-speed hermaphroditic strips
  • 136 FPGA I/Os (58 LVDS pairs possible) and 6 PS MIOs available on board-to-board connectors
  • On-board high-efficiency DC-DC converters
    • 4.0 A x 1.0 V power rail
    • 1.5 A x 1.5 V power rail
    • 1.5 A x 1.8 V power rail
    • 1.5 A x 2.5 V power rail
  • System management
  • eFUSE bit-stream encryption
  • AES bit-stream encryption
  • Temperature compensated RTC (real-time clock)
  • User LED
  • Evenly-spread supply pins for good signal integrity

Assembly options for cost or performance optimization available upon request.

Signals, Interfaces and Pins

System Controller I/O Pins

Special purpose pins used by TE0729

NameNote
NRST 
NRST_IN 

Boot Modes

TE0729 supports primary boot from

  • JTAG
  • SPI Flash
  • SD Card

Boot from on-board eMMC is also supported as secondary boot (FSBL must be loaded from SPI Flash).

The boot modes are controlled by the Pins 'BOOT1' and 'BOOT2' on the board to board (B2B) connector.

BOOTMODE1

BOOTMODE2Boot mode
LOWLOW 
LOWHIGH 
HIGHLOW 
HIGHHIGH 

JTAG

JTAG access to the Xilinx Zynq-7000 device is provided by connector J2.

SignalB2B Pin
TCKJ2:  119
TDIJ2:  115
TDOJ2:  117
TMSJ2:  113

JTAGSEL pin in J2 should be kept low or grounded for normal operation.

Clocking

ClockFrequencyICFPGANotes
PS CLK33.3333 MHzU14PS_CLKPS Subsystem main clock
10/100/1000 Mbps ETH PHY reference25 MHzU10- 
USB PHY reference52 MHzU12- 

Processing System (PS) Peripherals

PeripheralICDesignatorPSMIONotes
EEPROM I2C24AA025E48T-I/OTU8I2C0MIO10, MIO11MAC Address
EEPROM I2C24AA025E48T-I/OTU9I2C0MIO10, MIO11MAC Address
EEPROM I2C24AA025E48T-I/OTU20I2C0MIO10, MIO11MAC Address
RTCISL12020MIRZU22I2C0MIO10, MIO11Temperature compensated real time clock
RTC InterruptISL12020MIRZU22GPIOMIO46Real Time Clock Interrupt
SPI FlashS25FL256SAGBHI20U13QSPI0MIO1..MIO6 
Ethernet0 10/100/1000 Mbps PHY88E1512-A0-NNP2I000U3ETH0MIO16...MIO27 
Ethernet0 10/100/1000 Mbps PHY Reset  GPIOMIO51 
Ethernet1 10/100 Mbps PHYKSZ8081MLXCAU17-(EMIO) 
Ethernet1 10/100 Mbps PHY Reset  -(EMIO) 
Ethernet2 10/100 Mbps PHYKSZ8081MLXCAU19-(EMIO) 
Ethernet2 10/100 Mbps PHY Reset  -(EMIO) 
USBUSB3320C-EZKU11USB0MIO28...MIO39 
USB Reset  GPIOMIO49 
 e-MMC (embedded e-MMC)MTFC4GMVEA-4M IT  U5SDIO0MIO40...MIO45depending on state of pin MIO48 'SEL_SD'

Default MIO mapping:

MIOConfigured asB2BNotes
0GPIO J2-87 B2B
1QSPI0 -SPI Flash-CS
2QSPI0 -SPI Flash-DQ0
3QSPI0 -SPI Flash-DQ1
4QSPI0 -SPI Flash-DQ2
5QSPI0 -SPI Flash-DQ3
6QSPI0 -SPI Flash-SCK
7GPIO -Red LED D8
8 - - -
9GPIOJ2-88B2B
10I2C0 SDAJ2-90B2B 
11I2C0 SCLJ2-92B2B
12I2C1 SDAJ2-93 B2B (SDA on-board I2C, also configurable as GPIO by user)
13I2C1 SCLJ2-95 B2B (SCL on-board I2C, also configurable as GPIO by user)
14USART0 RXJ2-94B2B (RX on-board UART, also configurable as GPIO by user)
15USART0 TXJ2-96B2B (TX on-board UART, also configurable as GPIO by user)
16..27ETH0 RGMII
28..39USB0 ULPI
40SDIO0J2-100 B2B depending on state of pin MIO48 'SEL_SD'
41SDIO0J2-102 B2B depending on state of pin MIO48 'SEL_SD'
42SDIO0J2-104 B2B depending on state of pin MIO48 'SEL_SD'
43SDIO0J2-106 B2B depending on state of pin MIO48 'SEL_SD'
44SDIO0J2-108 B2B depending on state of pin MIO48 'SEL_SD'
45SDIO0J2-110 B2B depending on state of pin MIO48 'SEL_SD'
46GPIO-RTC Interrupt
47
48 GPIOSEL_SDselect source between e-MMC / baseboard SD-Card 
49GPIO -USB Reset
50GPIO -ETH0 Interrupt
51GPIO -ETH0 Reset
52ETH0 -MDC

53

ETH0 -MDIO

I2C Interface

The on-board I2C components are connected to MIO10 and MIO11 and configured as I2C0 by default.

I2C addresses for on-board components:

DeviceI2C-AddressNotes
EEPROM for MAC10x50 
EEPROM for MAC20x81 
EEPROM for MAC30x82 
RTC  
Battery backed RAM integrated in RTC

B2B I/O

Number of I/O's connected to the SoC's I/O bank and B2B connector:

BankTypeJxIO countIO VoltageNotes
500MIO

J2-87

J2-88

23,3 VMIO0, MIO9
500MIO

J2-93

J2-95

J2-94

J2-96

43,3 V

configured as I2C1 and USART0 by default,

configurable as GPIO by user

13HRJ148user 
33HRJ148user 
35HRJ2303,3 V 
34GPIOJ2102,5 V

configured as DISP_RX by default,

configurable as GPIO by user

For detailed information about the pin out, please refer to the Master Pinout Table.

Peripherals

LED's

 There are 3 LED's on TE0729:

LEDColorConnected toNotes
D1redSystem ControllerGlobal Status LED
D2greenDONEInverted DONE, ON when FPGA not configured
D8redMIO7OFF when PS7 not booted and not controlling MIO7 by software, else user controlled

LED D2 is connected to the FPGA Done pin and will go off as soon as PL is configured.

This LED will not operate if the System Controller can not power on the 3.3V output rail that also powers the 3.3V circuitry on the module.

Ethernet

 The TE0729 is equipped with a Marvell Alaska 88E1512 Gigabit Ethernet PHY (U3). The Ethernet PHY RGMII Interface is connected to the Zynq Ethernet0 PS GEM0. The I/O Voltage is fixed at 1.8V for HSTL signaling. 

SGMII (SFP copper or fiber) can be used directly with the Ethernet PHY, as the SGMII pins are available on the B2B connector J2.

The reference clock input of the PHY is supplied from an on board 25MHz oscillator (U10).

PHY connection:

PHY PINZYNQ PSZYNQ PLNotes
MDC/MDIOMIO52, MIO53--
LED0--pin J2-57 in B2B connector
LED1--pin J2-59 in B2B connector
LED2/InterruptMIO46--
CONFIG--Pin connected to GND, PHY Address is strapped to 0x00 by default
RESETnMIO51--
RGMIIMIO16..MIO27--
SGMII--on B2B J2 connector
MDI--on B2B J2 connector

USB

The USB PHY USB3320 from Microchip is used on the TE0729. The ULPI interface is connected to the Zynq PS USB0. The I/O Voltage is fixed at 1.8V.

The reference clock input of the PHY is supplied from an on board 52MHz oscillator (U12).  

PHY connection:

PHY PinZynq PinB2B NameNotes
ULPIMIO28..39-Zynq USB0 MIO pins are connected to the PHY
REFCLK--52MHz from on board oscillator (U12)
REFSEL[0..2]--000 GND, select 52MHz reference Clock
RESETBMIO49-Active low reset
CLKOUTMIO36-Connected to 1.8V selects reference clock operation mode
DP,DM-OTG_D_P, OTG_D_NUSB Data lines
CPEN-VBUS_V_ENExternal USB power switch active high enable signal
VBUS-USB_VBUSConnect to USB VBUS via a series resistor. Check reference schematic
ID-OTG_IDFor an A-Device connect to ground, for a B-Device left floating

The schematic for the USB connector and required components is different depending on the USB usage. USB standard A or B connectors can be used for Host or Device modes. A Mini USB connector can be used for USB Device mode. A USB Micro connector can be used for Device mode, OTG Mode or Host Mode.

RTC

An Intersil temperature compensated real time clock IC ISL12020MIRZ is used for timekeeping (U22). Battery voltage must be supplied to the module from the main board.

Battery backed registers are accessed at I2C slave address ???.

General purpose RAM is accessed at I2C slave address ???.

This RTC IC is supported in Linux so it can be used as hwclock device.

MAC-Address EEPROMs

Three Microchip 24AA025E48 EEPROMs (U8, U9, U20) are used on the TE0729. They contain globally unique 48-bit node addresses, that are compatible with EUI-48(TM) and EUI-64(TM). The devices are organized as two blocks of 128 x 8-bit memory. One of those blocks stores the 48-bit node address and is write protected, the other block is available for application use. It is accessible through the I2C slave address 0x50 for MAC-Address1 (U8), 0x81 for MAC-Address1 (U9)0x82 for MAC-Address1 (U20).

Power

For startup, a power supply with minimum current capability of 3A is recommended.

VIN and 3.3VIN can be connected to the same source (3.3 V).

Power Supplies

Vin

3.3 V to 5.5 V

Typical 200 mA, depending on customer design and connections

Vin 3.3V

3.3 V

Typical 50 mA, depending on customer design and connections

Bank Voltages

BankVoltagemax. Valuenote
5011,8 V-ETH0 / USB0 / SDIO0
5003,3 V-SPI / I2C / UART
5021,5 V-DDR3-RAM
13user3,3 Vconnected to 3,3V by default by 0 Ohm Resistor R36
33user3,3 Vconnected to 3,3V by default by 0 Ohm Resistor R55
342,5 V-ETH / DISP
353,3 V-GPIO

Initial Delivery state

Storage device nameContentNotes

24AA025E48 EEPROMs

User content not programmed

Valid MAC Address from manufacturer
e-MMC Flash-MemoryEmpty, not programmedExcept serial number programmed by flash vendor

SPI Flash OTP Area

Empty, not programmed

Except serial number programmed by flash vendor

SPI Flash Quad Enable bit

Programmed

 

SPI Flash main array

demo design

 

EFUSE USER

Not programmed

 

EFUSE Security

Not programmed

 

Hardware Revision History

RevisionChanges

01

Prototypes

02First production release

Technical Specification

Absolute Maximum Ratings

ParameterMinMaxUnitsNotes

Vin supply voltage

-0.3

6.0

V

 

Vin33 supply voltage

-0.4

3.6

V

 
VBat supply voltage-16.0V 
PL IO Bank supply voltage for HR I/O banks (VCCO)-0.53.6V 
I/O input voltage for HP I/O banks-0.55VCCO_X+0.55VTE0729 does not have HP banks

Voltage on Module JTAG pins

-0.4

VCCO_0+0.55

V

VCCO_0 is 3.3V nominal

Storage Temperature

-40

+85

C

 
Storage Temperature without the ISL12020MIRZ-55+100C 
Assembly variants for higher storage temperature range on request
Please check Xilinx Datasheet for complete list of Absolute maximum and recommended operating ratings for the Zynq device (DS181 Artix or DS182 Kintex).

Recommended Operating Conditions

ParameterMinMaxUnitsNotesReference document
Vin supply voltage2.55.5V  
Vin33 supply voltage3.1353.465V  
VBat supply voltage2.75.5V  
PL IO Bank supply voltage for HR I/O banks (VCCO)1.143.465V Xilinx document DS191
I/O input voltage for HR I/O banks(*)(*)V(*) Check datasheetXilinx document DS191 and DS187
Voltage on Module JTAG pins3.1353.465VVCCO_0 is 3.3 V nominal 

Physical Dimensions

  • Module size: 50 mm × 40 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 8mm

  • PCB thickness: 1.6mm

  • Highest part on PCB: approx. 2.5?? mm. Please download the step model for exact numbers.

All dimensions are shown in mm.

Temperature Ranges

Commercial grade modules

All parts are at least commercial temperature range of 0°C to +70°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Industrial grade modules

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Weight

?? g

Plain module

?? g

Set of bolts and nuts

Document Chance History

daterevisionauthorsdescription
206-06-14v10Ali Naseriinitial release

Disclaimer

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The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

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Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

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Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet.

According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products.

Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

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Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment.

Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

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