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auf jeden Fall mit Antti Rücksprache halten

changes

Winbond => Spansion  (reason: Xilinx tools support)

MEMS => footprint only (reason: discontinued)

enhancements

  • JTAG only boot mode: now supported

 

 

TPS for DDR3 changed to smaller and cheaper one
changed MEMS sensor
fixed I2C swap PCB error
fixed mode pin issue on wrong mode spi clk connectio
changed MDIO pullup from 10k to 4k7 --
added i2c mux for internal i2c bus to MIO10/MIO11 ? --
addes support for MIO to JTAG special mux (for efuse programming)
removed testpads +
eMMC core supply moved from switched 3V to 3.3Vin no
mac eeprom auf 1.8V

Issuer

Trenz Electronic GmbH

Place

Bünde, Germany, EU

Code

PCN-201406xx

Title

TE0720-01 to TE0720-02

Subject

Trenz Electronic TE0720 SoM (system on module): revision 1 to revision 2 upgrade

Change Level

major

Products Affected

 

affected productsuggested upgrade
TE0720-01-1CFTE0720-02-1CF
TE0720-01-1CF1TE0720-02-1CF
TE0720-01-1CRTE0720-02-1CR
TE0720-01-2EFTE0720-02-2EF
TE0720-01-2ER 
TE0720-01-2IFTE0720-02-2IF
TE0720-01-2IFC1TE0720-02-2IF
TE0720-01-2IFC2TE0720-02-2IF

Description of Change

Reason for Change

Application Impact

Proposed Countermeasures

Method of Identification

Method of identifying changed product.

Products Affected

by this change.

Production Shipment Schedule

Qualification Data (if applicable)

Contact Information

If you have any questions related to this PCN, please contact Trenz Electronic's Technical Support at

Disclaimer

Any projected dates in this PCN are based on the most current product information at the time this PCN is being
issued, but they may change due to unforeseen circumstances.  For the latest schedule and any other information,
please contact your local Trenz Electronic sales office, technical support or local distributor.

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