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Code

PCN-201406xx

Title

TE0720-01 to TE0720-02

Subject

Trenz Electronic TE0720 SoM (system on module): revision 1 to revision 2 upgrade

Change Level

major

Issuer

Trenz Electronic GmbH

Place

Bünde, Germany, EU

Products Affected

This change affects all Trenz Electronic TE0720 SoMs of the first revision: TE0720-01-*.

affected productsuggested upgrade
TE0720-01-1CFTE0720-02-1CF
TE0720-01-1CF1TE0720-02-1CF
TE0720-01-1CRTE0720-02-1CR
TE0720-01-2EFTE0720-02-2EF
TE0720-01-2ERcontact us
TE0720-01-2IFTE0720-02-2IF
TE0720-01-2IFC1TE0720-02-2IF
TE0720-01-2IFC2TE0720-02-2IF

Description of Change

  1. enhancement: JTAG only boot mode (question) is now supported.
  2. enhancement: Winbond W25Q256FV SPI Flash memory replaced with Spansion S25FL256.
  3. replacement: Texas Instruments TPS51200 Sink/Source DDR Termination Regulator replaced with TPS51206.

  4. change: changed MDIO pullup from 10k to 4k7.

  5. change: changed eMMC core supply from switched 3.3Vout to 3.3Vin.
  6. change: MAC EEPROM power changed from 3.3V to 1.8V, no impact on user design.
  7. I2C Multiplexing no longer needed (to select between RTC and MEMS), all I2C devices are on the same bus.
  8. removal: ST LSM303DLM (e-compass: 3D accelerometer and 3D magnetometer) MEMS is no longer assembled in standard assembly variants.
  9. removal: removed test pads on top layer.
  10. enhancement: increased component clearance from mounting holes on bottom layer.
  11. enhancement: System Controller in-system programming via B2B JTAG pins.
  12. JM1 pin 89 has new function that enables System Controller JTAG Chain, no impact for old designs that connect this pin to GND.

Reason for Change

  1. Enhancement of functionality.
  2. Spansion S25FL256 is supported by current Xilinx design tools (ISE14.7, Vivado) W25Q256 is only supported by u-boot, linux and Vivado SDK Programmer.
  3. TPS51206 was changed due to BOM optimization.
  4. Avoiding potential problems when PHY management bus is configured at high speeds. 
  5. eMMC startup timing improvement.
  6. PCB and System Controller optimization.
  7. Change to new type of MEMS with only one I2C.
  8. ST LSM303DLM MEMS has been discontinued.
  9. no longer needed as the System Controller factory programming is done during tests using main B2B Connectors.
  10. decreasing the possibility to damage the module with using improper extraction methods.
  11. enhancement for Factory tests and programming.
  12. enhancement for Factory tests and programming. 

Application Impact

  1. none
  2. May have to re-evaluate applications that write to the SPI Flash
  3. none
  4. none
  5. none
  6. none
  7. none (if the old GPIO based I2C mux was used it just has no effect now)
  8. none for designs that did not use the MEMS sensor
  9. none (test pads only used at factory)
  10. none
  11. none
  12. none

Proposed Countermeasures

  1.  

Method of Identification

The model code and revision number (e.g. TE0720-01 or TE0720-02) are printed on the top side of the PCB.

Production Shipment Schedule

From June 2014.

Contact Information

If you have any questions related to this PCN, please contact Trenz Electronic's Technical Support at

Disclaimer

Any projected dates in this PCN are based on the most current product information at the time this PCN is being
issued, but they may change due to unforeseen circumstances.  For the latest schedule and any other information,
please contact your local Trenz Electronic sales office, technical support or local distributor.

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