PCN-20240611 TEBF0808-04A to TEBF0808-05 Hardware Revision Change

Products Affected

This change affects all Trenz Electronic TEBF0808 SoMs: TEBF0808-04A*.

ED: Tabelle ist fertig!

Changes

#16 Restructured power supply circuit. Power supply can be supplied either via power path ATX connector (J20) (signal "12V_input_A") → fuse 0451007.MRL (F1) (signal "12V_input_A_Fused") → protection circuit LTC4365ITS8#TRMPBF (U52) with MOSFET Si7114ADN-T1-GE3 (T2, T3) (signal "12V") or via power path power jack (J25) (signal "12V_input_B") → fuse 0451007.MRL (F2) (signal "12V_input_B_Fused") → protection circuit LTC4365ITS8#TRMPBF (U53) with MOSFET Si7114ADN-T1-GE3 ( T4, T5) (signal "12V").

Type: Schematic Change

Reason: Improve power supply architecture.

Impact: None.

#1 Changed power supply for SFP+ connector (J14) from power rail "3.3V_PCI" to power rail "3.3V_PER".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#1 Changed pull-up resistor (R18, R21, R87, R115, R121, R122) from 4.99 kOhm to 7.5 kOhm.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#1 Changed pull-up resistor voltage (R18, R21, R86, R87, R113, R114, R115, R121, R122, R123).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#1 Removed pull-up resistor (R107, R108, R117, R118, R124, R127) for SFP+ connector (J14).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#1 Changed DCDC EN5335QI (U8) to MPM3650CGQW-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

Impact: Power supply option 1.25 V removed. Minor changes in electrical characteristics. (???)

#2 Changed DCDC EN6347QI (U19) to MPM3650CGQW-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

Impact: None. Increased current output capability. Minor changes in electrical characteristics. (???)

#2 Changed DCDC EN5311QI (U28, U43) to MP2164GG-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

Impact: None. Increased current output capability. Minor changes in electrical characteristics. (???)

#3 Changed load switch TPS27082LDDCR (Q1, Q2, Q3) to MP5077GG-Z and adapted circuit.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None. Increased current output capability. Minor changes in electrical characteristics. (???)

#3 Changed impedance for differential PCIe signals to 90 Ohm differential.

Type: PCB Change

Reason: Follow PCIe recommendation.

Impact: None.

#3 Routed signals (SATA, B47_L5_P/N, Bank 48 B48_L{1...6, 8...12}_P/N signals,

Bank 64 B64_L{1...24}_P/N signals, 

Bank 65 B65_L{1...13, 15...24}_P/N signals,

Bank 66 B48_L{1...24}_P/N signals, MGT Bank 128, MGT CLK0 Bank 228, MGT Bank 228, 

MGT CLK0 Bank 229, MGT Bank 229, 

MGT CLK0 Bank 230, MGT Bank 230, MGT CLK0/1 Bank 505, CLK0,7,8, Display Port (TX, AUX, TX_AUX,

) with 100 Ohm differential impedance.

Type: PCB Change

Reason: Follow PCIe recommendation.

Impact: None.

#1 Change eMMC (U2) from MTFC16GJVEC-2M WT to SDINBDG4-8G-XI2.

Type: BOM change

Reason: EOL of Component.

Impact: None. Replacement has same capacity as used on corresponding affected variant. Reference designs for vivado versions 2019.2 and 2020.2 were tested and work properly without any changes. (???)

#17 Changed resistor (R14) from 4.99 kOHm to 2 kOhm.

Type: BOM Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#28 Added testpoint (TP17, TP20 ... TP22).

Type: Schematic Change

Reason: Voltage and system monitoring improvement. (???)

Impact: None.

#12 Changed LED (D8, D10) from 150060VS75000 to 19-213/G6C-BM1N2/DT.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None.

#1 Changed Fan F455B-05LD (M1) to Fan MF40060V2-1000U-A99 (MP1) and updated according mechanical screws and nuts.

Type: BOM change

Reason:  EOL of Component.

Impact: Specified airflow of fan decreases slightly from 0.03 m³/min to 0.028 m³/min. (???)

#12 Added assembly option (default: not fitted) for cooling solution with fan controller LM96163CISD/NOPB (U54), temperature sense MMBT3904 (T12), and AND Gate (U55) 

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#12 Connected fan controller LM96163CISD/NOPB (U54) to I2C bus (signals "SC_SCL" and "SC_SDA").

Type: Schematic Change

Reason: Fan controller handling.

Impact: None. For assembled fan controller I2C address 0x4C is used.

#12 Changed pin header (J19) from two pins to four pins.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None. Consider to use correct pins.

#7 Added module orientation mark in silkscreen top side.

Type: PCB change

Reason: Improve module orientation visibility.

Impact: None.

#7 Used resistor (R164) as pull-up resistor for signal "POK_1V8.

Type: Schematic Change

Reason: Use external pull-up resistor.

Impact: None.

#7 Changed resistor (R41) from 4.99 kOhm to 200 kOhm.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#7 Changed resistor (R40) from 4.99 kOhm to 0 Ohm.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#7 Changed resistor (R65) from 8.06 kOhm to 1 kOhm.

Type: Schematic Change

Reason: Enable OTG capability.

Impact: None. (???)

#1 Restructered PCIe clock system tree. Differential clock (signals "CLK0_N" and "CLK0_P") is distributed via new added fanout buffer NB3L202KMN (U56) to PCIe connector (J11) (signals "PCI_REF_P" and "PCI_REF_N") and B2B connector (J2) (signals "B505_CLK0_P" and "B505_CLK0_N"). Removed clock oscillator DSC1123CI2-100.0000T (U6).

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact:

#7 Changed AC coupling (C93/C94) to DC coupling (R263/R264) for differnetial clock signal "CLK0_N" and "CLK0_P".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#7 Added termination resistor (R134) assembly option for differential clock signal "CLK0_N" and "CLK0_P".

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#22 Changed capacitor (C121, C122, C123, C124, C179, C182, C185, C221, C222, C223) from 100 nF, 6.3 V, X5R to 10 nF, 10 V, X7R.

Type: Schematic Change

Reason: Follow AMD recommendation.

Impact: None.

#22 Changed capacitor (C197, C200, C202, C203) from 100 nF, 6.3 V, X5R to 10 nF, 10 V, X7R.

Type: Schematic Change

Reason: Follow SATA recommendation.

Impact: None.

#22 Changed capacitor (C69, C70) from 100 nF, 6.3 V to 220 nF, 50 V.

Type: Schematic Change

Reason: Follow PCIe recommendation.

Impact: None.

#22 Added ferrid bead (L25) for fan power supply.

Type: Schematic Change

Reason: Improve power quality.

Impact: None.

#22 Changed capacitor (C39, C82, C207) from 4.7 µF, 6.3 V to 10 µF, 10 V.

Type: Schematic Change

Reason: Harmonize with TEBF0818 series.

Impact: None.

#22 Changed power inductor (L8, L9, L11, L12) from 1 µH to 4.7 µH.

Type: Schematic Change

Reason: Follow SFP+ recommendation.

Impact: None.

#22 Changed capacitor (C47, C48, C50, C52, C57, C58, C60, C62) from 470 nF, 6.3 V to 100 nF, 10 V.

Type: Schematic Change

Reason: Follow SFP+ recommendation.

Impact: None.

#22 Changed capacitor (C49, C51, C59, C61) from 10 µF, 6.3 V, 0603 to 22 µF, 25 V, 0805.

Type: Schematic Change

Reason: Follow SFP+ recommendation.

Impact: None.

#16 Added additional decoupling capacitor (C263). 

Type: Schematic Change

Reason: Improve power supply.

Impact: None.

#33 Added legal notices, system and power overview. Updated revision history. Updated page count and order. 

Type: Documentation Update

Reason: Documentation improvement.

Impact: None.

#1

Type:

Reason: 

Impact:

Method of Identification

Production Shipment Schedule

From XXXXX, after old stock is gone. If the new revision is not suitable for your application and still the former revision of the board is needed, please contact us.

This PCN follows JEDEC Standard J-STD-046.