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The Trenz Electronic TEB0707 is a carrier for 4 x 5 Trenz Electronic modules. It provides three high speed and one low speed CRUVI extension connectors. For more information, please refer to the CRUVI B2B Connectors. The TEB0707 is integrated with an Intel MAX10 FPGA as system controller and is equipped with a Micro USB2.0 Socket with FTDI to JTAG/UART solution, RJ45 LAN Socket, USB A Socket, Micro SD Card Socket, User LEDs, Push Buttons and DIP Switches for controlling the SoM.
Refer to http://trenz.org/teb0707-info for the current online version of this manual and other available documentation.
Storage device name | Content | Notes |
---|---|---|
EEPROM | Programmed | FTDI Configuration |
MODE Signal State | Boot Mode |
---|---|
MODE | Boot Mode:
|
PROGMODE | Programming Mode:
|
Signal | Connected to | I/O | Note |
---|---|---|---|
Reset | Push Button, S2 | Out | Module Reset signal |
Interfaces and Number of I/O signals connected to the B2B connectors for Trenz 4x5 modules:
B2B Connector | Interface | I/O Signal Count | Connected to | Notes |
---|---|---|---|---|
JB1 | Ethernet LAN | 4x Diff pairs | RJ45 Socket, J2 | |
SD Card | 6 x Single Ended | IO Expander, U4 | ||
I/Os | 20x Single Ended | MAX10 FPGA Bank 6, U6 | ||
CRUVI | 12x Diff pairs/24x Single ended 4x Single Ended | High Speed CRUVI, J12 | CRUVI C | |
SoM Control Signals | 5x Single Ended | MAX10 FPGA, U6 | ||
I/Os | 8x Single ended | MAX10 FPGA Bank 8, U6 | ||
JB2 | CRUVI | 12x Diff pairs/24x Single ended 4x Single Ended | High Speed CRUVI, J10 | CRUVI A |
CRUVI | 6x Diff pairs/12x Single ended | High Speed CRUVI, J11 | CRUVI B | |
JTAG | 4x Single Ended | FPGA Bank 5, U6 | ||
JB3 | CRUVI | 6x Diff pairs/12x Single ended 4x Single Ended | High Speed CRUVI, J11 | CRUVI B |
USB | 1x Diff pair, 2x Single Ended | USB A, J9 |
The TEMB0707 is equipped with a Low Speed Connectors J 13 and three High Speed Connector J10...12. These connectors are provided for CRUVI extension cards. More information is provided in the B2B Connectors section.
Speed | Designators | Schematic | Connected to | Notes |
---|---|---|---|---|
High | CRUVI C, J12 | A0...A5 (N/P) | B2B, JB1 | |
B0...B5 (N/P) | B2B, JB1 | |||
MODE, REFCLK, SMB_ALERT, SMB_SDA, SMB_SCL, SEL, DO, DI, SCK | MAX10 FPGA Bank 8, U6 | 3.3V User IOs (Max10 Firmware dependent) | ||
HSIO, HI, HO, RESET | B2B, JB1 | |||
High | CRUVI B, J11 | A0...A5 (N/P) | B2B, JB1 | |
B0...B5 (N/P) | B2B, JB1 | |||
MODE, REFCLK, SMB_ALERT, SMB_SDA, SMB_SCL, SEL, DO, DI, SCK | MAX10 FPGA Bank 2/3, U6 | 3.3V User IOs (Max10 Firmware dependent) | ||
HSIO, HSI, HSO, RESET | B2B, JB3 | |||
High | CRUVI A, J13 | A0...A5 (N/P) | B2B, JB2 | |
B0...B5 (N/P) | B2B, JB2 | |||
MODE, REFCLK, SMB_ALERT, SMB_SDA, SMB_SCL, SEL, DO, DI, SCK | MAX10 FPGA Bank 2/3, U6 | 3.3V User IOs (Max10 Firmware dependent) | ||
HSIO, HSI, HSO, RESET | B2B, JB2 | |||
Low | CRUVI | X0...X7 | MAX10 FPGA Bank 1A, U6 |
JTAG signals form FTDI U8 are routed to MAX10 CPLD. Via dip setting JTAG of MAX10 or JTAG of the connected Trenz 4x5 module can be selected. Forwarding signals to SoM is MAX10 Firmware dependent.
JTAG Signal | MAX10 Pin Bank 1B, U6 | Connected to |
---|---|---|
TMS | G1 | FTDI (U8) - ADBUS3 |
TDI | F5 | FTDI (U8) - ADBUS1 |
TDO | F6 | FTDI (U8) - ADBUS2 |
TCK | G2 | FTDI (U8) - ADBUS0 |
JTAGEN | E5 | Dip S1-4 |
JTAG access to the Trenz 4x5 module is through B2B connector JB2.
JTAG Signal | MAX10 Pin Bank5, U6 | B2B Connector |
---|---|---|
M_TMS | L12 | JB2-94 |
M_TDI | L13 | JB2-96 |
M_TDO | J10 | JB2-100 |
M_TCK | H8 | JB2-98 |
VCCJTAG | J11, J12 | JB2-92 |
The TEB0707 is equipped with an Micro SD Card slot, J8. For levelshifting an IO Expander (U4) is used.
Pin | Schematic | Connected to | Notes |
---|---|---|---|
DAT0...3 | ESD_DAT0...3 | B2B, JB1 | Through IO Expander, U4 |
CMD | ESD_CMD | B2B, JB1 | Through IO Expander, U4 |
VDD | 3.3V_SD | B2B, JB1 | Through IO Expander, U4 |
CLK | ESD_CLK | B2B, JB1 | Through IO Expander, U4 |
DLT | SD_CD | FPGA Bank 3, U6 | Card detect. |
There is a micro USB2.0 Socket, J15 provided in order to communicate with the FTDI, U8.
Pin | Schematic | Connected to | Notes |
---|---|---|---|
D+ | O2-D_P | B2B, JB3 | Through Line Filter, L4 |
D- | O2-D_N | B2B, JB3 | Through Line Filter, L4 |
Vbus | VBUS | B2B, JB3 |
The SoM USB 2.0 signals are routed to a USB A socket (host).
Pin | Schematic | Connected to | Notes |
---|---|---|---|
Data+ | O2-D_P | B2B, JB3 | Through Line Filter, L1 |
Data- | O2-D_N | B2B, JB3 | Through Line Filter, L1 |
VCC | USB_VBUS | B2B, JB3 |
There is a RJ45 Ethernet LAN MagJack, J2 connected to B2B, JB1.
Pin | Schematic | Connected to | Notes |
---|---|---|---|
2 | PHY_MDI0_P | B2B, JB1 | |
3 | PHY_MDI0_N | B2B, JB1 | |
4 | PHY_MDI1_P | B2B, JB1 | |
5 | PHY_MDI1_N | B2B, JB1 | |
6 | PHY_MDI2_P | B2B, JB1 | |
7 | PHY_MDI2_N | B2B, JB1 | |
8 | PHY_MDI3_P | B2B, JB1 | |
9 | PHY_MDI3_N | B2B, JB1 | |
VCC | ETH-VCC | B2B, JB1 | |
Green LED | ETH1_LED0 | Intel MAX 10, U6 | MAX10 Firmware dependent |
Yellow LED | ETH1_LED1 | Intel MAX 10, U6 | MAX10 Firmware dependent |
There are three Jumpers provided to choose the CRUVI Extension power voltage.
Designator | Schematic | Connected to | Notes |
---|---|---|---|
J14 | VCCIO_CC | B2B, JB2 | CRUVI C |
J16 | VCCIO_CB | B2B, JB2 | CRUVI B |
J17 | VCCIO_CA | B2B, JB2 | CRUVI A |
Designator | Schematic | Connected to | Notes |
---|---|---|---|
J3 | VBAT | B2B, JB1 |
Test Point | Signal | Connected to | Notes |
---|---|---|---|
TP1 | 3.3V | Regulator, U1 | |
TP2 | VIN | Voltage Protection, U2 | |
TP4 | IOV | Regulator, U3 | |
TP5 | 3.3V | Power Switch, Q1 | |
TP6 | C5VIN | Power Switch, Q2 |
Chip/Interface | Designator | Notes |
---|---|---|
Intel MAX 10 | U6 | |
FTDI | U8 | |
105698015 | U10 | FTDI, programmed with Xilinx licence |
Oscillator | U7 | |
105698015 | D1...8 | |
DIP Switch | S1 | |
Push Buttons | S2, S3 |
The TEB0707 is quipped with an Intel Max10 as CPLD used for levelshifting of 3.3V signals on CRUVI connectors, JTAG/UART forward to modules, Module control pis, power sequencing and IO voltage selection along with providing User Push buttons, LEDs and switches. For complete information, please see the TEB0707 MAX10 CPLD.
The FTDI chip (U8) converts signals from USB2 to variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the capacity of the FT2232H chip which is used in Multi-Protocol Synchronous Serial Engine (MPPSE) mode for JTAG.
The configuration of FTDI FT2232H chip is pre-programmed on the EEPROM U10.
Pin | Schematic | Connected to | Notes |
---|---|---|---|
ADBUS0 | TCK | FPGA Bank 1B, U6 | JTAG interface |
ADBUS1 | TDI | FPGA Bank 1B, U6 | |
ADBUS2 | TDO | FPGA Bank 1B, U6 | |
ADBUS3 | TMS | FPGA Bank 1B, U6 | |
BDBUS0 | F_UART_TX | FPGA Bank 1B, U6 | UART Transmitter output |
BDBUS1 | F_UART_RX | FPGA Bank 1B, U6 | UART Receiver Input |
OSCI | OSCI | Oscillator, U7 | Clock 12 MHz |
EECS | EECS | EEPROM, U10 | EEPROM Contains FTDI configuration |
EECLK | EECLK | EEPROM, U10 | |
EEDATA | EEDATA | EEPROM, U10 | |
DM/DP | FD_N/ FD_P | Micro USB, J15 | USB to UART |
nRESET | 3.3V | 3.3V |
The functions of the LEDs are MAX10 Firmware dependent. See TEB0707 MAX10 CPLD LEDs.
Designator | Color | Schematic | Connected to | Active Level | Note |
---|---|---|---|---|---|
D1 | green | LED3 | FPGA Bank 8 | Active High | |
D2 | green | LED5 | FPGA Bank 8 | Active High | |
D3 | green | LED7 | FPGA Bank 8 | Active High | |
D4 | red | LED4 | FPGA Bank 3 | Active High | |
D5 | red | LED6 | FPGA Bank 2 | Active High | |
D6 | red | LED8 | FPGA Bank 8 | Active High | |
D7 | red | LED2 | FPGA Bank 3 | Active High | |
D8 | green | LED1 | FPGA Bank 3 | Active High |
The EEPROM IC, U8 contains the FTDI configuration and is prprogrammed with Xilinx JTAG licence.
Pin | Schematic | Connected to | Notes |
---|---|---|---|
CS | EECS | FTDI, U8 | |
CLK | EECLK | FTDI, U8 | |
DIN | EEDATA | FTDI, U8 |
There is a DIP Switch provided for user controlling of settings. Dip1..3 are connected to MAX10 CPLD and therefore function is Firmware dependent, see TEB0707 MAX10 Dips.
Pin | Schematic | Function (in standard Firmware) | Notes |
---|---|---|---|
DIP1 | DIP1 | Forwarded to IO so SoM | MAX10 firmware dependent. |
DIP2 | DIP2 | IO Voltage selection | 1.8V ('high', open, OFF), 2.5V ('low', closed, ON) |
DIP3 | DIP3 (PROGMODE) | Programming mode (JTAG selection on Trenz 4x5 module) | Select between FPGA/SoC (high, open, OFF ) or CPLD (low, closed, ON), MAX10 firmware dependent. |
DIP4 | JTAGEN | JTAG Selection | JTAG mode between CPLD (high, closed, ON) or SoM (low, open, OFF) |
Buttons are connected MAX10 CPLD and therefore function is Firmware dependent, see TEB0707 MAX10 CPLD Buttons
Designator | Schematic | Function (in standard Firmware) | Notes |
---|---|---|---|
S2 | RESET | SoM Reset | Hardware debounced. |
S3 | BUTTON1 | User Button | debounced in Max10 FPGA |
MEMS U7 Oscillator is nedded for FTDI. It is additionally connectd to MAX 10 FPGA Bank 2 Pin H4 and can be used in custom Firmware.
Designator | Description | Frequency | Note |
---|---|---|---|
U7 | MEMS Oscillator | 12 MHz |
Power supply with minimum current capability of 3 A for system startup is recommended.
Power Input Pin | Typical Current |
---|---|
VIN | TBD* |
* TBD - To Be Determined
Power Rail Name | B2B Connector JB1 Pin | B2B Connector JB2 Pin | B2B Connector JB3 Pin | Direction | Notes |
---|---|---|---|---|---|
VCCIO_CA | - | 8, 10 | - | Output | |
VCCIO_CB | - | 2, 4, 6 | - | Output | |
VCCIO_CC | 10, 12 | - | - | Output | |
3.3V | 14, 16 | - | - | Output | |
M1.8VOUT | 40 | - | - | Input | |
M3.3VOUT | - | 9, 11 | - | Input | |
ETH-VCC | 13 | - | - | Input |
Below MAX10 CPLD Bankvoltages are summarized.
Bank | Schematic Name | Voltage | Notes |
---|---|---|---|
Bank 1A | 3.3V | 3.3V | |
Bank 1B | 3.3V | 3.3V | |
Bank 2 | 3.3V | 3.3V | |
Bank 3 | 3.3V | 3.3V | |
Bank 5 | VCCJTAG | from SoM | |
Bank 6 | VCCIO_CC | Variable | |
Bank 8 | 3.3V | 3.3V |
These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.
4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.
When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height
Order number | Connector on baseboard | compatible to | Mating height |
---|---|---|---|
23836 | REF-189016-01 | LSHM-150-02.5-L-DV-A-S-K-TR | 6.5 mm |
LSHM-150-03.0-L-DV-A-S-K-TR | LSHM-150-03.0-L-DV-A-S-K-TR | 7.0 mm | |
23838 | REF-189016-02 | LSHM-150-04.0-L-DV-A-S-K-TR | 8.0 mm |
LSHM-150-06.0-L-DV-A-S-K-TR | LSHM-150-06.0-L-DV-A-S-K-TR | 10.0mm | |
26125 | REF-189017-01 | LSHM-130-02.5-L-DV-A-S-K-TR | 6.5 mm |
LSHM-130-03.0-L-DV-A-S-K-TR | LSHM-130-03.0-L-DV-A-S-K-TR | 7.0 mm | |
24903 | REF-189017-02 | LSHM-130-04.0-L-DV-A-S-K-TR | 8.0 mm |
LSHM-130-06.0-L-DV-A-S-K-TR | LSHM-130-06.0-L-DV-A-S-K-TR | 10.0mm |
The module can be manufactured using other connectors upon request.
The LSHM connector speed rating depends on the stacking height; please see the following table:
Stacking height | Speed rating |
---|---|
12 mm, Single-Ended | 7.5 GHz / 15 Gbps |
12 mm, Differential | 6.5 GHz / 13 Gbps |
5 mm, Single-Ended | 11.5 GHz / 23 Gbps |
5 mm, Differential | 7.0 GHz / 14 Gbps |
Current rating of Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).
CRUVI carrier use on top side:
Mating height of the high speed connectors is 5mm. The low speed connectors mate correctly within a range from 4.78 mm to 5.29 mm.
Current rating of High Speed B2B connectors is 1.6A per pin (2 pins powered).
Current rating of Low Speed B2B connectors is 4.1A per pin (2 pins powered).
There is no data available for the connectors actual used here. Data available for other stacking heights of same connectors is summarized in the folllowing table:
Connector | Speed ratings |
---|---|
ST4/SS4 single ended (4mm stacking height!) | 13.5GHz / 27 Gbps |
ST4/SS4 differential (4mm stacking height!) | 15.5 GHz / 31 Gbps |
TMMH/CLT single ended (4.77mm stacking height!) | 5.5GHz / 11 Gbps |
All connectors are specified for a temp. range of -55 °C to 125 °C.
Symbols | Description | Min | Max | Unit |
---|---|---|---|---|
5VIN | Input supply Voltage | -40 | 60 | V |
T_STG | Storage Temperature | -40 | 85 | °C |
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
Input supply Voltage | 4.06 | 5.58 | V | See the OV/UV in the carrier datasheets. |
T_OPT | 0 | 70 | °C | See Push Button datasheet. |
Module size: 135 mm × 68 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 4 mm.
PCB thickness: 1.7 mm.
Trenz shop TEB0707 overview page | |
---|---|
English page | German page |
Date | Revision | Changes | Documentation Link |
---|---|---|---|
2020-11-20 | REV02 | first production release | REV02 |
2020-04-01 | REV01 | Prototypes | - |
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
Date | Revision | Contributor | Description |
---|---|---|---|
| |||
-- | all |
|
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