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Table of Contents

Overview

 

The Trenz Electronic TEC0330 FPGA board is a PCI Express form factor card (PCIe 2.0 or higher) integrating the Xilinx Virtex-7 XC7VX330T FPGA chip. This high-end FPGA card is designed for maximum system performance and intended for use in applications with high demands on system throughput. There is a SO-DIMM socket on the board for standard DDR3 SDRAM extension memory module.

The TEC0330 features HPC (High Pin Count) ANSI/VITA 57.1 compatible FMC interface connector for standard I/O Mezzanine modules. Other interface connectors found on-board include JTAG for accessing FPGA and on-board System Controller CPLD, and also connector with 5 high-speed I/O differential signaling pairs.

The TEC0330 FPGA board is intended to be used as add-on card in a PCIe 2.0 or higher capable host systems, it can not be used as a stand-alone device.

Key Features

  • Xilinx Virtex-7 FPGA module XC7VX330T-2FFG1157C (commercial temperature range)
  • PCI Express 2.0 x8 card with maximum throughput of 4 GB/s
  • FMC High Pin Count (HPC) connector
  • 8 FPGA MGT lanes available on PCIe interface
  • DDR3 SO-DIMM SDRAM socket
  • 256-Mbit (32-MByte) Quad SPI Flash memory (for configuration and operation) accessible through:
    • FPGA
    • JTAG port (SPI indirect, bus width x4)
  • External clock input via SMA coaxial connector
  • 28 GTH transceivers, each with up to 13.1 Gbit/s data transmission rate
  • FPGA configuration through:
    • JTAG connector
    • SPI Flash memory
  • Programmable quad clock generator
  • TI LMK04828B ultra low-noise JESD204B compliant clock jitter cleaner
  • On-board high-efficiency DC-DC converters
  • Up to 202 FPGA I/O pins available on FMC connector (up to 101 LVDS pairs possible)
  • System management and power sequencing
  • AES bit-stream encryption
  • eFUSE bit-stream encryption

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram


Figure 1TEC0330-03 Block Diagram.

Main Components

 

Figure 2: FPGA board TEC0330-03.

  1. PCI Express 2.0 x8 connector, J1
  2. FPGA JTAG connector, J9
  3. User button, S2
  4. SO-DIMM socket, U2
  5. Xilinx Virtex-7 XC7VX330T-2FFG1157C FPGA, U1
  6. ANSI/VITA 57.1 compliant FMC HPC connector, J2
  7. SMA coaxial connector for external clock input, J3
  8. System Controller CPLD JTAG connector, J8
  9. I2C connector for LT LTM4676 step-down DC-DC regulator, J10
  10. IDC header for access to 5 x high-speed data lanes (LVDS pairs), J7
  11. 4-wire PWM fan connector, J4
  12. 6-pin 12V power connector, J5
  13. Reference clock generator @10.0 MHz (P5146) , U11
  14. LDO DC-DC regulator @3.3V (LMK_3V3) (TI TPS74901RGWR), U21
  15. 256 Mbit Quad SPI Flash Memory (Micron N25Q256A), U12
  16. Cooling fan 5VDC M1 (45X5MM, 0.7W, 1.06CFM)
  17. System Controller CPLD (Lattice Semiconductor LCMXO2-1200HC), U5
  18. Ultra low jitter clock synthesizer (TI LMK04828B), U9
  19. Step-down DC-DC regulator @1.0V (LT LTM4676), U4
  20. Step-down DC-DC regulator @1.5V (VCC1V5) (LT LTM4676, U3
  21. I2C Programmable quad clock generator (Silicon Labs Si5338A), U13
  22. 4A PowerSoC DC-DC converter @1.8V (Altera EN6347QI, U20
  23. LDO DC-DC regulator @1.0V (MGTAVCC_FPGA) (TI TPS74401RGW), U18
  24. LDO DC-DC regulator @1.2V (MGTAVTT_FPGA) (TI TPS74401RGW), U17
  25. 4A PowerSoC DC-DC converter @3.3V (3V3FMC) (Altera EN6347QI), U15
  26. 4A PowerSoC DC-DC converter @1.8V (FMC_VADJ) (Altera EN6347QI), U7

Initial Delivery State

Storage device name

Content

Notes

SPI Flash OTP Area

Empty, not programmed

Except serial number programmed by flash vendor.

SPI Flash Quad Enable bit

Programmed

-

SPI Flash main array

Demo design

-

eFUSE USER

Not programmed

-

eFUSE Security

Not programmed

-

Table 1: Initial delivery state.

Signals, Interfaces and Pins

FMC Connector

The high-pin count (HPC) FMC (FPGA Mezzanine Card) connector (J2) is a standard ANSI/VITA 57.1 modular interface to the FPGA and provides access to numerous FPGA I/O pins for use by other mezzanine modules and expansion cards. The FMC connector supports single ended I/O (with several VCCIO voltages available) and LVDS I/O signaling.

The I/O signals are routed from the FPGA I/O banks to the FMC connector as LVDS pairs:

FPGA BankI/O SignalsLVDS pairsBank Voltage (VCCO)
Notes
Bank 1992461.8V-
Bank 394221VIO_B_FMC

Bank voltage VIO_B_FMC must be supplied by FMC connector pins J2-J39, J2-K40.

Bank's VREF_B_M2C signal is routed to the FMC connector pin J2-K1 (external reference voltage).

Bank 3734171.8VBank's VREF_A_M2C signal is routed to the FMC connector pin J2-H1 (external reference voltage).
Bank 3834171.8VBank's VREF_A_M2C signal is routed to the FMC connector pin J2-H1 (external reference voltage).

Table 2: Overview of the FPGA I/O bank signals routed to the FMC.

 

There are also 10 high-speed MGT lanes (Xilinx GTH transceivers) from different FPGA MGT banks routed to the FMC connector.

The MGT banks have also clock input pins which are exposed to the FMC connector. Following MGT lanes are available on the FMC connector:

FPGA BankI/O signalsLVDS pairsMGT lanesBank's reference clock (LVDS pair)
11610521 clock-signal from clock synthesizer U9 to bank's pins T6/T5
117201042 clock-signals from clock FMC connector GBTCLK0_M2C and GBTCLK1_M2C (pins J2-D4/J2-D5 and J2-B20/J2-B21) to bank's pins M6/M5 and P6/P5
11820104

1 reference clock from clock synthesizer U9 to bank's pins F6/F5

1 reference clock from  programmable quad clock generator U13 to bank's pins H6/H5

Table 3: Overview of MGT banks lanes routed to the FMC connector.

The FMC connector provides JTAG and I2C interfaces to the System Controller CPLD:

Interface I/O signals
Schematic name / FMC pinConnected toNotes
JTAG5

FMC_TRST, pin D34

FMC_TCK, pin D29

FMC_TMS, pin D33

FMC_TDI, pin D30

FMC_TDO, pin D31

SC CPLD, bank 2VCCIO: 3V3PCI
I2C2

FMC_SCL, pin C30

FMC_SDA, pin C31

SC CPLD, bank 2

VCCIO: 3V3PCI

I2C-lines 3V3PCI pulled-up

Control lines3

FMC_PRSNT_M2C_L, pin H2

FMC_PG_C2M, pin D1 (3V3FMC pull-up)

FMC_PG_M2C, pin F1 (3V3FMC pull-up)

SC CPLD, bank 1

PG - Power Good signal

C2M - carrier to mezzanine module

M2C - mezzanine module to carrier

Internal System Controller CPLD signal assignment:

FEX_0_N <= FMC_PG_M2C

FMC_PG_C2M <= FMC_PRSNT_M2C_L

Table 4:  FMC connector pin-outs of available interfaces to the System Controller CPLD.

 

FPGA bank 17 and 18 clock inputs from FMC connector:

Schematic name
FMC connector pinsFPGA bankFPGA pins
CLK0_P, CLK0_NH4, H517R28, R29
CLK1_P, CLK1_NG2, G317P29, P30
CLK2_P, CLK2_NK4, K518G31, G31
CLK3_P, CLK3_NJ2, J318H29, H30

Table 5:  FMC connector pin-outs for reference clock input.

 

Several VCCIO voltages are available on the FMC connector for FPGA I/O banks:

Schematic nameMax currentFMC connector pinsNotes
12V1AC35/C37Externally supplied 12V
3V3PCI20mAD32Supplied by the PCIe interface
3V3FMC3AD36/D38/D40/C39Supplied by DC-DC converter U15
VIO_B_FMCExternal supplyJ39/K40Externally supplied VCCO to HB FPGA bank 39
FMC_VADJ4AH40/G39/F40/E39Fixed to 1.8V, supplied by DC-DC converter U7

Table 6:  Available VCCIO voltages on FMC connector.

PCI Express Interface

The TEC0330 FPGA board is a PCI Express card designed to fit into systems with PCI Express x8 slots (PCIe 2.0 or higher) and is PCIe Gen. 2 capable. See next section for the overview of FPGA MGT lanes routed to the PCIe interface.

MGT Lanes

MGT (Multi Gigabit Transceiver) lane consists of one receive and one transmit (RX/TX) differential pairs, four signals total per one MGT lane. Following table lists lane number, MGT bank number, transceiver type, signal schematic name, FMC connector pin connection and FPGA pin connection information.

FPGA to FMC Connector MGT lanes

LaneFPGA BankTypeSignal NameFPGA PinFMC Pin
0117GTH
  • DP0_M2C_P
  • DP0_M2C_N
  • DP0_C2M_P
  • DP0_C2M_N
  • MGTHRXP0_117, N4
  • MGTHRXN0_117, N3
  • MGTHTXP0_117, M2
  • MGTHTXN0_117, M1
  • J2A-C6
  • J2A-C7
  • J2A-C2
  • J2A-C3
1117GTH
  • DP1_M2C_P
  • DP1_M2C_N
  • DP1_C2M_P
  • DP1_C2M_N
  • MGTHRXP1_117, L4
  • MGTHRXN1_117, L3
  • MGTHTXP1_117, K2
  • MGTHTXN1_117, K1
  • J2A-A2
  • J2A-A3
  • J2A-A22
  • J2A-A23
2117GTH
  • DP2_M2C_P
  • DP2_M2C_N
  • DP2_C2M_P
  • DP2_C2M_N
  • MGTHRXP2_117, K6
  • MGTHRXN2_117, K5
  • MGTHTXP2_117, H2
  • MGTHTXN2_117, H1
  • J2A-A6
  • J2A-A7
  • J2A-A26
  • J2A-A27
3117GTH
  • DP3_M2C_P
  • DP3_M2C_N
  • DP3_C2M_P
  • DP3_C2M_N
  • MGTHRXP3_117, J4
  • MGTHRXN3_117, J3
  • MGTHTXP3_117, F2
  • MGTHTXN3_117, F1
  • J2A-A10
  • J2A-A11
  • J2A-A30
  • J2A-A31
4118GTH
  • DP4_M2C_P
  • DP4_M2C_N
  • DP4_C2M_P
  • DP4_C2M_N
  • MGTHRXP0_118, G4
  • MGTHRXN0_118, G3
  • MGTHTXP0_118, D2
  • MGTHTXN0_118, D1
  • J2A-A14
  • J2A-A15
  • J2A-A34
  • J2A-A35

Table 8: FPGA to FMC connector MGT lanes overview (continue on next page).

FPGA to FMC Connector MGT lanes (continued)

LaneFPGA BankTypeSignal NameFPGA PinFMC Pin
5118GTH
  • DP5_M2C_P
  • DP5_M2C_N
  • DP5_C2M_P
  • DP5_C2M_N
  • MGTHRXP1_118, E4
  • MGTHRXN1_118, E3
  • MGTHTXP1_118, C4
  • MGTHTXN1_118, C3
  • J2A-A18
  • J2A-A19
  • J2A-A38
  • J2A-A39
6118GTH
  • DP6_M2C_P
  • DP6_M2C_N
  • DP6_C2M_P
  • DP6_C2M_N
  • MGTHRXP2_118, D6
  • MGTHRXN2_118, D5
  • MGTHTXP2_118, B2
  • MGTHTXN2_118, B1
  • J2A-B16
  • J2A-B17
  • J2A-B36
  • J2A-B37
7118GTH
  • DP7_M2C_P
  • DP7_M2C_N
  • DP7_C2M_P
  • DP7_C2M_N
  • MGTHRXP3_118, B6
  • MGTHRXN3_118, B5
  • MGTHTXP3_118, A4
  • MGTHTXN3_118, A3
  • J2A-B12
  • J2A-B13
  • J2A-B32
  • J2A-B33
8116GTH
  • DP8_M2C_P
  • DP8_M2C_N
  • DP8_C2M_P
  • DP8_C2M_N
  • MGTHRXP2_116, U4
  • MGTHRXN2_116, U3
  • MGTHTXP2_116, T2
  • MGTHTXN2_116, T1
  • J2A-B8
  • J2A-B9
  • J2A-B28
  • J2A-B29
9116GTH
  • DP9_M2C_P
  • DP9_M2C_N
  • DP9_C2M_P
  • DP9_C2M_N
  • MGTHRXP3_116, R4
  • MGTHRXN3_116, R3
  • MGTHTXP3_116, P2
  • MGTHTXN3_116, P1
  • J2A-B4
  • J2A-B5
  • J2A-B24
  • J2A-B25

Table 8: FPGA to FMC connector MGT lanes overview.

 

FPGA to PCIe Connector MGT lanes

LaneFPGA BankTypeSignal NameFPGA PinPCIe Pin
0115GTH
  • PER0_P
  • PER0_N
  • PET0_P
  • PET0_N
  • MGTHRXP3_115, AB2
  • MGTHRXN3_115, AB1
  • MGTHTXP3_115, AC4
  • MGTHTXN3_115, AC3
  • J1-A16
  • J1-A17
  • J1-B14
  • J1-B15
1115GTH
  • PER1_P
  • PER1_N
  • PET1_P
  • PET1_N
  • MGTHRXP2_115, AD2
  • MGTHRXN2_115, AD1
  • MGTHTXP2_115, AE4
  • MGTHTXN2_115, AE3
  • J1-A21
  • J1-A22
  • J1-B19
  • J1-B20
2115GTH
  • PER2_P
  • PER2_N
  • PET2_P
  • PET2_N
  • MGTHRXP1_115, AF2
  • MGTHRXN1_115, AF1
  • MGTHTXP1_115, AF6
  • MGTHTXN1_115, AF5
  • J1-A25
  • J1-A26
  • J1-B23
  • J1-B24
3115GTH
  • PER3_P
  • PER3_N
  • PET3_P
  • PET3_N
  • MGTHRXP0_115, AH2
  • MGTHRXN0_115, AH1
  • MGTHTXP0_115, AG4
  • MGTHTXN0_115, AG3
  • J1-A29
  • J1-A30
  • J1-B27
  • J1-B28
4114GTH
  • PER4_P
  • PER4_N
  • PET4_P
  • PET4_N
  • MGTHRXP3_114, AK2
  • MGTHRXN3_114, AK1
  • MGTHTXP3_114, AJ4
  • MGTHTXN3_114, AJ3
  • J1-A35
  • J1-A36
  • J1-B33
  • J1-B34
5114GTH
  • PER5_P
  • PER5_N
  • PET5_P
  • PET5_N
  • MGTHRXP2_114, AM2
  • MGTHRXN2_114, AM1
  • MGTHTXP2_114, AL4
  • MGTHTXN2_114, AL3
  • J1-A39
  • J1-A40
  • J1-B37
  • J1-B38
6114GTH
  • PER6_P
  • PER6_N
  • PET6_P
  • PET6_N
  • MGTHRXP1_114, AN4
  • MGTHRXN1_114, AN3
  • MGTHTXP1_114, AM6
  • MGTHTXN1_114, AM5
  • J1-A43
  • J1-A44
  • J1-B41
  • J1-B42
7114GTH
  • PER7_P
  • PER7_N
  • PET7_P
  • PET7_N
  • MGTHRXP0_114, AP2
  • MGTHRXN0_114, AP1
  • MGTHTXP0_114, AP6
  • MGTHTXN0_114, AP5
  • J1-A47
  • J1-A48
  • J1-B45
  • J1-B46

Table 9: FPGA to PCIe connector MGT lanes overview.

JTAG Interfaces

TEC0330 board JTAG interfaces accessing the FPGA or the System Controller CPLD:

JTAG InterfaceSignal Schematic NameJTAG Connector PinConnected to

CPLD JTAG

VCCIO: 3V3PCI

Connector: J8

CPLD_JTAG_TMSJ8-1SC CPLD, bank 0, pin 90
CPLD_JTAG_TDIJ8-2SC CPLD, bank 0, pin 94
CPLD_JTAG_TDOJ8-3SC CPLD, bank 0, pin 95
CPLD_JTAG_TCK

J8-4

SC CPLD, bank 0, pin 91
    

FPGA JTAG

VCCIO: 1V8

Connector: J9

FPGA_JTAG_TMSJ9-4FPGA, bank 0, pin N9
FPGA_JTAG_TMSJ9-6FPGA, bank 0, pin M8
FPGA_JTAG_TCKJ9-8FPGA, bank 0, pin N8
FPGA_JTAG_TDIJ9-10FPGA, bank 0, pin L8
    

FMC JTAG

VCCIO: 3.3VPCI

Connector: J2

FMC_TRSTJ2-D34SC CPLD, bank 2, pin 36
FMC_TRSTJ2-D29SC CPLD, bank 2, pin 27
FMC_TCKJ2-D33SC CPLD, bank 2, pin 28
FMC_TMSJ2-D30SC CPLD, bank 2, pin 31
FMC_TDOJ2-D31SC CPLD, bank 2, pin 32

Table 10: JTAG Interface on TEC0330 board.

On-board Peripherals

System Controller CPLD

The System Controller CPLD is the central system management unit that provides numerous interfaces between the on-board peripherals and to the FPGA module. The signals routed to the CPLD will be linked by the logic implemented in the CPLD firmware, which generates output signals to control the system, the on-board peripherals and the interfaces. So some interfaces between the on-board peripherals and to the FPGA module are by-passed, forwarded and controlled by the System Controller CPLD.

Other tasks of the System Controller CPLD are the monitoring of the power-on sequence, the proper programing of the FPGA module and to display its programming state.

CPLD bankCPLD bank's VCCIO
03V3PCI
13V3PCI
23V3PCI
31V8

Table 11: VCCIO voltages of CPLD banks.

Following table describes the interfaces and functionalities of the System Controller CPLD, which are not described elsewhere in this TRM:

CPLD functionalityInterfaceDesignated CPLD pinsConnected to
Notes
I2C interface between on-board peripherals and FPGAI2C

FPGA_IIC_SDA, pin 24

FPGA_IIC_SCL, pin 25

FPGA_IIC_OE, pin 19

FPGA bank 16, pin V29

FPGA bank 16, pin W29

FPGA bank 16, pin W26

VCCIO: 1V8, all with pull-up to 1V8.

Following devices and connectors are linked to the FPGA_IIC I2C interface:

  • DC-DC converter U3 and U4 (LT LTM4676)
  • Programmable quad clock generator U13
  • FMC connector J2
  • PCIe connector J1

Note: FPGA_IIC_OE must kept high for I2C operation.

For I2C slave device addresses refer to the component datasheets.

User I/Os

External LVDS pairs

10 I/Os

5 x differential signaling pairs

EX0_P ... EX4_P

EX0_N ... EX4_N

IDC header J7

Can also be used for single-ended signaling.

User I/Os

Internal LVDS pairs

13 I/Os

6 x differential signaling pairs

FEX0_P ... FEX5_P

FEX0_N ... FEX5_N

FEX_DIR (single-ended I/O)

FPGA bank 18

VCCIO: 1V8

Can also be used for single-ended signaling.

FPGA bank 18 has also reference clock input from FMC connector (CLK2, CLK3) and clock synthesizer U9 (FCLK).

Internal signal assignment:

FEX_DIR <= FMC_PRSNT_M2C_L

FPGA programming control and state2 I/Os

DONE, pin 7

PROGRAM_B, pin 8

FPGA bank 0, pin V8

FPGA bank 0, pin U8

VCCIO: 1V8
I2C interface to programmable quad clock generatorI²C

PLL_SCL, pin 14

PLL_SDA, pin 15

U13, pin 12

U13, pin 19

VCCIO: 1V8

Only PLL_SDA has 1V8 pull-up.

Fan PWM control J42 I/Os

F1SENSE, pin 99

F1PWM, pin 98

J4-3 (active low)

J4-4

Internal signal assignment:

FEX_5_P <= F1SENSE

FEX_5_N => F1PWM

Button S21 I/OBUTTON, pin 77Switch S2Functionality depends on CPLD firmware, activating pin PROGRAM_B (active low) and LED1 in standard configuration.
LED11 I/OLED1, pin 76LED D1 (green)

Fast blinking, when FPGA is not programmed.

Internal signal assignment:

LED1 <= Button S2 or FEX0_P

PCIe control line RESET_B

1 I/OPCIE_RSTB, pin 37PCIe connector J1-A11 (33R serial resistor)

Internal signal assignment:

FEX_4_N <= PCIE_RSTB

Control Interface to clock synthesizer U9 (TI LMK04828B)

SPI (3 I/Os),

4 I/Os

CLK_SYNTH_SDIO, pin 75

CLK_SYNTH_SCK, pin 74

CLK_SYNTH_RESET, pin 54

CLK_SYNTH_CS, pin 53

CLK_SYNTH_SYNC, pin 52

LMK_STAT0, pin 62

LMK_STAT1, pin 63

U9, pin 20

U9, pin 19

U9, pin 5

U9, pin 18

U9, pin 6

U9, pin 31

U9, pin 48

Pull up to 3V3PCI.

Internal signal assignment:

LMK_SCK <= FEX_1_P

LMK_SDIO <= FEX_1_N

LMK_CS <= FEX_3_P

LMK_SYNC <= EX_3_N

LMK_RESET <= FEX_4_P

FEX_2_P => LMK_SDIO (FEX_2_N must be 0)

LMK_STAT0 and LMK_STAT1 signals are not used.

Control Interface to DC-DC converters U3 and U4 (both LT LTM4676)

I2C (2 I/Os),

2 I/Os

LTM_SCL, pin 67

LTM_SDA, pin 66

LTM1_ALERT, pin 65

LTM2_ALERT, pin 64

U4, pin E6 and U3, pin E6

U4, pin D6 and U3, pin D6

U4, pin E5

U3, pin E5

3V3 pull-ups.

LTM I2C interface is also accessible trough header J10.

LTM1_Alert and LTM2_ALERT signals are not used.

Power-on sequence and monitoring6 I/Os

EN_1V8, pin 58

PG_1V8, pin 59

EN_FMC_VADJ, pin 60

PG_FMC_VADJ, pin 61

EN_3V3, pin 51

PG_3V3, pin 57

U20, pin 27

U20, pin 28

U7, pin 27

U7, pin 28

U15, pin 27

U15, pin 28

Sequence of the supply voltages depend on the System Controller CPLD firmware.

EN_1V8, EN_3V3 and EN_FMC_VADJ will be set simultaneously at start-up.

PG signals will not be evaluated.

Table 12: Overview of the System Controller CPLD functions.

SO-DIMM Socket for DDR3 SDRAM

The TEC0330 board supports additional DDR3 SO-DIMM via 204-pin SO-DIMM socked U2. The DDR3 memory interface is routed to the FPGA banks 34, 35 and 36.

The reference clock signal for the DDR3 interface is generated by the quad programmable reference clock U13 and is applied to bank 35.

There is also a I2C interface between the System Controller CPLD and the DDR3 SDRAM memory:

Interface signals schematic nameSystem Controller CPLD pinDDR3 memory interface pin
DDR3_SDABank 2, pin 48Pin 200 (3V3PCI pull-up)
DDR3_SCLBank 2, pin 49Pin 202 (3V3PCI pull-up)

Table 13: I2C-interface between SC CPLD and DDR3 SDRAM memory.

Quad SPI Flash Memory

An 256 Mbit (32 MByte) Quad SPI Flash Memory (Micron N25Q256A, U12) is provided for FPGA configuration file storage. After configuration process completes the remaining free memory can be used for application data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths to be used. The maximum data transfer rate depends on the bus width and clock frequency. The memory can be accessed indirectly by the FPGA JTAG port (J9) by implementing the functional logic for this purpose inside the FPGA.

Clock sources

The TEC0330 FPGA board has a sophisticated clock generation and conditioning system to meet the requirements of the Xilinx Virtex-7 GTH units with data transmission rates up to 13.1 Gb/s.

List of on-board and external reference clock signals of the TE0330 board:

Clock SourceSchematic NameFrequencyClock destination
SMA coaxial connector, J3

CLK_SYNTH_CLKIN0_P,

CLK_SYNTH_CLKIN0_N (GND)

UserClock synthesizer U9, pins 37/38
RAKON P5146LF oscillator, U11-10.0 MHzClock synthesizer U9, pins 43/44
SiTime SiT8208 oscillator, U14CLK_25MHz25.0 MHzProgrammable quad clock generator U13, pin 3
FMC connector J2, pins H4/H5

CLK0_P, CLK0_N

UserFPGA bank 17, pins R28/R29
FMC connector J2, pins G2/G3CLK1_P, CLK1_NUserFPGA bank 17, pins P29/P30
FMC connector J2, pins K4/K5CLK2_P, CLK2_NUserFPGA bank 18, pins G30/G31
FMC connector J2, pins J2/J3CLK3_P, CLK3_NUserFPGA bank 18, pins H29/H30
FMC connector J2, pins D4/D5

GBTCLK0_M2C_P,

GBTCLK0_M2C_N

UserFPGA bank 117, pins M6/M5
FMC connector J2, pins B20/B21

GBTCLK1_M2C_P,

GBTCLK1_M2C_N

UserFPGA bank 117, pins P6/P5
PCIe interface J1, pins A13/A14

PCIE_CLK_P,

PCIE_CLK_N

100 MHz

(PCIe spec.)

FPGA bank 115, pins AD6/AD5

Table 14: Clock generator sources overview.

Programmable Clock Generator

There is a Silicon Labs I2C programmable quad clock generator Si5338A (U13) on-board. It's output frequencies can be programmed by using the I2C-bus with address 0x70.

A 25 MHz (U14) oscillator is connected to pin 3 (IN3) and is used to generate the output clocks.

Once running, the frequency and other parameters can be changed by programming the device using the I2C bus connected between the FPGA (master) and clock generator (slave). Logic needs to be generated inside the FPGA module to utilize I²C-bus correctly.

Si5338A (U13) inputSignal schematic nameNotes

IN1/IN2

CLKIN_5338_C_P, CLKIN_5338_C_N

Reference clock signal from clock synthesizer U9

(100 nF decoupling capacitors and 100Ω termination resistor)

IN3

Reference clock oscillator input, SiTime  SiT8208AI (U14).

25.0 MHz fixed frequency

IN4/IN6

Connected to the GND.LSB (pin 'IN4') of the default I²C-adress 0x70 is zero

IN5

Not connected

-
Si5338A (U13) output
Signal schematic nameNotes

CLK0 A/B

DDR3_CLK_P, DDR3_CLK_N

DDR3-RAM reference clock signal to FPGA bank 35

CLK1 A/B

MGTCLK_5338_C_P,

MGTCLK_5338_C_N

Reference clock signal to FPGA bank 115 MGT

(100 nF decoupling capacitors and 100Ω termination resistor)

CLK2 A/B

LMK_CLK_P, LMK_CLK_N

Input clock signal to clock synthesizer U9

(100 nF decoupling capacitors)

CLK3 A/B

MGTCLK2_5338_C_P,

MGTCLK2_5338_C_N

Reference clock signal to FPGA bank 118 MGT

(100 nF decoupling capacitors and 100Ω termination resistor)

Table 15: I/O pin description of programmable clock generator Si5338A.

Ultra low-noise high-performance clock synthesizer

The TEC0330 board utilizes an ultra low jitter clock synthesizer TI LMK04828B (U9) for conditioning and generating clean clock signals which are necessary for the GTH units of the Xilinx Virtex-7 FPGA module.

The clock synthesizer can be controlled and programmed by its SPI interface (SPI slave) and other control lines, which are routed to the FPGA module (SPI master) and by-passed trough the System Controller CPLD. See section 'System Controller CPLD' for more detailed information.

Logic needs to be generated inside the FPGA module to utilize SPI bus correctly.

LMK04828B (U9) inputsignal schematic nameNote
Status_LD1, Status_LD2LMK_STAT0, LMK_STAT1Connected to System Controller CPLD, not implemented in current CPLD firmware

SPI interface and control lines

see section 'System controller CPLD'The clock synthesizer can be controlled and programmed by the FPGA module via the SPI interface and control lines, which are by-passed through the System Controller CPLD
CLKin0, CLKin0*

CLK_SYNTH_CLKIN0_P,

CLK_SYNTH_CLKIN0_N

Input reference clock signal via SMA coaxial connector J3, connected to CLKin0* via serial decoupling capacitor 100nF.

CLKin0 to connected to GND via serial decoupling capacitor 100nF. 

CLKin1, CLKin1*

CLK_SYNTH_CLKIN1_P,

CLK_SYNTH_CLKIN1_N

Input reference clock signal from programmable quad clock generator Si5338A (U13) via serial decoupling capacitor 100nF.
OSCin, OSCin*-Signal from reference clock oscillator RAKON P51446LF, fixed to 10.0 MHz
LMK04828B (U9) outputsignal schematic nameNote
DCLKout0, DCLKout0*

CLK_SYNTH_DCLKOUT0_P,

CLK_SYNTH_DCLKOUT0_N

Reference clock signal to FPGA bank 15 pins AD29/AE29
SDCLKout1, SDCLKout1*

CLK_SYNTH_SDCLKOUT1_P,

CLK_SYNTH_SDCLKOUT1_N

Reference clock signal to FPGA bank 15 pins AE31/AF31
DCLKout2, DCLKout2*

CLKIN_5338_P,

CLKIN_5338_N

Reference clock signal to programmable quad clock generator Si5338A (U13)

(100 nF decoupling capacitors and 100Ω termination resistor)

DCLKout4, DCLKout4*

CLK_SYNTH_DCLKOUT4_P,

CLK_SYNTH_DCLKOUT4_N

Reference clock signal to FPGA bank 115 MGT, pins T6/T5
SDCLKout7, SDCLKout7*

CLK_SYNTH_SDCLKOUT7_P,

CLK_SYNTH_SDCLKOUT7_N

Reference clock signal to FPGA bank 118 MGT, pins F6/F5
OSCout0, OSCout0*

CLK_SYNTH_CLKIN2_P,

CLK_SYNTH_CLKIN2_N

Reference clock signal to FPGA bank 18, pins J30/J31

(100 nF decoupling capacitors)

Table 16: Pin description of clock synthesizer TI LMK04828B.

Power and Power-On Sequence

Power Supply

6-pin 12V power connector J5 is the main power supply of the TEC0330 FPGA board, minimum current capability of 3A for system startup is recommended.

 

Power Consumption

 Power Input
Typical Current
12V (J5)TBD
3V3PCI (J1)TBD

Table 17: Typical power consumption. TBD  - To Be Determined.

Power-On Sequence

The on-board voltages of the TEC0330 FPGA board will be powered up in order of a determined sequence after the external voltages 12V on connector J5 and 3V3PCI on connector J1 are available.

Core voltages and main supply voltages have to reach stable state and their "Power Good"-signals have to be asserted before other voltages like PL bank's I/O voltages can be powered up.

Following diagram describes the sequence of enabling the on-board voltages:

Figure 3: FPGA board TEC0330-03 power-on sequence diagram.

Bank Voltages

BankSchematic NameVoltageRangeNote
01V81.8VHP: 1.2V to 1.8VConfig bank (fixed to 1.8V) / JTAG interface
141V81.8VHP: 1.2V to 1.8VQSPI flash memory interface
151V81.8VHP: 1.2V to 1.8VReference clock input
161V81.8VHP: 1.2V to 1.8VI2C interface of FPGA
171V81.8VHP: 1.2V to 1.8VReference clock input
181V81.8VHP: 1.2V to 1.8VReference clock input / I/O's to CPLD
34VCC1V51.5VHP: 1.2V to 1.8VDDR3 memory interface
35VCC1V51.5VHP: 1.2V to 1.8VDDR3 memory interface
36VCC1V51.5VHP: 1.2V to 1.8VDDR3 memory interface

114

115

116

117

118

MGTAVCC_FPGA

MGTVCCAUX_FPGA

MGTAVTT_FPGA

1.0V

1.8V

1.2V

MGT bank supply voltage

MGT bank auxiliary supply voltage

MGT bank termination circuits voltage

MGT banks with Xilinx GTH transceiver units
191V81.8VHP: 1.2V to 1.8VI/Os routed to FMC, usable as LVDS pairs
 371V81.8VHP: 1.2V to 1.8VI/Os routed to FMC, usable as LVDS pairs
 381V81.8VHP: 1.2V to 1.8VI/Os routed to FMC, usable as LVDS pairs
 39VIO_B_FMCuserHP: 1.2V to 1.8VI/Os routed to FMC, usable as LVDS pairs

Table 18: Range of FPGAs bank voltages.

See Xilinx Virtex-7 datasheet (DS183) for the voltage ranges allowed.

Power Rails

Connector / PinVoltageDirectionNotes
J4, pin 212V (filtered)Output4-wire PWM fan connector supply voltage
J6, pin 25V (filtered)OutputCooling fan M1 supply voltage
J8, pin 63V3PCIOutputVCCIO CPLD JTAG
J9, pin 21V8OutputVCCIO FPGA JTAG
J2, pin C35 / C3712VOutputVCCIO FMC
J2, pin D323V3PCIOutputVCCIO FMC
J2, pin D36 / D38 / D39 / D403V3FMCOutputVCCIO FMC
J2, pin H1VREF_A_M2CInputVREF voltage for bank 37 / 38
J2, pin K1VREF_B_M2CInputVREF voltage for bank 39
J2, pin J39 / J40VIO_B_FMCInputPL I/O voltage bank 39 (VCCO)
J2, pin H40 / G39 / F40 / E39FMC_VADJOutputVCCIO FMC (fixed to 1.8V)
J1, pin A10 / A11 / B83V3PCIInputPCIe interface supply voltage
J5, pin 1 / 2 / 312VInputMain power supply connector

Table 19: Power rails and corresponding connectors of the FPGA board.

Technical Specifications

Absolute Maximum Ratings

ParameterMinMaxUnitsNotesNotes

12V power supply voltage

11.412.6V12V ± 5 %ANSI/VITA 57.1 FPGA Mezzanine Card (FMC) standard
PL I/O voltage for HP banks-0.55 VCCO_X + 0.55V-Xilinx datasheet DS183
GTH transceivers-0.51.26V-Xilinx datasheet DS183
Voltage on System Controller CPLD pins

-0.3

3.6V-

MachXO2 family datasheet

Storage temperature

-55

+125

°C-MachXO2 family datasheet

Table 20: Absolute maximum ratings.

Recommended Operating Conditions

ParameterMinMaxUnitsNotesReference Document
12V power supply voltage11.412.6V12V ± 5 %ANSI/VITA 57.1 FPGA Mezzanine Card (FMC) standard
PL I/O voltage for HP banks-0.2VCCO_X + 0.2V-Xilinx datasheet DS183
GTH transceivers(*)(*)--Xilinx datasheet DS183
Voltage on System Controller CPLD pins3.1353.6V-MachXO2 family datasheet

Table 21: Recommended operation conditions.


Check Xilinx datasheet (DS183) for complete list of absolute maximum and recommended operating ratings.

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

The FPGA board's operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Physical Dimensions

  • board size: 106,65mm × 167,65mm
  • Mating height with standard FMC connectors: 10 mm
  • PCB thickness: 1.65 mm

All dimensions are given in millimeters.

Figure 4: Physical dimensions of the TEC0330-03 board.

Hardware Revision History

DateRevisionNotesPCNDocumentation
-03First production release--
2015-11-0502Prototype--
-01Prototype--

Table 22: Hardware revision history.

Hardware revision number is printed on the PCB board together with the model number separated by the dash.

Figure 5: TE0330 board revision number.

Document Change History

DateRevisionContributorsDescription

 

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 Jan Kumann
  • MGT Lanes section added
  • Fixed signal names in JTAG section.
  • On-board peripherals section added.
  • Weight section removed.

2017-08-30

v.15

Jan Kumann
  • Block diagram changed.
  • Physical dimensions image changed.
  • New product images.
  • Corrections in content.
  • Template revision added.
2017-03-15
v.3
 Ali Naseri
Initial TRM release.

Table 23: Document change history.

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Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.


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DP0_C2M_N

 

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