You are viewing an old version of this page. View the current version.

Compare with Current View Page History

« Previous Version 7 Next »

Download PDF version of this document.

 

CompanyTrenz Electronic GmbH
PCN NumberPCN-20240514
TitleTE0807-03 to TE0807-04 Hardware Revision Change
SubjectHardware Revision Change
Issue Date

2024-12-01

Products Affected

This change affects all Trenz Electronic TE0807 SoMs: TE0807-03*.

Affected Product

Replacement
TE0807-03-4AI21-ATE0807-04-4AI81-A
TE0807-03-4AI21-AZTE0807-04-4AI81-A
TE0807-03-4AI21-CTE0807-04-4AI81-C
TE0807-03-4AI21-XEOL
TE0807-03-4BE21-ATE0807-04-4BE81-A
TE0807-03-4BE21-AKTE0807-04-4BE81-AK
TE0807-03-4BE21-AZTE0807-04-4BE81-A
TE0807-03-7AI21-ATE0807-04-7AI81-A
TE0807-03-7DE21-ATE0807-04-7DE81-A
TE0807-03-7DE21-AKTE0807-04-7DE81-AK
TE0807-03-7DE21-ASTE0807-04-7DE81-AS
TE0807-03-7DE21-AZTE0807-04-7DE81-A
TE0807-03-7DE21-KZTE0807-04-7DE81-AK
TE0807-03-7DI21-ATE0807-04-7DI81-A
TE0807-03-7DI21-AZTE0807-04-7DI81-A
TE0807-03-7DI21-CTE0807-04-7DI81-C
TE0807-03-7DI24-ATE0807-04-7DI84-A
TE0807-03-7DI24-AZTE0807-04-7DI84-A
TE0807-03-7NE21-ATE0807-04-7NE81-A

ED: Tabelle sollte fertig sein!

Changes

#1 Changed DCDC EN63A0QI (U4) to MPQ8633BGLE-Z and adapted power circuit.

Type: Schematic Change

Reason: EOL of Component.

Impact: None. Increased current output capability. Minor changes in electrical characteristics.

#2 Changed DCDC TPS82085SIL/MUN3CAD03-SE (U13) to MPM3860GQW-Z and adapted power circuit.

Type: Schematic Change

Reason: Increase current capability.

Impact: None. Increased current output capability. Minor changes in electrical characteristics.

#1 Changed DCDC (U15, U19, U20, U21, U22, U23, U24, U29, U30, U31, U38) from TPS82085SIL/MUN3CAD03-SE to MPM3834CGPA and adapted according circuit.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None. Minor changes in electrical characteristics.

#7 Increased voltage from 1.35 V to 1.45 V via voltage divider resistors (R28, R30) and changed voltage rail name accordingly from PL_GT_1V35 to PL_GT_1V45.

Type: Schematic Change

Reason: Improve voltage rail behaviour.

Impact: None.

#8 Increased voltage from 1.05 V to 1.15 V via voltage divider resistors (R33, R35) and changed voltage rail name accordingly from PL_GT_1V05 to PL_GT_1V15.

Type: Schematic Change

Reason: Improve voltage rail behaviour.

Impact: None.

#1 Changed PLL (U5) from Si5345A-B to Si5345A-D-GM.

Type:

Reason: 

Impact:

#1 Changed inverted buffer SN74LVC1G06DRL to not inverted buffer SN74LVC1G07DRL (U16A/U16B).

Type:

Reason: 

Impact:

#5 Added diode (D3) between U41 pin 3 net MR and voltage rail LP_DCDC.

Type: Schematic Change

Reason: Protect manual reset pin.

Impact: None.


#1 Added capacitors C213 ... C215 for VTT voltage rail VTT.

Type:

Reason: 

Impact:

#1 Replaced DDR4 memory chips to use bigger chip sizes.

Type:

Reason: 

Impact:

#6 Enabled DDR4 test usage via connecting all DDR4 TEN pins together, pulled them down with resistor (R103) and added testpoint (TP3).

Type: Schematic Change

Reason: Enable DDR4 test improvement.

Impact: None.

#9 Added option to use remote senses for DCDCs U29 via resistor R13 (Default: not fitted).

Type: Schematic Change

Reason: Remote sense option.

Impact: None.

#9 Added option to use remote senses for DCDCs U30 via resistor R90 (Default: not fitted).

Type: Schematic Change

Reason: Remote sense option.

Impact: None.

#9 Added option to use remote senses for DCDCs U31 via resistor R106 (Default: not fitted).

Type: Schematic Change

Reason: Remote sense option.

Impact: None.

#17 Added additional decoupling capacitors C136, C149...C151, C155, C156, C201...C212, C216, C217...C234, 

Type: Schematic Change

Reason: Improve decoupling.

Impact: None.

#15 Added pull-up resistor for "HOLD"-function (R92) and "WP"-function (R93) for flash (U7).

Type: Schematic Change

Reason: Improved SPI interface usage with different flashs.

Impact: None.

#16 Added pull-up resistor for "HOLD"-function (R100) and "WP"-function (R102) for flash (U17).

Type: Schematic Change

Reason: Improved SPI interface usage with different flashs.

Impact: None.

#16 Added pull-up resistor (R107) (default: not fitted) and pull-down resistor (R109) (default: fitted) for signal "POR_OVERRIDE" (U1).

Type: Schematic Change

Reason: Enable POR Override feature.

Impact: None.

#19 Changed 10 nF capacitor (C112) from 16 V, 0402 to 10 V, 0201.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None.

#18 Changed 100 nF capacitor (C37, C95, C96, C130, C131, C133) from 6.3 V, X5R, 0201 to 50 V, X7R, 0402.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None.

#20 Changed capacitor (C12 ... C16, C18 ... C21, C42, C44, C45, C170, C171) from 4.7 µF to 10 µF.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None.

#19 Changed 10 µF capacitor (C65, C66, C67) from 16 V, 0603 to 10 V, 0401.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None.

#18 Changed 100 µF capacitor (C29 ... C32, C35, C36, C43, C46, C52, C166 ... C169) from 6.3 V, 1206 to 4 V, 0805.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None.

#22 Changed 47 µF capacitor (C22 ... C28, C33, C34, C68 ... C70, C74, C76 ... C78, C80 .... C88, C110, C154, C198, C199, C200, C205) from 0805 to 0603.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None.

#19 Changed ferrid bead (L1 ... L5, L7) from BKP0603HS121-T to MPZ0603S121HT000.

Type: BOM Change

Reason: EOL of component.

Impact: None.

#24 Changed resistor (R41, R58) from 2 kOhm to 2.49 kOhm.

Type: Schematic Change

Reason: BOM optimization.

Impact: None.

#27 Added testpoints (TP4, TP6 ... TP9, TP11, TP13, TP14, TP19 ... TP22, TP34 ... TP67).

Type: Schematic Change

Reason: Improve voltage measuring possibilities.

Impact: None.

#28 Added Trenz address on PCB.

Type: PCB Change

Reason: Required for export to UK. (ED: ???)

Impact: None.

#28 Added CE-, UKCA-, RoHS-, and WEEE-logo.

Type: PCB Change

Reason: Required for export to UK. (ED: ???) 

Impact: None.

#29 Updated components from library.

Type: Schematic Change

Reason: Use latest component data.

Impact: None.

#30 Changed signal trace lengths.

Type: PCB Change

Reason: Result of changes above.

Impact: Changed trace length have to be taken into account in existing designs. The trace length for new revision will be available in TE080x series pinout generator. Please check if change in trace length still matches your requirements. Adaption of carrier may be necessary.

#31 Updated documentation.

Type: Documentation Update

Reason: Documentation improvement.

Impact: None.

Method of Identification

The revision number is visible on the top side of the PCB.


Production Shipment Schedule

From January 2025, after old stock is gone. If the new revision is not suitable for your application and still the former revision of the board is needed, please contact us.


Contact Information

If you have any questions related to this PCN, please contact Trenz Electronics Technical Support at

Disclaimer

Any projected dates in this PCN are based on the most current product information at the time this PCN is being issued, but they may change due to unforeseen circumstances.  For the latest schedule and any other information, please contact your local Trenz Electronic sales office, technical support or local distributor.

This PCN follows JEDEC Standard J-STD-046.

  • No labels