3456 Module type PCB Revision 1 (initial) Device name Temperature Other assembly variations (position 17)TE 0003 - 03 - 5 D I 2 1 - A S 1 2 7 8 9 10 11 12 13 14 15 16 17 18 TEL Trenz Electronic Module name 0006 0007 0008 Module Revision 01 A B D F G H iCE40UP iCE5LP iCE40UL iCE40LP iCE40HX iCE40LM Size A B D F G H J K 384 640 1k 2k 3k 4k 5k 8k I I DDR memory 0 Not populated Flash memory (2x for all modules) 0 Not populated - - - eMMC (for TE0820/0821/0823) - Not present (for TE0803/07/08) - - - Other options (Connectors, custom options) Module Variation Description All A Standard connector height L Low profile connector height C Standard connector height, FPGA: XCZUxxx-xxxxxxxxx4524 (without encryption) D Low profile connector height, FPGA: XCZUxxx-xxxxxxxxx4524 (without encryption) ... Custom assembly variant, look additional table below Additional options Blank No extra options S Starter Kit K With heat spreader P Prototype Module Variation Description
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