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Table of Contents
The Trenz Electronic TEBT0782 is a carrier for TE0782, TE0783 and TE0784 module.
Refer to http://trenz.org/tebt0782-info for the current online version of this manual and other available documentation.
Storage device name | Content | Notes |
---|---|---|
- | - | - |
MODE Signal State | B2B | Boot Mode | Notes |
---|---|---|---|
XMOD_A | JBC3- 129 | Used as UART TX line | |
XMOD_B | JBC3- 135 | Used as UART RX line |
Signal | B2B | Note |
---|---|---|
RESIN | JBC3-130 | Board Reset |
FPGA bank number and number of I/O signals connected to the B2B connector:
B2B Connector | Interface | Number of I/O | Notes |
---|---|---|---|
JBC1 | RJ45, J1B-J1C | 1 Differential pair, 2 Single Ended | Yellow, Green LEDs |
RJ45, J1A | 4 Differential pair, 8 Single Ended | ||
RJ45, J2B-J2C | 1 Differential pair, 2 Single Ended | Yellow, Green LEDs | |
RJ45, J2A | 4 Differential pair, 8 Single Ended | ||
TE0790 Base, J8 | 4 Single Ended | ||
TE0790 Base, J7 | 1 Single Ended | ||
USB A Stacked, U7 | 2 Single Ended | ||
Power Switch, U1 | 2 Single Ended | ||
SMD Line Filter, L6 | 1 Differential pair, 2 Single Ended | ||
SMD Line Filter, L7 | 1 Differential pair, 2 Single Ended | ||
JBC2 | Module TE0782...4 FPGA, Bank 111-112 | 16 Differential pair, 32 Single Ended | MGT_RX8...15, MGT_TX8...15 |
Module TE0782...4 FPGA, Bank 34 | 1 Differential pair, 2 Single Ended | J1_B34_VRP, J1_B34_VRN | |
Module TE0782...4 FPGA, Bank 34 | 1 Differential pair, 2 Single Ended | J1_B33_VRP, J1_B33_VRN | |
JBC3 | TE0790 Base, J8 | 4 Single Ended | M_TCK, M_TMS, M_TDO, M_TDI |
TE0790 Base, J7 | 4 Single Ended 2 Single Ended 1 Single Ended | TCK, TMS, TDO, TDI UART RX/TX RESIN | |
DIP Switch, S1-A | 1 Single Ended | JTAGENB | |
Module TE0782...4 FPGA, Bank 109-110 | 16 Differential pair, 32 Single Ended | MGT_RX0...7, MGT_TX0...7 |
JTAG access to the TE0782...4 SoMs through B2B connector JMX.
JTAG Signal | B2B Connector |
---|---|
TMS | |
TDI | |
TDO | |
TCK | |
JTAG_EN |
MIO Pin | Connected to | B2B | Notes |
---|---|---|---|
Chip/Interface | Designator | Notes |
---|---|---|
MIO Pin | Schematic | U?? Pin | Notes |
---|---|---|---|
MIO Pin | Schematic | U? Pin | Notes |
---|---|---|---|
MIO Pin | I2C Address | Designator | Notes |
---|---|---|---|
MIO Pin | Schematic | U?? Pin | Notes |
---|---|---|---|
MIO Pin | I2C Address | Designator | Notes |
---|---|---|---|
Schematic | Color | Connected to | Active Level | Note |
---|---|---|---|---|
The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.
Bank | Signal Name | ETH1 | ETH2 | Signal Description |
---|---|---|---|---|
Bank | Schematic | U?? Pin | Notes |
---|---|---|---|
D-Tx | Driver Input | ||
R-Rx | Reciever Output |
Designator | Description | Frequency | Note |
---|---|---|---|
MHz | |||
MHz | |||
KHz | |||
Power supply with minimum current capability of xx A for system startup is recommended.
Power Input Pin | Typical Current |
---|---|
VIN | TBD* |
* TBD - To Be Determined
Create DrawIO object here: Attention if you copy from other page, objects are only linked.
Create DrawIO object here: Attention if you copy from other page, objects are only linked.
Create DrawIO object here: Attention if you copy from other page, objects are only linked.
Power Rail Name | B2B Connector JM1 Pin | B2B Connector JM2 Pin | B2B Connector JM3 Pin | Direction | Notes |
---|---|---|---|---|---|
Bank | Schematic Name | Voltage | Notes |
---|---|---|---|
? x ? modules use two or three Samtec Micro Tiger Eye Connector on the bottom side.
3 x REF-??????? (compatible to ????????), (?? pins, ?? per row)
Operating Temperature: -??°C ~ ??°C
Current Rating: ??A per ContactNumber of Positions: ??
Number of Rows: ??
Symbols | Description | Min | Max | Unit |
---|---|---|---|---|
V | ||||
V | ||||
V | ||||
V | ||||
V | ||||
V | ||||
V | ||||
V | ||||
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
V | See ???? datasheets. | |||
V | See Xilinx ???? datasheet. | |||
V | See Xilinx ???? datasheet. | |||
V | See Xilinx ???? datasheet. | |||
V | See Xilinx ???? datasheet. | |||
V | See Xilinx ???? datasheet. | |||
V | See Xilinx ???? datasheet. | |||
°C | See Xilinx ???? datasheet. | |||
°C | See Xilinx ???? datasheet. |
Module size: 116 mm × 116 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: ? mm.
PCB thickness: ?? mm.
Trenz shop TE0728 overview page | |
---|---|
English page | German page |
Date | Revision | Changes | Documentation Link |
---|---|---|---|
- | |||
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
Date | Revision | Contributor | Description |
---|---|---|---|
| |||
-- | all |
|
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Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
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