Table of Contents
The Trenz Electronic TEB0707 is a carrier for 4 x 5 Trenz Electronic modules. It provides three high speed and one low speed CRUVI extension connectors. For more information, please refer to the CRUVI B2B Connectors. The TEB0707 is integrated with an Intel MAX10 FPGA as system controller and is equipped with a Micro USB2.0 Socket with FTDI to JTAG/UART solution, RJ45 LAN Socket, USB A Socket, Micro SD Card Socket, User LEDs, Push Buttons and DIP Switches for controlling the SoM.
Refer to http://trenz.org/teb0707-info for the current online version of this manual and other available documentation.
- 4x5 Trenz Electronic modules
- EEPROM (FTDI Configuration)
- On Board
- Intel Max 10 FPGA
- FTDI FT2223
- 6x User LEDs (3x green, 3x red)
- 2x Status LED
- DIP Switch
- Push Buttons
- Gigabit RJ45 LAN socket
- SD Card socket
- Micro USB2.0 Socket
- USB A Socket
- 3x High Speed CRUVI B2B Connectors
- 1x Low Speed CRUVI B2B Connector
- 4x Jumpers
- 5V Input Power Supply
- 135 x 68 mm
- Barrel Jack Power Supply, J1
- Voltage Regulator, U1
- Micro SD Card Socket, J8
- Micro USB2.0 Socket, J15
- FT2232H FTDI, U8
- USB A Socket, J9
- RJ45 LAN Socket, J2
- SDIO Port Expander, U4
- Jumpers, J4...7
- Push Button (Reset), S2
- DIP Switch, S1
- B2B Connector, JB3
- B2B Connector, JB2
- B2B Connector, JB1
- Intel MAX 10 FPGA, U6
- High Speed CRUVI Connector, J10
- High Speed CRUVI Connector, J11
- High Speed CRUVI Connector, J12
- Low Speed CRUVI Connector, J13
- User Push Button, S3
- Pin header, J3
Initial Delivery State
Storage device name
MODE Signal State
|Push Button, S2||Out||Module Reset signal|
Signals, Interfaces and Pins
Board to Board (B2B)
Interfaces and Number of I/O signals connected to the B2B connectors for Trenz 4x5 modules:
|B2B Connector||Interface||I/O Signal Count||Connected to||Notes|
|JB1||Ethernet LAN||4x Diff pairs||RJ45 Socket, J2|
|SD Card||6 x Single Ended||IO Expander, U4|
|I/Os||20x Single Ended||MAX10 FPGA Bank 6, U6|
12x Diff pairs/24x Single ended
4x Single Ended
|High Speed CRUVI, J12||CRUVI C|
|SoM Control Signals||5x Single Ended||MAX10 FPGA, U6|
|I/Os||8x Single ended||MAX10 FPGA Bank 8, U6|
12x Diff pairs/24x Single ended
4x Single Ended
|High Speed CRUVI, J10||CRUVI A|
|CRUVI||6x Diff pairs/12x Single ended||High Speed CRUVI, J11||CRUVI B|
|JTAG||4x Single Ended||FPGA Bank 5, U6|
6x Diff pairs/12x Single ended
4x Single Ended
|High Speed CRUVI, J11||CRUVI B|
1x Diff pair,
2x Single Ended
|USB A, J9|
CRUVI B2B Connectors
The TEMB0707 is equipped with a Low Speed Connectors J 13 and three High Speed Connector J10...12. These connectors are provided for CRUVI extension cards. More information is provided in the B2B Connectors section.
|High||CRUVI C, J12||A0...A5 (N/P)||B2B, JB1|
|B0...B5 (N/P)||B2B, JB1|
|MODE, REFCLK, SMB_ALERT, SMB_SDA, SMB_SCL, SEL, DO, DI, SCK||MAX10 FPGA Bank 8, U6||3.3V User IOs (Max10 Firmware dependent)|
|HSIO, HI, HO, RESET||B2B, JB1|
|High||CRUVI B, J11||A0...A5 (N/P)||B2B, JB1|
|B0...B5 (N/P)||B2B, JB1|
|MODE, REFCLK, SMB_ALERT, SMB_SDA, SMB_SCL, SEL, DO, DI, SCK||MAX10 FPGA Bank 2/3, U6||3.3V User IOs (Max10 Firmware dependent)|
|HSIO, HSI, HSO, RESET||B2B, JB3|
|High||CRUVI A, J13||A0...A5 (N/P)||B2B, JB2|
|B0...B5 (N/P)||B2B, JB2|
MODE, REFCLK, SMB_ALERT, SMB_SDA, SMB_SCL, SEL, DO, DI, SCK
|MAX10 FPGA Bank 2/3, U6||3.3V User IOs (Max10 Firmware dependent)|
|HSIO, HSI, HSO, RESET||B2B, JB2|
|Low||CRUVI||X0...X7||MAX10 FPGA Bank 1A, U6|
JTAG signals form FTDI U8 are routed to MAX10 CPLD. Via dip setting JTAG of MAX10 or JTAG of the connected Trenz 4x5 module can be selected. Forwarding signals to SoM is MAX10 Firmware dependent.
|MAX10 Pin Bank 1B, U6|
|TMS||G1||FTDI (U8) - ADBUS3|
|TDI||F5||FTDI (U8) - ADBUS1|
|TDO||F6||FTDI (U8) - ADBUS2|
FTDI (U8) - ADBUS0
JTAG access to the Trenz 4x5 module is through B2B connector JB2.
|MAX10 Pin Bank5, U6|
SD Card socket
The TEB0707 is equipped with an Micro SD Card slot, J8. For levelshifting an IO Expander (U4) is used.
|DAT0...3||ESD_DAT0...3||B2B, JB1||Through IO Expander, U4|
|CMD||ESD_CMD||B2B, JB1||Through IO Expander, U4|
|VDD||3.3V_SD||B2B, JB1||Through IO Expander, U4|
|CLK||ESD_CLK||B2B, JB1||Through IO Expander, U4|
|DLT||SD_CD||FPGA Bank 3, U6||Card detect.|
Micro USB2.0 Socket
There is a micro USB2.0 Socket, J15 provided in order to communicate with the FTDI, U8.
|D+||O2-D_P||B2B, JB3||Through Line Filter, L4|
|D-||O2-D_N||B2B, JB3||Through Line Filter, L4|
USB A Socket
The SoM USB 2.0 signals are routed to a USB A socket (host).
|Data+||O2-D_P||B2B, JB3||Through Line Filter, L1|
|Data-||O2-D_N||B2B, JB3||Through Line Filter, L1|
RJ45 LAN Socket
There is a RJ45 Ethernet LAN MagJack, J2 connected to B2B, JB1.
|Green LED||ETH1_LED0||Intel MAX 10, U6||MAX10 Firmware dependent|
|Yellow LED||ETH1_LED1||Intel MAX 10, U6||MAX10 Firmware dependent|
There are three Jumpers provided to choose the CRUVI Extension power voltage.
|J14||VCCIO_CC||B2B, JB2||CRUVI C|
|J16||VCCIO_CB||B2B, JB2||CRUVI B|
|J17||VCCIO_CA||B2B, JB2||CRUVI A|
|Test Point||Signal||Connected to||Notes|
|TP2||VIN||Voltage Protection, U2|
|TP5||3.3V||Power Switch, Q1|
|TP6||C5VIN||Power Switch, Q2|
Intel Max10 CPLD
The TEB0707 is quipped with an Intel Max10 as CPLD used for levelshifting of 3.3V signals on CRUVI connectors, JTAG/UART forward to modules, Module control pis, power sequencing and IO voltage selection along with providing User Push buttons, LEDs and switches. For complete information, please see the TEB0707 MAX10 CPLD.
The FTDI chip (U8) converts signals from USB2 to variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the capacity of the FT2232H chip which is used in Multi-Protocol Synchronous Serial Engine (MPPSE) mode for JTAG.
The configuration of FTDI FT2232H chip is pre-programmed on the EEPROM U10.
|ADBUS0||TCK||FPGA Bank 1B, U6||JTAG interface|
|ADBUS1||TDI||FPGA Bank 1B, U6|
|ADBUS2||TDO||FPGA Bank 1B, U6|
FPGA Bank 1B, U6
|BDBUS0||F_UART_TX||FPGA Bank 1B, U6||UART Transmitter output|
|BDBUS1||F_UART_RX||FPGA Bank 1B, U6||UART Receiver Input|
|OSCI||OSCI||Oscillator, U7||Clock 12 MHz|
|EECS||EECS||EEPROM, U10||EEPROM Contains FTDI configuration|
|DM/DP||FD_N/ FD_P||Micro USB, J15||USB to UART|
The functions of the LEDs are MAX10 Firmware dependent. See TEB0707 MAX10 CPLD LEDs.
|Designator||Color||Schematic||Connected to||Active Level||Note|
|D1||green||LED3||FPGA Bank 8||Active High|
|D2||green||LED5||FPGA Bank 8||Active High|
|D3||green||LED7||FPGA Bank 8||Active High|
|D4||red||LED4||FPGA Bank 3||Active High|
|D5||red||LED6||FPGA Bank 2||Active High|
|D6||red||LED8||FPGA Bank 8||Active High|
|D7||red||LED2||FPGA Bank 3||Active High|
|D8||green||LED1||FPGA Bank 3||Active High|
The EEPROM IC, U8 contains the FTDI configuration and is prprogrammed with Xilinx JTAG licence.
There is a DIP Switch provided for user controlling of settings. Dip1..3 are connected to MAX10 CPLD and therefore function is Firmware dependent, see TEB0707 MAX10 Dips.
|Pin||Schematic||Function (in standard Firmware)||Notes|
|DIP1||DIP1||Forwarded to IO so SoM|
MAX10 firmware dependent.
|DIP2||DIP2||IO Voltage selection||1.8V ('high', open, OFF), 2.5V ('low', closed, ON)|
|DIP3||DIP3 (PROGMODE)||Programming mode (JTAG selection on Trenz 4x5 module)||Select between FPGA/SoC (high, open, OFF ) or CPLD (low, closed, ON), MAX10 firmware dependent.|
|DIP4||JTAGEN||JTAG Selection||JTAG mode between CPLD (high, closed, ON) or SoM (low, open, OFF)|
Buttons are connected MAX10 CPLD and therefore function is Firmware dependent, see TEB0707 MAX10 CPLD Buttons
|Designator||Schematic||Function (in standard Firmware)||Notes|
|S2||RESET||SoM Reset||Hardware debounced.|
|S3||BUTTON1||User Button||debounced in Max10 FPGA|
MEMS U7 Oscillator is nedded for FTDI. It is additionally connectd to MAX 10 FPGA Bank 2 Pin H4 and can be used in custom Firmware.
|U7||MEMS Oscillator||12 MHz|
Power and Power-On Sequence
Power supply with minimum current capability of 3 A for system startup is recommended.
|Power Input Pin||Typical Current|
* TBD - To Be Determined
Power Distribution Dependencies
|Power Rail Name|
|VCCIO_CB||-||2, 4, 6||-||Output|
Below MAX10 CPLD Bankvoltages are summarized.
|Bank 5||VCCJTAG||from SoM|
Board to Board Connectors
These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.
4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.
- 2 x REF-189016-02 (compatible to LSHM-150-04.0-L-DV-A-S-K-TR), (100 pins, "50" per row)
- 1 x REF-189017-02 (compatible to LSHM-130-04.0-L-DV-A-S-K-TR), (60 pins, "30" per row) (depending on module)
Connector Mating height
When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height
|Order number||Connector on baseboard||compatible to||Mating height|
The module can be manufactured using other connectors upon request.
Connector Speed Ratings
The LSHM connector speed rating depends on the stacking height; please see the following table:
|Stacking height||Speed rating|
|12 mm, Single-Ended||7.5 GHz / 15 Gbps|
|12 mm, Differential|
6.5 GHz / 13 Gbps
|5 mm, Single-Ended||11.5 GHz / 23 Gbps|
|5 mm, Differential||7.0 GHz / 14 Gbps|
Current rating of Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).
Connector Mechanical Ratings
- Shock: 100G, 6 ms Sine
- Vibration: 7.5G random, 2 hours per axis, 3 axes total
Absolute Maximum Ratings
|5VIN||Input supply Voltage||-40||60||V|
Recommended Operating Conditions
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
|Input supply Voltage||4.06||5.58||V||See the OV/UV in the carrier datasheets.|
|T_OPT||0||70||°C||See Push Button datasheet.|
Module size: 135 mm × 68 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 4 mm.
PCB thickness: 1.7 mm.
Currently Offered Variants
Hardware Revision History
|2020-11-20||REV02||first production release||REV02|
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
Document Change History
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Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
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