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Overview

The Trenz Electronic TEB0707 is a carrier for 4 x 5 Trenz Electronic modules. It provides three high speed and one low speed CRUVI extension connectors. For more information, please refer to the CRUVI B2B Connectors. The TEB0707 is integrated with an Intel MAX10 FPGA as system controller and is equipped with a Micro USB2.0 Socket with FTDI to JTAG/UART solution, RJ45 LAN Socket, USB A Socket, Micro SD Card Socket, User LEDs, Push Buttons and DIP Switches for controlling the SoM.

Refer to http://trenz.org/teb0707-info for the current online version of this manual and other available documentation.

Key Features

  • Modules
    • 4x5 Trenz Electronic modules
  • RAM/Storage
    • EEPROM (FTDI Configuration)
  • On Board
    • Intel Max 10 FPGA
    • FTDI FT2223
    • 6x User LEDs (3x green, 3x red)
    • 2x Status LED
    • DIP Switch
    • Push Buttons
  • Interface
    • Gigabit RJ45 LAN socket
    • SD Card socket
    • Micro USB2.0 Socket
    • USB A Socket
    • 3x High Speed CRUVI B2B Connectors
    • 1x Low Speed CRUVI B2B Connector
    • 4x Jumpers
  • Power
    • 5V Input Power Supply 
  • Dimension
    • 135 x 68 mm
  • Notes


Block Diagram


TEB0707 block diagram

Main Components

TEB0707 main components
  1. Barrel Jack Power Supply, J1
  2. Voltage Regulator, U1
  3. Micro SD Card Socket, J8
  4. Micro USB2.0 Socket, J15
  5. FT2232H FTDI, U8
  6. USB A Socket, J9
  7. RJ45 LAN Socket, J2
  8. SDIO Port Expander, U4
  9. Jumpers, J4...7
  10. Push Button (Reset), S2
  11. DIP Switch, S1
  12. B2B Connector, JB3
  13. B2B Connector, JB2
  14. B2B Connector, JB1
  15. Intel MAX 10 FPGA, U6
  16. High Speed CRUVI Connector, J10
  17. High Speed CRUVI Connector, J11
  18. High Speed CRUVI Connector, J12
  19. Low Speed CRUVI Connector, J13
  20. User Push Button, S3
  21. Pin header, J3

Initial Delivery State

Storage device name

Content

Notes

EEPROMProgrammed

FTDI Configuration

Initial delivery state of programmable devices on the module

Configuration Signals

MODE Signal State

Boot Mode

MODE

Boot Mode:

  • SD Card (Low)
  • QSPI (High)
PROGMODE

Programming Mode:

  • select between CPLD (low, closed, on)
  • on SoM or FPGA/SoC (high, open, off )
Boot process.

Signal

Connected toI/ONote

Reset

Push Button, S2OutModule Reset signal
Reset process.

Signals, Interfaces and Pins

Board to Board (B2B)

Interfaces and Number of I/O signals connected to the B2B connectors for Trenz 4x5 modules:

B2B ConnectorInterfaceI/O Signal CountConnected toNotes
JB1


Ethernet LAN4x Diff pairsRJ45 Socket, J2
SD  Card6 x Single EndedIO Expander, U4
I/Os20x Single EndedMAX10 FPGA Bank 6, U6
CRUVI

12x Diff pairs/24x Single ended

4x Single Ended

High Speed CRUVI, J12CRUVI C
SoM Control Signals5x Single EndedMAX10 FPGA, U6
I/Os8x Single endedMAX10 FPGA Bank 8, U6
JB2

CRUVI

12x Diff pairs/24x Single ended

4x Single Ended

High Speed CRUVI, J10CRUVI A
CRUVI6x Diff pairs/12x Single endedHigh Speed CRUVI, J11CRUVI B
JTAG4x Single EndedFPGA Bank 5, U6
JB3CRUVI

6x Diff pairs/12x Single ended

4x Single Ended

High Speed CRUVI, J11CRUVI B
USB 

1x Diff pair,

2x Single Ended

USB A, J9
General PL I/O to B2B connectors information

CRUVI B2B Connectors

The TEMB0707 is equipped with a Low Speed Connectors J 13 and three High Speed Connector J10...12. These connectors are provided for CRUVI extension cards. More information is provided in the  B2B Connectors section.

SpeedDesignatorsSchematicConnected toNotes
High



CRUVI C, J12A0...A5 (N/P)B2B, JB1
B0...B5 (N/P)B2B, JB1
MODE, REFCLK, SMB_ALERT, SMB_SDA, SMB_SCL, SEL, DO, DI, SCKMAX10 FPGA Bank 8, U63.3V User IOs (Max10 Firmware dependent)
HSIO, HI, HO, RESET B2B, JB1
High


CRUVI B, J11A0...A5 (N/P)B2B, JB1
B0...B5 (N/P)B2B, JB1
MODE, REFCLK, SMB_ALERT, SMB_SDA, SMB_SCL, SEL, DO, DI, SCKMAX10 FPGA Bank 2/3, U63.3V User IOs (Max10 Firmware dependent)
HSIO, HSI, HSO, RESET B2B, JB3
High



CRUVI A, J13



A0...A5 (N/P)B2B, JB2
B0...B5 (N/P)B2B, JB2

MODE, REFCLK, SMB_ALERT, SMB_SDA, SMB_SCL, SEL, DO, DI, SCK

MAX10 FPGA Bank 2/3, U63.3V User IOs (Max10 Firmware dependent)
HSIO, HSI, HSO, RESET B2B, JB2
LowCRUVIX0...X7MAX10 FPGA Bank 1A, U6
CRUVI B2B connectors information


JTAG Interface

JTAG signals form FTDI U8  are routed to MAX10 CPLD. Via dip setting JTAG of MAX10 or JTAG of the connected Trenz 4x5 module can be selected. Forwarding signals to SoM is MAX10 Firmware dependent.

JTAG Signal

MAX10 Pin Bank 1B, U6

Connected to

TMSG1FTDI (U8) - ADBUS3
TDIF5FTDI (U8) - ADBUS1
TDOF6FTDI (U8) - ADBUS2
TCKG2

FTDI (U8) - ADBUS0

JTAGENE5Dip S1-4
JTAG pins connection

JTAG access to the Trenz 4x5 module is through B2B connector JB2.

JTAG Signal

MAX10 Pin Bank5, U6

B2B Connector

M_TMSL12JB2-94
M_TDIL13JB2-96
M_TDOJ10JB2-100
M_TCKH8

JB2-98

VCCJTAGJ11, J12JB2-92
JTAG pins connection

SD Card socket

The TEB0707 is equipped with an Micro SD Card slot, J8. For levelshifting an IO Expander (U4) is used.

Pin SchematicConnected toNotes
DAT0...3ESD_DAT0...3B2B, JB1Through IO Expander, U4
CMDESD_CMDB2B, JB1Through IO Expander, U4
VDD3.3V_SDB2B, JB1Through IO Expander, U4
CLKESD_CLKB2B, JB1Through IO Expander, U4
DLTSD_CDFPGA Bank 3, U6Card detect.
USB2.0 Socket information

Micro USB2.0 Socket

There is a micro USB2.0 Socket, J15 provided in order to communicate with the FTDI, U8.

Pin SchematicConnected toNotes
D+O2-D_PB2B, JB3Through Line Filter, L4
D-O2-D_NB2B, JB3Through Line Filter, L4
VbusVBUSB2B, JB3
Micro USB2.0 Socket information

 USB A Socket

The SoM USB 2.0 signals are routed to a USB A socket (host).

Pin SchematicConnected toNotes
Data+O2-D_PB2B, JB3Through Line Filter, L1
Data-O2-D_NB2B, JB3Through Line Filter, L1
VCCUSB_VBUSB2B, JB3
USB A Socket information

RJ45 LAN Socket

There is a RJ45 Ethernet LAN MagJack, J2 connected to B2B, JB1.

Pin SchematicConnected toNotes
2PHY_MDI0_PB2B, JB1
3PHY_MDI0_NB2B, JB1
4PHY_MDI1_PB2B, JB1
5PHY_MDI1_NB2B, JB1
6PHY_MDI2_PB2B, JB1
7PHY_MDI2_NB2B, JB1
8PHY_MDI3_PB2B, JB1
9PHY_MDI3_NB2B, JB1
VCCETH-VCCB2B, JB1
Green LEDETH1_LED0Intel MAX 10, U6MAX10 Firmware dependent
Yellow LEDETH1_LED1Intel MAX 10, U6MAX10 Firmware dependent
RJ45 LAN Socket information

Jumpers

There are three Jumpers provided to choose the CRUVI Extension power voltage.

DesignatorSchematicConnected toNotes
J14VCCIO_CCB2B, JB2CRUVI C
J16VCCIO_CBB2B, JB2CRUVI B
J17VCCIO_CAB2B, JB2CRUVI A
Jumpers information

Pin Header

DesignatorSchematicConnected toNotes
J3VBATB2B, JB1
Jumpers information

Test Points

Test PointSignalConnected toNotes
TP13.3VRegulator, U1
TP2VINVoltage Protection, U2
TP4IOVRegulator, U3
TP53.3VPower Switch, Q1
TP6C5VINPower Switch, Q2
Test Points Information

On-board Peripherals

Chip/InterfaceDesignatorNotes
Intel MAX 10U6
FTDIU8
TEB0707 TRM#EEPROMU10FTDI, programmed with Xilinx licence
OscillatorU7
TEB0707 TRM#LEDsD1...8
DIP SwitchS1
Push ButtonsS2, S3
On board peripherals

Intel Max10 CPLD

The TEB0707 is quipped with an Intel Max10 as CPLD used for levelshifting of 3.3V signals on CRUVI connectors, JTAG/UART forward to modules, Module control pis, power sequencing and IO voltage selection along with providing User Push buttons, LEDs and switches. For complete information, please see the TEB0707 MAX10 CPLD.

FTDI FT2232H

The FTDI chip (U8) converts signals from USB2 to variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the capacity of the FT2232H chip which is used in  Multi-Protocol Synchronous Serial Engine (MPPSE) mode for JTAG. 

The configuration of FTDI FT2232H chip is pre-programmed on the EEPROM U10.

PinSchematicConnected toNotes
ADBUS0TCKFPGA Bank 1B, U6JTAG interface
ADBUS1TDIFPGA Bank 1B, U6
ADBUS2TDOFPGA Bank 1B, U6
ADBUS3TMS

FPGA Bank 1B, U6

BDBUS0F_UART_TXFPGA Bank 1B, U6UART Transmitter output
BDBUS1F_UART_RXFPGA Bank 1B, U6UART Receiver Input
OSCIOSCIOscillator, U7Clock 12 MHz
EECSEECSEEPROM, U10EEPROM Contains FTDI configuration
EECLKEECLKEEPROM, U10
EEDATAEEDATAEEPROM, U10
DM/DPFD_N/ FD_PMicro USB, J15USB to UART
nRESET3.3V3.3V
FTDI chip interfaces and pins

LEDs

The functions of the LEDs are MAX10 Firmware dependent. See TEB0707 MAX10 CPLD LEDs.

DesignatorColorSchematicConnected toActive LevelNote
D1greenLED3FPGA Bank 8Active High
D2greenLED5FPGA Bank 8Active High
D3greenLED7FPGA Bank 8Active High
D4redLED4FPGA Bank 3Active High
D5redLED6FPGA Bank 2Active High
D6redLED8FPGA Bank 8Active High
D7redLED2FPGA Bank 3Active High
D8greenLED1FPGA Bank 3Active High
On-board LEDs

EEPROM

The EEPROM IC, U8 contains the FTDI configuration and is prprogrammed with Xilinx JTAG licence.

PinSchematicConnected toNotes
CSEECSFTDI, U8
CLKEECLKFTDI, U8
DINEEDATAFTDI, U8
I2C EEPROM interface MIOs and pins

DIP Switch

There is a DIP Switch provided for user controlling of settings. Dip1..3 are connected to MAX10 CPLD and therefore function is Firmware dependent, see TEB0707 MAX10 Dips.

PinSchematicFunction (in standard Firmware)Notes
DIP1DIP1Forwarded to IO so SoM

MAX10 firmware dependent.

DIP2DIP2IO Voltage selection1.8V ('high', open, OFF), 2.5V ('low', closed, ON)
DIP3DIP3 (PROGMODE)Programming mode (JTAG selection on Trenz 4x5 module)Select between FPGA/SoC (high, open, OFF ) or CPLD (low, closed, ON), MAX10 firmware dependent.
DIP4JTAGENJTAG SelectionJTAG mode between CPLD (high, closed, ON) or SoM (low, open, OFF)
DIP Switch connections

Push Buttons

Buttons are connected MAX10 CPLD and therefore function is Firmware dependent, see TEB0707 MAX10 CPLD Buttons

DesignatorSchematicFunction (in standard Firmware)Notes
S2RESETSoM ResetHardware debounced.
S3BUTTON1User Buttondebounced in Max10 FPGA
Push Buttons informations

Clock Sources

MEMS U7 Oscillator is nedded for FTDI. It is  additionally connectd to MAX 10 FPGA Bank 2 Pin H4 and can be used in custom Firmware.

DesignatorDescriptionFrequencyNote
U7MEMS Oscillator12 MHz
Osillators

Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of 3 A for system startup is recommended.

Power Consumption

Power Input PinTypical Current
VINTBD*
Power Consumption

* TBD - To Be Determined

Power Distribution Dependencies

Power Distribution

Power-On Sequence

Power Sequency

Power Rails

Power Rail Name

B2B Connector

JB1 Pin

B2B Connector

JB2 Pin

B2B Connector

JB3 Pin

DirectionNotes
VCCIO_CA-8, 10-Output
VCCIO_CB-2, 4, 6-Output
VCCIO_CC10, 12--Output

3.3V 

14, 16--Output
M1.8VOUT40--Input
M3.3VOUT-9, 11-Input
ETH-VCC13--Input
Module power rails.

Bank Voltages

Below MAX10 CPLD Bankvoltages are summarized.

Bank          

Schematic Name

Voltage

Notes
Bank 1A3.3V3.3V
Bank 1B

3.3V

3.3V
Bank 23.3V3.3V
Bank 33.3V3.3V
Bank 5VCCJTAG
from SoM
Bank 6VCCIO_CC

Variable

Bank 83.3V3.3V


Zynq SoC bank voltages.


Board to Board Connectors

These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.

4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.

  • 2 x REF-189016-02 (compatible to LSHM-150-04.0-L-DV-A-S-K-TR), (100 pins, "50" per row)
  • 1 x REF-189017-02 (compatible to LSHM-130-04.0-L-DV-A-S-K-TR), (60 pins, "30" per row) (depending on module)
Connector Mating height

When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height

Order numberConnector on baseboardcompatible toMating height
23836REF-189016-01LSHM-150-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-150-03.0-L-DV-A-S-K-TRLSHM-150-03.0-L-DV-A-S-K-TR7.0 mm
23838REF-189016-02LSHM-150-04.0-L-DV-A-S-K-TR8.0 mm

LSHM-150-06.0-L-DV-A-S-K-TRLSHM-150-06.0-L-DV-A-S-K-TR10.0mm
26125REF-189017-01LSHM-130-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-130-03.0-L-DV-A-S-K-TRLSHM-130-03.0-L-DV-A-S-K-TR7.0 mm
24903 REF-189017-02LSHM-130-04.0-L-DV-A-S-K-TR8.0 mm

LSHM-130-06.0-L-DV-A-S-K-TRLSHM-130-06.0-L-DV-A-S-K-TR10.0mm
Connectors.

The module can be manufactured using other connectors upon request.

Connector Speed Ratings

The LSHM connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
12 mm, Single-Ended7.5 GHz / 15 Gbps
12 mm, Differential

6.5 GHz / 13 Gbps

5 mm, Single-Ended11.5 GHz / 23 Gbps
5 mm, Differential7.0 GHz / 14 Gbps
Speed rating.
Current Rating

Current rating of  Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).

Connector Mechanical Ratings
  • Shock: 100G, 6 ms Sine
  • Vibration: 7.5G random, 2 hours per axis, 3 axes total


Manufacturer Documentation

  File Modified
PDF File hsc-report_lshm-lshm-05mm_web.pdf High speed test report 07 04, 2016 by Thorsten Trenz
PDF File lshm_dv.pdf LSHM catalog page 07 04, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf Recommended layout and stencil drawing 07 04, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf Technical drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189016-01.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189016-02.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189017-01.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189017-02.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File TC0923--2523_report_Rev_2_qua.pdf Design qualification test report 07 04, 2016 by Thorsten Trenz
PDF File tc0929--2611_qua(1).pdf Shock and vibration report 07 04, 2016 by Thorsten Trenz



CRUVI Connectors

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Technical Specifications

Absolute Maximum Ratings

SymbolsDescriptionMinMaxUnit
5VINInput supply Voltage-4060V
T_STGStorage Temperature-4085°C
PS absolute maximum ratings

Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

ParameterMinMaxUnitsReference Document
Input supply Voltage4.065.58VSee the OV/UV in the carrier datasheets.
T_OPT070°CSee  Push Button datasheet.
Recommended operating conditions.

Physical Dimensions

  • Module size: 135 mm × 68 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 4 mm.

PCB thickness: 1.7 mm.

Physical Dimension

Currently Offered Variants 

Trenz shop TEB0707 overview page
English pageGerman page
Trenz Electronic Shop Overview

Revision History

Hardware Revision History


DateRevisionChangesDocumentation Link
2020-11-20REV02first production releaseREV02
2020-04-01REV01Prototypes-
Hardware Revision History

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Board hardware revision number.

Document Change History

DateRevisionContributorDescription

Martin Rohrmüller

  • Initial Reslease

--

all

  • --
Document change history.

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.



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