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Table of Contents

Overview

The carrier board TEB0745 was especially designed and developed for the use of Trenz Electronic module TE0745. 

Refer to http://trenz.org/teb0745-info for the current online version of this manual and other available documentation.

Key Features

  • Module: 
    • Trenz Electronic Module TE0745
    • Temperature: -40 to 85 °C
  • On Board:
    • 24V power supply terminal
    • 1 x EMI Network Filter
    • 3 x Variable Step Down Regulator Module (VDRM) with head sink
    • 2 x Synchronous Buck Regulator
    • 2 x Button (User / Reset)
    • 2 x LED (Green)
  • Interfaces:
    • 1 x XMOD (TE0790) Pin Header (JTAG / UART)
    • 1 x Pin Header (JTAG)
    • 1 x microSD connector
    • 1 x RJ45 Ethernet connector
    • 1 x USB Host Connector
    • 8 x SFP-Connector
    • 6 x Pin Header 50 pol. (FPGA Bank I/O's and Power)
    • 6 x Pin Header 12 pol. (FPGA Bank I/O's and Power)
    • 1 x battery holder
    • 2 x DIP Switch Array (VCC_HR_B / Modi)
  • Dimension: 200 mm x 231 mm

Block Diagram

TEB0745 block diagram

Main Components

TEB0745 main components
  1. SFP+ Connector, J4 J6 J8 J10 J13 J15 J18 J20
  2. Board to Board Connector (B2B), J1 J2 J3
  3. RJ45 Gigabit Ethernet connector, J22
  4. SD card connector, J16
  5. USB connector, J41
  6. Push Button, S2 S3
  7. SDIO port expander, U15
  8. Power distribution switch, U4
  9. Battery holder, B1
  10. Mag I3C power, U26 U12 U5
  11. Push bottun switch, S1 S4
  12. Buck regulator, U6 U7
  13. I2C EEPROM, U33
  14. Low voltage chanel I2C switch, U16
  15. Overvoltage, undervoltage, reversesupply protection controller, U13
  16. EMI suppression filter, U29
  17. JTAG interface, J12
  18. Power jack, J31
  19. 8bit IO expandor for I2C bus, U18 U25
  20. Pin Headers J23...26 (Not Assembled)
  21. Pin Headers J27-J28-J32-J36 (Not Assembled)
  22. Pin Headers J37...40 (Not Assembled)

Initial Delivery State

Storage device name

Content

Notes

EEPROMEUI-64 number programmed

Can be used for MAC

Initial delivery state of programmable devices on the module

Configuration Signals

MODE Signal State

Connected toB2BStatusBoot Mode

BOOTMODE

S1J2-133OpenQSPI
ShortSD Card
Boot process.

Schematic

Connected toB2BNote
RST_IN_N

Push Button, S2

J2-131Low Active Reset
Reset process.

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

B2B ConnectorInterfacesNumber of I/ONotes
J1

User I/O

48 singel ended, 24 Differential

2 singel ended

Connected to Bank 13

48 singel ended, 24 Differential

2 singel ended

Connected to Bank 12
JTAG Interface5 single endedTCK, TDI, TMS, TDO, JTAG_EN
SFP+ Connector8 DiffSPF4....7_RX_N/P , SPF4....7_TX_N/P
J2

Ethernet PHY4 Differential
2 single endedPHY_LED0...1
USB1 DifferentialOTG_N/P
Control Signals3 single endedPS_SRST, BOOTMODE, RST_IN_N
Power Control Signal2 single endedPWR_PS_OK, PWR_PL_OK
I2C Bus2 single endedI2C_SDA, I2C_SCL
User I/O4 single endedMIO12...15

J3


User I/O6 Single endedMIO46...51
SD Card Connector6 Single endedSD_CLK, SD_CMD, SD_DAT0...3 (MIO40...45)
SFP+ Connector8 DifferentialSPF0....3_RX_N/P , SPF0....3_TX_N/P
General PL I/O to B2B connectors information

XMOD Pin Header

JTAG access to the TEB0745 SoM is available through B2B connector JB1 and JB2. JTAG_EN is connected to J1-138, JTAG_EN can be activated through DIP Switch S1-2.

Designator

Connected to

B2B Pin

XMOD Header JB1Note
AMIO15J2-129JB1-3UART TX - Input to the module
BMIO14J2-127JB1-7UART RX - Output of the module
CTCKJ1-143JB1-4JTAG interface signal
DTDOJ1-145JB1-8JTAG interface signal
FTDIJ1-142JB1-10JTAG interface signal
HTMSJ1-144JB1-12

JTAG interface signal

GRST_IN_NJ2-131JB1-11RESET will be connected to Push Button on JTAG Programmer
JTAG pins connection

There is a DIP switch, S2, on TE0790 adapter which must be set as following.

DIP Switch,S2DefaultDescription
1ONUpdate Mode JTAG access to SC CPLD only
2OFFMust be always in OFF state.
3OFFVIO is supplied from Module
4OFF3.3V is high impedance
Xmod Adapter DIP-Switch Setting Description

SFP+ Connectors

The TEB0745 is equipped with 8 SFP+ Connectors, 

PinConnected to Notes
SFP+ , J4SFP+, J6SFP+, J8SFP+, J10SFP+, J13SFP+, J15SFP+, J18SFP+, J20
TD+B2B, J3B2B, J3B2B, J3B2B, J3B2B, J1B2B, J1B2B, J1B2B, J1GT
TD-B2B, J3B2B, J3B2B, J3B2B, J3B2B, J1B2B, J1B2B, J1B2B, J1GT
RD+B2B, J3B2B, J3B2B, J3B2B, J3B2B, J1B2B, J1B2B, J1B2B, J1GT
RD-B2B, J3B2B, J3B2B, J3B2B, J3B2B, J1B2B, J1B2B, J1B2B, J1GT
TX FAULTIO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
TX DISABLE IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
MOD-DEF2 IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
MOD-DEF1IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
MOD-DEF0IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
RS0IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
LOSIO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
RS1IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25SFP_CTRL
SFP Connectors

SD Card Socket

Power supply voltage for SD card holder is 3.3V.

SignalsConnected toB2BNotes
SD_CLKMIO40J3-150
SD_CMDMIO41J3-152
SD_DAT0MIO42J3-154
SD_DAT1MIO43J3-156
SD_DAT2MIO44J3-158
SD_DAT3MIO45J3-160
SD card interface MIOs and pins

RJ45 Connector

Ethernet Socket is connected to Board to Board (B2B)  JM2.

SignalB2BNotes
PHY_MDIO0_PJ2-120
PHY_MDIO_NJ2-122
PHY_MDIO1_PJ2-126
PHY_MDIO1_NJ2-128
PHY_MDIO2_PJ2-132
PHY_MDIO2_NJ2-134
PHY_MDIO3_PJ2-138
PHY_MDIO3_NJ2-140
PHY_LED0J2-144
PHY_LED1J2-146
LAN Transformer

Test Points

Test Point

Signals

B2B Connector

Notes
TP 15V-
TP 2VBAT_INJ1-146
TP 3VCCIO18VJ2- J3
TP 4VCC_HR_BJ1
TP 5-9GND-
TP 10PS_1.8VJ2
TP 11VCC_HR_BJ1
TP 123.3VJ1- J2
TP 13--
TP 14--
TP 15PWR_PL_OKJ2- 135
TP 16PWR_PS_OKJ2-139
TP 1724V_FUSED-
TP 183.3V_SFP-
Test Points Information

On-board Peripherals


Chip/InterfaceDesignatorNotes
TEB0745 TRM#EEPROMU33

DIP Switches

S1, S4
I2C SwitchU16
I/O ExpanderU18...U25
Push ButtonsS2, S3
TEB0745 TRM#LEDsD1, D5
On board peripherals

EEPROM

MIO PinSchematicB2BNotes
MIO10I2C_SCLJ2-119
MIO11I2C_SDAJ2-121
I2C EEPROM interface MIOs and pins

I2C DeviceDesignatorI2C AddressNotes
EEPROMU330x51
I2C address for EEPROM

DIP Switches

There are two DIP Switches S1,S4.

DesignatorConnected toB2BNote
S1-ABootModeJ2-133
S1-BJTAG_ENJ1-148
S1-C-

S1-DPS_SWJ2-123
DIP Switch S1

VCC_HR_B voltage can be selected using DIP Switch S4 .

S4-1S4-2S4-3S4-4Power VCC_HR_BNotes
OFFOFFOFFN.C.1,8V
OFFOFFONN.C.1,5V
OFFONOFFN.C.3,3V
OFFONONN.C.2,5V
ONOFFOFFN.C.0,8V
ONOFFONN.C.Do not use
ONONOFFN.C.1,25V
ONONONN.C.1,2V
DIP Switch S4

I2C Switch

There is a I2C Switch on the TEB0745 which can be used in order to controll the SPF+ Connectors. 

PinSchematic Connected toNotes
VCC3.3V

SCLI2C_SCLB2B, J2
SDA

I2C_SDA

B2B, J2
nRESETI2C_RSTVoltage Translator, U34
A0GNDLow I2C address is 0x72
A13.3VHighI2C address is 0x72
A2GNDLowI2C address is 0x72
SD0/ SC0SFP0_SDA / SFP0_SDASFP+ Connector, J4
SD1/ SC1SFP1_SDA / SFP1_SDASFP+ Connector, J6
SD2/ SC2SFP2_SDA / SFP2_SDASFP+ Connector, J8
SD3/ SC3SFP3_SDA / SFP3_SDASFP+ Connector, J10
SD4/ SC4SFP4_SDA / SFP4_SDASFP+ Connector, J13
SD5/ SC5SFP5_SDA / SFP5_SDASFP+ Connector, J15
SD6/ SC6SFP6_SDA / SFP6_SDASFP+ Connector, J18
SD7/ SC7SFP7_SDA / SFP7_SDASFP+ Connector, J20
I2C Switch

I2C DeviceDesignatorI2C AddressNotes
I2C DeviceU160x72
I2C Address of I2C Switch

IO Expanders

The TEB0745 is equipped with 8 I/O Expanders.

PinConnected to Notes
IO Exp, U18IO Exp, U19IO Exp, U20IO Exp, U21IO Exp, U22IO Exp, U23IO Exp, U24IO Exp, U25
nINTNot Connected Not Connected Not Connected Not Connected Not Connected Not Connected Not Connected Not Connected 
SCL

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2


SDA

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2

I2C Switch, U16

B2B, J2


A0GND3.3VGND3.3VGND3.3VGND3.3V 
A1GNDGND3.3V3.3VGNDGND3.3V 3.3V 
A2GNDGNDGNDGND3.3V3.3V 3.3V 3.3V 
VCC3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 
P0...P7SFP+, J4SFP+, J6SFP+, J8SFP+, J10SFP+, J13SFP+, J15SFP+, J18SFP+, J20
SFP Connectors
IO Expander Information

In the following table you can find I2C addresses of I/O Expanders which would be designated by pins A0,A1 and A2. 

I2C DeviceDesignatorI2C AddressNotes
I/O ExpanderU180x20
U190x21
U200x22
U210x23
U220x24
U230x25
U240x26
U250x27
I2C Addresses of I/O Expanders

Push Buttons

There are two push buttons S2, S3.

DesignatorConnected toB2BActive LevelNote
S3USR_BTNJ3-153Active high
S2RST_IN_NJ2-131Active highGeneral Reset
On-board push button =s

LEDs

DesignatorColorB2BConnected toActive LevelNote
D1GreenJ3-149MIO48Active HighLED1
D5GreenJ3-151MIO49Active HighLED2
On-board LEDs

Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of 2.5 A for system startup is recommended.

Power Consumption

Power Input VoltageTypical Current
24VTBD*
VBATTBD*
Power Consumption

* TBD - To Be Determined

Power Distribution Dependencies

Power Distribution

Power-On Sequence

Power Sequency

Power Rails

Power Rail Name

B2B Connector

JM1 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

DirectionNotes
3.3V

147, 149, 151, 153,
155, 157, 159

154, 156, 158,160-OutputPL_VIN
VCCIO1254, 55--Outputhigh range bank I/O voltage
VCCIO13112, 113--Outputhigh range bank I/O voltage
VCCIO33--115, 120Outputhigh performance bank I/O voltage
VCCIO34-29, 30-Outputhigh performance bank I/O voltage
VCCIO35-87, 88-Outputhigh performance bank I/O voltage
VBAT_IN146--OutputRTC (battery-backed) supply voltage
PS_1.8V-130-Inputinternal 1.8V voltage level (Process System)
Module power rails.

Board to Board Connectors

5.2 x 7.6 cm SoM Kintex modules use three Samtec Razor Beam LP Terminal Strip (ST5) on the bottom side.
  • 3x REF-192552-02 (160-pins)
    • ST5 Mates with SS5

5.2 x 7.6 cm SoM Kintex carrier use three Samtec Razor Beam LP Socket Strip (SS5) on the top side.

  • 3x REF192552-01 (160-pins)
    • SS5 Mates with ST5

Technical Specifications

Absolute Maximum Ratings

SymbolsMinMaxUnitNote
VIN Supply Voltage024V
Storage Temperatur-25+85°C
PS absolute maximum ratings

Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution.

ParameterMinMaxUnitsReference Document
VIN Supply Voltage2025.4VSee LTC4365ITS8 Datasheet
Operating Temperatur-40+85°C
Recommended operating conditions.

Physical Dimensions

  • Module size: 200 mm x 231 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 3.5 mm.

  • PCB thickness: 1.6 mm.

Physical dimensions drawing

Currently Offered Variants 

Trenz shop TEB0745 overview page
English pageGerman page
Trenz Electronic Shop Overview

Revision History

Hardware Revision History

DateRevisionChangesDocumentation Link
2018-12-0602a
  • Resistors R14 and R15 was replaced by 953R (was 5K1)
  • Resistor R5 was replaced by 5K1, R8 by 953R (was 9K09 and 1K69 respectively)
REV02-A
2018-10-1902
  • U16 I2C expander: address set to 0x72
  • U33 EEPROM: address set to 0x51. Added variant to set address 0x52.
  • Changed power up sequence: 24V_FUSED -> 3.3V (Module power up) -> 5V -> VCCIO18, VCC_HR_B, 3.3V_SFP
  • Fixed PCB patch: U6 pin 18 connected to 5V, pin 19 connected to GND.
  • JTAG connector J30 VREF (pin2) and XMOD VIO (pin 6) connected to 3.3V. XMOD IO A, B, E, G connected to module MIO via level translator U8.
  • Pull-up for BOOTMODE and PS_SW (DIP switch S1), RST_IN_N and USR_BTN (front panel buttons S2, S3) changed from VCCIO18 to PS_1.8V; JTAG_EN connected to 3.3V via DIP switch (S1).
  • Added switch S4 for selecting of output voltage of DCDC U7 (VCC_HR_B, HR banks VCCO)
REV02
2016-05-2501-REV01
Hardware Revision History

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Board hardware revision number.

Document Change History

DateRevisionContributorDescription

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  • Correction power sequencing picture

2019-012-08v.134Pedram Babakhani
  • Technical Specifications Update

--

all

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  • --
Document change history.

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.


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