Table of Contents
Overview
The Trenz Electronic TE0722-02 is a DIPFORTy1 "Soft Propeller" based on the Xilinx Zynq-7000 SoC.
Key Features
- Xilinx Zynq XC7Z010 SoC
- Dual-core ARM A9+ (TE0722-02-07S-1C variant has single-core ARM A9+)
- 16 MByte quad SPI Flash
- Micro SD Card socket with card detect signal
- 34 I/Os on DIP40 header pins
- System status LED (DONE)
- RGB LED connected to PL I/O
- Green user LED connected to ARM CPU GPIO
- Proximity and ambient light sensor
- DIP40 form factor (size 18 x 51 mm)
Additional assembly options are available for cost or performance optimization upon request.
Block Diagram
Figure 1: TE022-02 block diagram.
Main Components
Figure 2: TE0722-02 PCB top side.
Figure 3: TE0722-02 PCB bottom side.
- Xilinx Zynq XC7Z010 or Zynq XC7Z007S SoC, U1
- Micro SD card socket with card detect, J8
- Red LED, D3
- Green LED, D2
- Red LED, D6
- 20-pin connector placeholder, P1
- Red LED, D5
- Proximity/ambient light sensor, U4
- RGB LED, D4
- Red LED, D1
- 20-pin connector placeholder, P2
- Ultra-low supply-current voltage monitor, U4
- 2 x 5-pin connector placeholder, J1
- 2 x 5-pin connector placeholder, J2
- 2 x 5-pin connector placeholder, J3
- 16 MByte QSPI Flash memory, U5
- Low-power programmable oscillator @ 33.333333 MHz, U8
- 1A PowerSoC DC-DC converter (1.0V), U2
- 1A PowerSoC DC-DC converter (1.8V), U3
Initial Delivery State
Storage device name | Content | Notes |
|---|---|---|
Quad SPI Flash | Empty |
Table 1: .
Boot Process
By default the ... supports QSPI and SD Card boot modes which is controlled by the MODE input signal from the B2B connector JM..
High or open | SD Card |
Low or ground | QSPI Interface |
Table 2: Selecting power-on boot device.
Signals, Interfaces and Pins
I/O Signals
Overview of the PL I/O banks signals routed to the external connectors:
| Bank | Type | Connector | I/O Signal Count | Voltage | Notes |
|---|---|---|---|---|---|
| 34 | HR | P1 | 8 | 3.3V | P0 - P7 |
| 34 | HR | P2 | 8 | 3.3V | P24 - P31 |
| 34 | HR | P2 | 10, 5 LVDS pairs | 3.3V | |
| 34 | HR | J1 | 6 | 3.3V | X2A - X2F |
| 34 | HR | J2 | 2 | 3.3V | |
| 34 | HR | J3 | 4 | 3.3V | X1A - X1D |
| 35 | HR | P1 | 8, 4 LVDS pairs | 3.3V |
Table 3: Zynq SoC PL I/O signals overview.
JTAG Interface
JTAG access to the Xilinx ZYNQ XC7Z010 SoC is provided through J2 connector.
JTAG Signal | J2 Connector Pin |
|---|---|
| TCK | 4 |
| TDI | 9 |
| TDO | 10 |
| TMS | 8 |
Table 4: JTAG interface signals.
Quad SPI Interface
Quad SPI Flash (U5) is connected to the Zynq SoC PS QSPI0 interface via PS MIO bank 500, pins MIO1 ... MIO6.
| Zynq SoC's MIO | Signal Name | U5 Pin |
|---|---|---|
| 1 | SPI0-CS | 1 |
| 2 | SPI0-DQ0/M0 | 5 |
| 3 | SPI0-DQ1/M1 | 2 |
| 4 | SPI0-DQ2/M2 | 3 |
| 5 | SPI0-DQ3/M3 | 7 |
| 6 | SPI0-SCK | 6 |
Table 5: Quad SPI interface signals and connections.
SD Card Interface
TE0722 module has on-board 3.3V SD Card socket (J8) with card detect switch wired to the Zynq SoC PS MIO bank 501, pins MIO28 .. MIO33 and MIO49.
| Zynq SoC's MIO | Connected To | Signal Name |
|---|---|---|
| 28 | J8-7 | DAT0 |
| 29 | J8-3 | CMD |
| 30 | J8-5 | CLK |
| 31 | J8-8 | DAT1 |
| 32 | J8-1 | DAT2 |
| 33 | J8-2 | CD/DAT3 |
| 49 | J8-G4 | Card detect switch |
Table 6: SD card interface signals.
I2C Interface
I2C interface pins SCL and SDA from the Zynq SoC PL bank 34 are connected to the connector J1. There are no on-board I2C slave devices.
| Zynq SoC's MIO | Connected To | Signal Name |
|---|---|---|
| MIO36 | U4-2 | SCL |
| MIO37 | U4-1 | SDA |
Table 7: Zynq SoC I2C interface signals.
Default PS MIO Mapping
| MIO | Function | Connector Pin | Notes |
|---|---|---|---|
| 7 | GPIO | - | Green LED D2 |
| 39 | GPIO | - | Si1143 INT pin |
Table 8: .
On-board Peripherals
Quad SPI Flash Memory
Proximity and Ambient Light Sensor
Oscillators
On-board LEDs
| LED | Color | Connected To | Description and Notes |
|---|---|---|---|
| D1 | Red | LED2, U4 | |
| D2 | Green | MIO7, U1 | User controlled, default OFF (when PS7 has not been booted). |
| D3 | Red | LED1, U4 | |
| D4 | RGB | RGB_R, U1 RGB_G, U1 RGB_B, U1 | |
| D5 | Red | LED3, U4 | |
D6 | Green | DONE, U1 | Reflects inverted DONE signal. ON when FPGA is not configured, OFF as soon as PL configuration is finished. |
Table 9: .
Power and Power-On Sequence
Power Consumption
Power supply with minimum current capability of 1A for system startup is recommended. The maximum power consumption of the module mainly depends on the design running on the Zynq SoC's FPGA.
Xilinx provide a power estimator excel sheets to calculate power consumption. It is also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.
Typical power consumption is to be determined.
Power-On Sequence
... diagram will be here soon ...
Variants Currently in Production
| Module Variant | Xilinx Zynq SoC | ARM Cores | PL Cells | LUTs | Flip-Flops | Block RAM | DSP Slices | Operating Temperature | Temperature Range |
|---|---|---|---|---|---|---|---|---|---|
| TE0722-02I | XC7Z010-1CLG225I | Dual-core | 28K | 17,6K | 35,2K | 2.1 MBytes | 80 | –40°C to +85°C | Industrial |
| TE0722-02 | XC7Z010-1CLG225C | Dual-core | 28K | 17,6K | 35,2K | 2.1 MBytes | 80 | 0°C to +70°C | Commercial |
| TE0722-02-07S-1C | XC7Z007S-1CLG225C | Single-core | 23K | 14,4K | 28,8K | 1.8 MBytes | 66 | 0°C to +70°C | Commercial |
Table 8: Module variants.
Technical Specifications
Absolute Maximum Ratings
Parameter | Min | Max | Units | Reference Document |
|---|---|---|---|---|
VIN supply voltage | -0.5 | 3.6 | V | Xilinx datasheet DS187, "Zynq-7000 All Programmable SoC: DC and AC Switching Characteristics". |
Storage temperature | -40 | +85 | °C | Silicon Labs Si1141/42/43 datasheet. |
Table 9: Module absolute maximum ratings.
Recommended Operating Conditions
| Parameter | Min | Max | Units | Reference Document |
|---|---|---|---|---|
| Supply voltage | 1.14 | 3.465 | V | Xilinx datasheet DS187, "Zynq-7000 All Programmable SoC: DC and AC Switching Characteristics". |
Table 10: Module recommended operating conditions.
Assembly variants for higher storage temperature range are available on request.
Physical Dimensions
Module size: 18 mm × 51 mm. Please download the assembly diagram for exact numbers.
PCB thickness: 1.6 mm.
Highest part on PCB approx. 4 mm. Please download the step model for exact numbers.
All dimensions are given in millimeters.
Figure 4: TE0722-02 physical dimensions.
Operating Temperature Ranges
Commercial grade: 0°C to +70°C.
Industrial grade: -40°C to +85°C.
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Revision History
Hardware Revision History
| Date | Revision | Notes | PCN | Documentation Link |
|---|---|---|---|---|
| 2015-10-23 | 02 | TE0722-02 | ||
01 |
|
Table 11: TE0722 module hardware revision history.
Hardware revision number is printed on the PCB board together with the module model number separated by the dash.
Figure 5: TE0722 module hardware revision number.
Document Change History
Date | Revision | Contributors | Description |
|---|---|---|---|
Jan Kumann | Initial document. |
Table 12: Document change history.
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