auf jeden Fall mit Antti Rücksprache halten
changes
Winbond => Spansion (reason: Xilinx tools support)
MEMS => footprint only (reason: abgekündigt)
enhancements
- JTAG only boot mode: now supported
TPS for DDR3 changed to smaller and cheaper one
changed MEMS sensor
fixed I2C swap PCB error
fixed mode pin issue on wrong mode spi clk connectio
changed MDIO pullup from 10k to 4k7 --
added i2c mux for internal i2c bus to MIO10/MIO11 ? --
addes support for MIO to JTAG special mux (for efuse programming)
removed testpads +
eMMC core supply moved from switched 3V to 3.3Vin no
mac eeprom auf 1.8V
changed MEMS sensor
fixed I2C swap PCB error
fixed mode pin issue on wrong mode spi clk connectio
changed MDIO pullup from 10k to 4k7 --
added i2c mux for internal i2c bus to MIO10/MIO11 ? --
addes support for MIO to JTAG special mux (for efuse programming)
removed testpads +
eMMC core supply moved from switched 3V to 3.3Vin no
mac eeprom auf 1.8V
Overview
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