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Table of Contents
Overview
Trenz Electronic TE0728 is an automotive-grade FPGA module integrating an Automotive Xilinx Zynq-7 FPGA, two Ethernet transceivers (PHY) , DDR3L SDRAM, QSPI Flash memory for configuration and operation, and powerful switching-mode power supplies for all on-board voltages. Numerous configurable I/Os are provided via rugged high-speed strips.
Within the complete module only Automotive components are installed.
All this in a compact 6 x 6 cm form factor, at the most competitive price.
Refer to http://trenz.org/te0728-info for the current online version of this manual and other available documentation.
Key Features
- Xilinx XA7Z020-1CLG484Q (Automotive) [XA7Z014S is available on other assembly options]
- Rugged for shock and high vibration
- Dimensions: 6 x 6 cm
- Temperature range: Automotive
- Dual-Core ARM Cortex-A9 MPCore
- 2 x 100 MBit Ethernet transceiver (PHY)
- DDR3L SDRAM, 16-bit-width [different size is available on other assembly options]
- QSPI Flash memory (with XiP support) [different size is available on other assembly options]
- Plug-on module with 3 x 80-pin Samtec Micro Tiger Eye(TM) high-speed connectors
- 76 single ended I/O, 24 LVDS pairs (48 I/O) and 42 MIO available on board-to-board connectors
- CAN transceiver (PHY)
- 12 V power supply with watchdog
- On-board high-efficiency DC-DC converters
- System management and power sequencing
- eFUSE bit-stream encryption
- AES bit-stream encryption
- Temperature compensated RTC (real-time clock)
- Three user LEDs
- Evenly-spread supply pins for good signal integrity
Block Diagram
TE0728 block diagram
Main Components
draw.io
TE0728 main components
- DDR3 SDRAM, U1
- Xilinx Automotive XA7Z020-1CLG484Q ,U2
- 100 MBit Ethernet transceiver, U3
- 100 MBit Ethernet transceiver, U10
- User LED Green, D4
- Real Time Clock, U7
- Standard Clock Oscillators, U5
- 64 Kbit I2C EEPROM, U11
- CAN Tranceiver, U16
- QSPI NOR Flash memory, U13
- Standard Clock Oscillators, U14
- Low-Quiescent-Current Programmable Delay Supervisory Circuit, U15
- Low-Quiescent-Current Programmable Delay Supervisory Circuit, U12
- B2B connector , JM2
- B2B connector , JM3
- B2B connector , JM1
FPGA (U2), DDR3 SDRAM (U1) and QSPI (U13) can be varied on other assembly option, for more information contact us.
Initial Delivery State
Storage Device | Symbol | Content |
|---|---|---|
Quad SPI Flash | U13 | Not Programmed |
| EEPROM | U11 | Not Programmed |
Initial delivery state of programmable devices on the module
Configuration Signals
Signal | FPGA Bank | Pin | B2B | Signal State | Boot Mode |
|---|---|---|---|---|---|
Boot_R | 500 | E4 | J2-11 | Low | QSPI |
| High | SD Card |
Boot process.
Signal | B2B | I/O | Note |
|---|---|---|---|
Reset | J2-7 | Input | Comes from Carrier |
| RST_OUT | J2-9 | Output | PS_PROB_B |
Reset process.
Signals, Interfaces and Pins
Board to Board (B2B) I/Os
FPGA bank number and number of I/O signals connected to the B2B connector:
| FPGA Bank | Type | B2B Connector | I/O Signal Count | Voltage Level | Notes |
|---|---|---|---|---|---|
| 13 | HR | J1 | 48 Single ended (24 Diff) | VCCO_13 | variable from carrier |
| 500 | MIO | J1 | 4 Singel ended | 3.3V | |
| 501 | MIO | J2 | 38 Singel ended | VMIO1 | variable from carrier |
| 33 | HR | J3 | 34 Single ended (17 Diff) | 3.3V | |
| 35 | HR | J3 J2 | 20 Single ended (10 Diff) 22 Single ended (11 Diff) | 3.3V |
General PL I/O to B2B connectors information
Ethernet PHY
Ethernet pins connections to Board to Board (B2B). Ethernet components ETH1 and ETH2 are connected to B2B connector J3.
| Schematic | ETH1 | ETH2 | Direction | Notes |
|---|---|---|---|---|
| CTREF | J3-57 | J3-25 | In | Magnetics center tap voltage |
| TD+ | J3-58 | J3-28 | Out | Transfer |
| TD- | J3-56 | J3-26 | Out | |
| RD+ | J3-52 | J3-22 | In | Recieve |
| RD- | J3-50 | J3-20 | In | |
| LED1 | J3-55 | J3-23 | Out | LED Yellow on carrier, multiple usage-ACK |
| LED2 | J3-53 | J3-21 | Out | |
| LED3 | J3-51 | J3-19 | Out | LED Green on carrier, multiple usage-Link |
| POWERDOWN/INT | L21 | R20 | In | |
| RESET_N | M15 | R16 | In | Active low PHY Reset |
Ethernet PHY B2B connectors.
CAN PHY
CAN pins connections to Board to Board (B2B).
| Schematic | B2B | Direction | Notes |
|---|---|---|---|
| CANH/CANL | J1-2/J1-4 | Inout/Inout |
CAN B2B connectors.
JTAG Interface
JTAG access to the Xilinx XA7Z020 FPGA through B2B connector JM2.
JTAG Signal | B2B Pin |
|---|---|
| TMS | J2-12 |
| TDI | J2-10 |
| TDO | J2-8 |
| TCK | J2-6 |
JTAG pins connection
MIO Pins
| MIO Pin | Connected to | B2B | Notes |
|---|---|---|---|
| MIO0 | MIO0 | - | RTC interrupt |
| MIO1...MIO6 | SPI_CS , SPI_DQ0... SPI_DQ3 SPI_SCK | - | SPI Flash |
| MIO7 | LED RED | - | LED |
| MIO8/MIO9 | Tx/Rx | - | CAN Transceiver |
| MIO10...MIO13 | IO_0 ... IO_3 | J1 | GPIO |
| MIO14/MIO15 | SCL/SDA | - | I2C |
| MIO16...MIO27 | - | J2 | GPIO |
| MIO28...MIO39 | Tx_clk, Txd0...Txd3, Tx_ctl Rx_clk, Rxd0...Rxd3, Rx_ctl | J2 | ETH |
| MIO40...MIO48 | CLK, Cmd, Data0...Data3, wp, cd | J2 | SD |
| MIO48 | PS_MIO48_501 | J2 | LED Red on Carrier |
| MIO49 | PS_MIO49_501 | J2 | LED Yellow on Carrier |
| MIO50 | PS_MIO49_501 | J2 | LED Green on Carrier |
| MIO51 | PS_MIO51_501 | J2 | GPIO |
| MIO52/MIO53 | UART_Txd / UART_Rxd | J2 | UART transfer/recieve |
MIOs pins
On-board Peripherals
| Chip/Interface | Designator | Notes |
|---|---|---|
| QSPI Flash | U13 | --- |
| EEPROM | U11 | EEPROM |
| RTC | U7 | Real Time Clock |
| DDR3 SDRAM | U1 | Volatile Memory |
| Ethernet | U3, U10 | Two 100 Mbit Ethernet PHY |
| CAN Transceiver | U16 | --- |
| User LED | D4 | Green LED |
On board peripherals
Quad SPI Flash Memory
On-board QSPI flash memory is used to store initial FPGA configuration. Datasheet is provided in Texas Instruments. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency.
Quad SPI Flash (U7) is connected to the Zynq PS QSPI0 interface via PS MIO bank 500.
| MIO Pin | Schematic | Notes |
|---|---|---|
| MIO1 | SPI_CS | |
| MIO2 | SPI_DQ0/M0 | |
| MIO3 | SPI_DQ1/M1 | |
| MIO4 | SPI_DQ2/M2 | |
| MIO5 | SPI_DQ3/M3 | |
| MIO6 | SPI_SCK/M4 |
Quad SPI interface MIOs and pins
RTC
The RTC has an I2C Bus (2-wire SerialInterface) and offers temperature compensated time. The STC-Smart Temperature Compensation is calibrated in the factory and leads to a very high time-accuracy.
RTC intruppt is connected to MIO0 connected to Bank 500 through pin G6.
| MIO Pin | I2C Address | Designator | Notes |
|---|---|---|---|
| MIO14...15 | 0xAD / 0xAC | U7 | Read/ Write |
I2C Address for RTC
EEPROM
The Microchip Technology Inc. 24xx64 is a 64 Kbit Electrically Erasable PROM. The device is organized as a single block of 8K x 8-bit memory with a 2-wire serial interface. The 24xx64 also has a page write capability for up to 32 bytes of data. Functional address lines allow up to eight devices on the same bus, for up to 512 Kbits address space.
| MIO Pin | I2C Address | Designator | Notes |
|---|---|---|---|
| MIO14...15 | 0xA1/0xA0 | U11 | Read/Write |
I2C address for EEPROM
LEDs
| Designator | Color | Connected to | Active Level |
|---|---|---|---|
| D9 | Green | DONE | Low |
| D8 | RED | MIO7 | High |
| D4 | Green | Bank 33 - V18 | High |
On-board LEDs
DDR3 SDRAM
The TE0728 SoM has a volatile DDR3 SDRAM, 256Mx16bit (512MB), IC for storing user application code and data. Size of DDR3 can be varied in different assembly versions.
- Part number: NT5CB256M16CP-DIH
- Supply voltage: 1.5V
- Organization: 256M x 16 bits
DDR3 SDRAM can be varied on demand for other assembly options. DDR3 can have density of maximum 512MB due to available addressing.
Ethernet
There are two 100 MBit Extreme Temperature Ethernet provided by Texas Instrumen on the board. Datasheet is provided at TI website. Both PHY's are connected with all I/O Pins to FPGA Bank 34 (VCCIO = 3.3V). PHY Clock 25 MHz source is provided from MEMS Oscillator. There is no sharing of signals for the two PHY's.
PUDC pin is connected with pull-up to 3.3V those pre-configuration pull-ups are disabled by default. Strapping resistor exist to change the PUDC mode.
| Bank | Signal Name | ETH1 | ETH2 | Signal Description |
|---|---|---|---|---|
| 34 | ETH-RST | M15 | R16 | Ethernet reset, active-low. |
| 34 | ETH_COL | L16 | P20 | |
| 34 | MDC | P16 | T17 | Ethernet management clock. |
| 34 | MDIO | M16 | T16 | Ethernet management data. |
| 34 | ETH_TX_D0 | J22 | N22 | Ethernet transmit data 0. Output to Ethernet PHY. |
| 34 | ETH_TX_D1 | M17 | P21 | Ethernet transmit data 1. Output to Ethernet PHY. |
| 34 | ETH_TX_D2 | K21 | P22 | Ethernet transmit data 2. Output to Ethernet PHY. |
| 34 | ETH_TX_D3 | M22 | R21 | Ethernet transmit data 3. Output to Ethernet PHY. |
| 34 | ETH_TX_EN | J21 | M21 | Ethernet transmit enable. |
| 34 | ETH_RX_D0 | L17 | R18 | Ethernet receive data 0. Input from Ethernet PHY. |
| 34 | ETH_RX_D1 | K18 | R19 | Ethernet receive data 1. Input from Ethernet PHY. |
| 34 | ETH_RX_D2 | J18 | T18 | Ethernet receive data 2. Input from Ethernet PHY. |
| 34 | ETH_RX_D3 | J20 | T19 | Ethernet receive data 3. Input from Ethernet PHY. |
| 34 | ETH_RX_DV | N17 | P15 | Ethernet receive data valid. |
Ethernet PHY to Zynq SoC connections
CAN Transceiver
Controller Area Network (CAN) transceivers are designed for use with the Texas Instruments TMS320Lx240x 3.3-V DSPs with CAN controllers. The datasheet is available in TI website. Each CAN transceiver is designed to provide differential transmit capability to the bus and differential receive capability to a CAN controller at speeds up to 1 Mbps.
| Bank | Signal name | Notes |
|---|---|---|
| 500 | D - Tx | Driver Input |
| 500 | R - Rx | Reciever Output |
CAN Tranciever interface MIOs
Clock Sources
| Designator | Description | Frequency | Used as |
|---|---|---|---|
| U14 | MEMS Oscillator | 50 MHz | PS_CLK |
| U5 | MEMS Oscillator | 25 MHz | Ethernet PHY Clock |
| U7 | RTC (internal oscillator) | 32.768 KHz | CLKOUT of RTC is not connected |
Osillators
Power and Power-On Sequence
Power Supply
Power supply with minimum current capability of 2.5A for system startup is recommended.
Power Consumption
| Power Input Pin | Typical Current |
|---|---|
| VIN | TBD* |
Power Consumption
* TBD - To Be Determined
Power Distribution Dependencies
Power Dependencies
Power on Sequence
The TE07028 SoM meets the recommended criteria to power up the Xilinx Zynq properly by keeping a specific sequence of enabling the on-board DC-DC converters and regulators dedicated to the particular functional units of the Zynq chip and powering up the on-board voltages. When the U8 and U9 generates PWRGD signal, it turns on the U4 which generates PWRGD_3.3V, it turns on the U6 and it generates PWROK signal which is connected to MR. Whenever the supply voltage for U12 drops down below the threshold it resets the system. Actually it resets the system when all regulators are working.
draw.io
Power On Sequence
Voltage Monitor Circuit
The microprocessor supervisory circuits monitor system voltages asserting an open-drain RESET signal when the SENSE voltage drops below a preset threshold or when the manual reset (MR) pin drops to a logic low. The RESET output remains low for the user adjustable delay time after the SENSE voltage and MR return above their thresholds. Datasheet is available in Texas Instruments website.
Power Rails
B2B Name | B2B JM1 Pin | B2B JM2 Pin | B2B JM3 Pin | Direction | Notes |
|---|---|---|---|---|---|
| VIN | 1,3 | - | - | Input | Supply voltage from carrier board. |
| VCCO_13 | 39 | - | - | I/O | |
| VBATT | - | 1 | - | Output | RTC Supply voltage |
| 3.3V | 19 | 4 | 25,57 | Output | Internal 3.3V voltage level. |
| VMIO | - | 2 | Input | 3.3V from carrier | |
1.8V | - | 5 | - | Output | Internal 1.8V voltage level. |
Module power rails.
Bank Voltages
Bank | Schematic Name | Voltage | I/O Type | Notes |
|---|---|---|---|---|
| 500 | VCCO_MIO0_500 | 3.3V | MIO | |
| 501 | VCCO_MIO1_501 | 2.5V or 3.3V | MIO | supplied by 3.3V from carrier. |
| 502 | VCCO_DDR_502 | 1.5V | DDR3 | |
| 13 | VCCO_13 | 1.8V or 3.3V | HR | Supplied by the carrier board. J1 |
| 33 | 3.3V | 3.3V | HR | Supplied by carrier board. J3 |
| 34 | 3.3V | 3.3V | HR | |
| 35 | 3.3V | 3.3V | HR | Supplied by the carrier board. J2, J3 |
Zynq SoC bank voltages.
Board to Board Connectors
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6 x 6 modules use two or three Samtec Micro Tiger Eye Connector on the bottom side.
3 x REF-189018-01 (compatible to SEM-140-02-03.0-H-D-A), (80 pins, "40" per row)
Technical Specifications
Absolute Maximum Ratings
| Symbols | Min | Max | Unit | Description |
|---|---|---|---|---|
| VCCPINT | -0.5 | 1.1 | V | PS internal logic supply voltage |
| VCCPAUX | -0.5 | 2.0 | V | PS auxiliary supply voltage |
| VCCPLL | -0.5 | 2.0 | V | PS PLL supply |
| VCCO_DDR | -0.5 | 2.0 | V | PS DDR I/O supply voltage |
| VPREF | -0.5 | 2.0 | V | PS input reference voltage |
| VCCO_MIO0 | -0.5 | 3.6 | V | PS MIO I/O supply voltage for HR I/O banks |
| VCCO_MIO1 | 1.71 | 3.45 | V | PS MIO I/O supply voltage for HR I/O banks |
| VCCINT | -0.5 | 1.1 | V | PL internal logic supply voltage |
| VCCPAUX | -0.5 | 2.0 | V | PL auxiliary supply voltage |
| VCCPLL | -0.5 | 1.1 | V | PL PLL supply |
| VPREF | -0.5 | 2.0 | V | PL input reference voltage |
| VCCO | -0.5 | 3.6 | V | PL supply voltage for HR I/O banks |
| VIN | 1.71 | 3.45 | V | I/O input voltage for HR I/O banks |
Absolute maximum ratings
Recommended Operating Conditionse
| Parameter | Min | Max | Units | Reference Document |
|---|---|---|---|---|
| VIN supply voltage | 3.5 | 60 | V | TPS54260-Q1 datasheets. |
| Supply voltage for PS MIO banks | 1.71 | 3.465 | V | See Xilinx DS187 datasheet. |
| I/O input voltage for PS MIO banks | -0.2 | VCCO_MIO + 0.20 | V | See Xilinx DS187 datasheet. |
| Supply voltage for PS DDR | 1.14 | 1.89 | V | See Xilinx DS187 datasheet. |
| I/O input voltage for PS DDR | -0.20 | VCCO_DDR + 0.20 | V | See Xilinx DS187 datasheet. |
| Supply voltage for HR I/Os banks | 1.14 | 3.465 | V | See Xilinx DS187 datasheet. |
| I/O input voltage for HR I/O banks | -0.20 | VCCIO + 0.20 | V | See Xilinx DS187 datasheet. |
| Storage Temperature | -40 | +85 | °C | |
| Operating Temperature | -40 | +105 | °C |
Recommended operating conditions
Physical Dimensions
Module size: 60 mm × 60 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 7 mm.
PCB thickness: 1.6 mm.
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Physical Dimension
Variants Currently Offered
| Trenz shop TE0728 overview page | |
|---|---|
| English page | German page |
Trenz Electronic Shop Overview
Revision History
Hardware Revision History
| Date | Revision | Note | PCN | Documentation Link |
|---|---|---|---|---|
| 04 | Product Release | PCN | TE0728-04-1Q |
| 03 | - | TE0728-03-1Q |
Hardware Revision History
Hardware revision number is printed on the PCB board next to the module model number separated by the dash.
Document Change History
| Date | Revision | Contributor | Description |
|---|---|---|---|
| |||
-- | all |
|
Document change history.
Disclaimer
Data Privacy
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The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.
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The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.
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REACH, RoHS and WEEE
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RoHS
Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.
WEEE
Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).
Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.
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