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Table of Contents

Overview

 

Trenz Electronic TE0711 is an industrial-grade FPGA module integrating a Xilinx Artix-7 FPGA, 32 MByte Quad SPI Flash memory for configuration and operation and powerful switching-mode power supplies for all on-board voltages. Numerous configurable I/O's are provided via rugged high-speed strips. All this on a tiny footprint, smaller than a credit card size at very competitive price. All Trenz Electronic SoM's in 4 x 5 cm form factor are mechanically compatible.

Block Diagram

Figure 1: TE0711-01 block diagram.

Main Components

   

Figure 2: TE0711 (REV 01).

  1. Artix-7 (15T to 100T) FPGA
  2. EN6347QI voltage Regulator 1.0V
  3. EN5311QI voltage Regulator 1.8V
  4. S25FL256S 32 MByte Quad SPI Flash memory
  5. Dual USB to UART/FIFO Bridge (FT2232H)
  6. TPS27082L load switch for 3.3V voltage level
  7. B2B connector JM1 (0,40 mm Razor Beam™ High Speed Hermaphroditic Terminal/Socket Strip (LSHM-150))
  8. B2B connector JM2 (0,40 mm Razor Beam™ High Speed Hermaphroditic Terminal/Socket Strip (LSHM-150))
  9. B2B connector JM3 (0,40 mm Razor Beam™ High Speed Hermaphroditic Terminal/Socket Strip (LSHM-150))
  10. System Controller CPLD (Lattice LCMXO2-256HC): 256 Macrocell CPLD
  11. SiT8008AI 100 MHz reference clock (connected to FPGA bank 14)
  12. SiT8008AI 12 MHz reference clock (connected to USB to UART/FIFO Bridge)
  13. EEPROM (configuration data for USB to UART/FIFO Bridge)
  14. TPS3805H33 voltage detector for generating "Power OK"-signal indicating successful power-on-sequencing


Key Features

  • Industrial-grade Xilinx Artix-7 (15T to 100T) SoM (System on Module), supported by the free Xilinx Vivado WebPACK tool

  • Rugged for shock and high vibration

  • FTDI FT2232HQ USB 2.0 High Speed to UART/FIFO
  • 32 MByte QSPI Flash memory (with XiP support)

  • 100 MHz MEMS oscillator

  • Plug-on module with 2 × 100-pin and 1 × 60-pin high-speed hermaphroditic strips

  • 178 FPGA I/Os (84 differential pairs) are available on board-to-board connectors

  • On-board high-efficiency DC-DC converters

    • 4.0 A x 1.0 V power rail

    • 1.0 A x 1.8 V power rail

    • 1.0 A x 1.5 V power rail

  • System management and power sequencing

  • eFUSE bit-stream encryption

  • AES bit-stream encryption

  • User LED

  • Evenly-spread supply pins for good signal integrity

Assembly options for cost or performance optimization available upon request.

Initial Delivery State

Storage Component

Content

Notes

SPI Flash OTP Area

Empty, not programmed

Except serial number programmed by flash vendor.

SPI Flash Quad Enable bit

Programmed

-

SPI Flash main array

Demo design

-

EFUSE USER

Not programmed

-

EFUSE Security

Not programmed

-

Table 1: TE0711 initial delivery state.

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

I/O signals connected to the FPGA's I/O banks and B2B connector:

BankTypeB2B ConnectorI/O Signal CountVoltageNotes

0

HR

-

-

3.3VConfiguration bank

14

HR

JM1

JM2

8 I/O pins

18 I/O pins,

(9 LVDS pairs possible)

3.3V

HR banks support voltages from 1.2V to 3.3V.

See Xilinx Artix-7 datasheet (DS181) for voltage ranges.

15

HR

JM1

48 I/O pins

24 LVDS pairs possible

User

As above.

16

HR

JM1

6 I/O pins

3 LVDS pairs possible

1.8V

As above.
34HR

JM1

JM3

48 I/O pins

24 LVDS pairs possible

UserAs above.
35HRJM2

50 I/O pins

24 LVDS pairs possible

UserAs above.

Table 2: Voltage ranges and pin-outs of available logic banks of the FPGA.

Please use Master Pin-out Table as primary reference for the pin mapping information.

JTAG Interface

JTAG access to the Xilinx Artix-7 and to the System Controller CPLD is provided through B2B connector JM2.

JTAG SignalB2B Connector
TCKJM2-99
TDIJM2-95
TDOJM2-97
TMS

JM2-93

Table 3: Pin-mapping of JTAG Interface on B2B connector

JTAGSEL pin on B2B connector JM1 is used to control which physical device is accessible via JTAG interface. If this pin is set to low or left open, JTAG interface is enabled for Xilinx Artix-7 FPGA, if set to high, JTAG interface for System Controller CPLD will be enabled.

The use of Xilinx legacy development tools (ISE, iMPACT) is not recommended. iMPACT does not recognize any Xilinx Artix-7 below A100T model.

System Controller I/O Pins

Special purpose pins are connected to smaller System Controller CPLD and have following default configuration:

Pin NameModeFunctionDefault ConfigurationB2B Connector
STAT_SC2OutputPower GoodActive high when all on-module power supplies are working properly.JM1-30
NRST_SC0InputResetActive low reset signal, drive low to keep the system in reset (FPGA pin PROG_B will be driven by CPLD)JM2-18
JTAGSELInputJTAG SelectLow for normal operation, high (3.3V) to programm the System Controller CPLDJM1-89
EN_SC3InputEnable FPGA Core Voltage supplyHigh (3.3V) or open for normal operation, low to stop power-on sequencingJM1-28

Table 4: Pin-description of System Controller CPLD.

LED's

The TE0711 SoM has total of 4 on-board LED's. LED's D1, D2 and D3 are connected to the Xilinx Artix-7 FPGA and can be freely used by user design. LED D4 is the System Controller CPLD status LED.

LEDColorConnected toDescription and Notes
D1RedSYSLED2User LED, active HIGH, connected to FPGA Pin A8
D2GreenSYSLED4User LED, active HIGH, connected to FPGA Pin R17
D3GreenSYSLED3User LED, active LOW, connected to FPGA Pin L15
D4GreenSYSLED1System Controller status LED, connected to CPLD

Table 5: Description of on-board LED's.

Clocking

The TE0711 is equipped with MEMS oscillator (SiT8008AI-73-XXS-100.000000E, U8) to provide 100 MHz clock signal for Xilinx Artix-7 FPGA pin P17.

On-board Peripherals

32 MByte Quad SPI Flash Memory

An SPI flash memory S25FL256S (U7) is provided for FPGA configuration file storage. After configuration completes the remaining free memory can be used for application data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths to be used. The maximum data rate will be dependent on the bus width and clock frequency.

SPI Flash QE (Quad Enable) bit must be set, or the FPGA would not configure from Flash. This bit is always set at manufacturing.

System Controller

The system controller is used to coordinate the configuration of the FPGA. The FPGA is held in reset (by driving the PROG_B signal) until the power supplies have sequenced. Low level at NRST_SC0 pin also resets the FPGA. This signal can be driven from the user’s PCB via the B2B connector pin JM2-18. Input EN_SC3 is also gated to FPGA Reset and should be open or pulled up for normal operation. EN_SC3 low turns off on board DC-DC converters and stops power-on sequencing.

It is possible for the user to create their own system controller design using the Lattice Diamond software. Once created the design can be programmed into the device using the JTAG pins. The signal JTAGSEL should be set to 3.3V to enable programming mode. For normal operation it should be set to 0V.

There are one status LED connected to the system controller CPLD. When the FPGA is not configured the LED will flash continuously. Finally once FPGA configuration has completed the LEDs can be used in the user's FPGA design.

Dual channel USB to UART/FIFO

The TE0711-01 SoM has on-board high-speed USB 2.0 to UART/FIFO FT2232HQ controller from FTDI. Channel A can only be used in simple UART mode. Channel B can be used as UART in FT245 FIFO mode, JTAG (MPSSE) mode or in high-speed serial modes.

FT2232HQ controller is connected to the FPGA bank 14 with fixed 3.3V VCCIO and all signalling must meet the LVCMOS 3.3V I/O standard.

256 Byte EEPROM is connected to the FT2232HQ-chip to store custom configuration settings. These settings can be changed using FTDI provided tools that can be downloaded from FTDI website.

Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of 2A for system startup is recommended.

 Power Input PinVoltage RangeMax Current
VIN3.3V to 5.5VTypical 200mA, depending on customer design and connections.
3.3VIN3.3VTypical 50mA, depending on customer design and connections.

Table 6: Typical power consumption.

VIN and VIN3.3V can be connected to the same power source (3.3V).

Lowest power consumption is achieved when powering the module from single 3.3V supply. When using split 3.3V/5V supplies the power consumption (and heat dissipation) will rise, this is due to the DC/DC converter efficiency (it decreases when VIN/VOUT ratio rises).

Power-On Sequence

For highest efficiency of on board DC-DC regulators, it is recommended to use same 3.3V power source for both VIN and 3.3VIN power rails. Although VIN and 3.3VIN can be powered up in any order, it is recommended to power them up simultaneously.

It is important that all baseboard I/O's are 3-stated at power-on until System Controller sets STAT_SC2 signal high (B2B connector JM1, pin 30), or 3.3V is present on B2B connector JM2 pins 10,12 or 91, meaning that all on-module voltages have become stable and module is properly powered up.

See Xilinx Artix-7 datasheet DS181 for additional information. Also check related baseboard documentation when choosing baseboard design for TE0711-01 module.

A 3.3V supply is also needed and must be supplied from the user's PCB. An output 3.3V supply is available on some of the board connector pins (see section 'Power Rails'). The input 3.3VIN will be switched to the internal 3.3V voltage level after the FPGA 1.0V supply has stabilized. Than 3.3V supply will be available on the B2B connector pins.

The regulators can be powered from the 3.3V supply or a 5V supply if preferred. The options for powering the board are as follows:

  • Apply 5V to pins VIN and 3.3V to pins 3.3VIN on the board connector
  • Apply 3.3V to pins VIN and 3.3VIN on the board connectors.

Power Rails

Voltages on B2B-

Connectors

B2B JM1-PinB2B JM2-PinDirectionNote
VIN

1, 3, 5

2, 4, 6, 8inputsupply voltage
3.3VIN13, 15-inputsupply voltage
VCCIO159, 11-inputhigh range bank voltage
VCCIO34-1, 3inputhigh range bank voltage
VCCIO35 7, 9inputhigh range bank voltage
3.3V1410, 12, 91outputinternal 3.3V voltage level
1.8V39-outputinternal 1.8V voltage level

Table 7: Power rails of SoM on B2B connectors.

Bank Voltages

BankSchematic NameVoltageRange
0 Config3.3V3.3V-
143.3V3.3V- 
15VCCIO15userHR: 1.2V to 3.3V
161.8V1.8V-
34VCCIO34userHR: 1.2V to 3.3V
35VCCIO35userHR: 1.2V to 3.3V

Table 8: Range of FPGA's bank voltages.

See the Artix7 datasheet DS181 for the allowable voltage range.

Board to Board Connectors

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Variants Currently In Production

Module Variant

FPGAFPGA Junction TemperatureOperating Temperature Range
TE0711-01-100-2CXC7A100T-2CSG324C0°C to 85°CCommercial grade
TE0711-01-35-2CXC7A35T-2CSG324C0°C to 85°CCommercial grade
TE0711-01-100-2IXC7A100T-2CSG324I-40°C to 100°CIndustrial grade
TE0711-01-35-2IXC7A35T-2CSG324I-40°C to 100°CIndustrial grade

Table 9: Differences between variants of Module TE0711-01

Technical Specifications

Absolute Maximum Ratings

ParameterMinMaxUnitsNotes

VIN supply voltage

-0.37.0VEN6347QI / EN5311QI data sheet
3.3VIN supply voltage

-0.1

3.6 V-
PL IO bank supply voltage for HR I/O Banks (VCCO)-0.53.6 V-
I/O input voltage for HR I/O banks-0.4 VCCO_X+0.55 V-
Voltage on module JTAG pins

-0.5

 VCCO_0+0.45 VVCCO_0 is 3.3V nominal.
Storage temperature-55

+125

 °C-

Table 10: Absolute maximum ratings.

Recommended Operating Conditions

ParameterMinMaxUnitsNotesReference Document
VIN supply voltage2.45.5 V-EN5311QI data sheet
3.3VIN supply voltage3.1353.465 V-

3,3V ± 5%

PL I/O bank supply voltage for HR

I/O banks (VCCO)

1.143.465 V-

Xilinx datasheet DS181

 I/O input voltage for HR I/O Banks- 0.20VCCO + 0.2 V-

Xilinx datasheet DS181

 Voltage on Module JTAG pins3.1353.465 V-3,3V ± 5%

Table 11: Recommended operating conditions.

Please check Xilinx datasheet (DS181) for complete list of absolute maximum and recommended operating ratings.

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

Module operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Physical Dimensions

  • Module size: 50 mm × 40 mm.  Please download the assembly diagram for exact numbers.
  • Mating height with standard connectors: 8mm
  • PCB thickness: 1.6mm
  • Highest part on PCB: approx. 2.5mm. Please download the step model for exact numbers.

All dimensions are shown in millimeters.

  

Figure 3: Physical Dimensions of the TE0711-01 board.

Weight

20.6 gPlain module
8.8 gSet of bolts and nuts

Table 11: Module weight data.

Revision History

Hardware Revision History

DateRevisionNotesPCNDocumentation link
 01

First production release

Current Hardware Revision

 TE0711

Table 12: Hardware revisions.

Hardware revision number is printed on the PCB board together with the module model number separated by the dash.


Document Change History

DateRevisionContributorsDescription
2017-01-01
Ali Naseri, Jan Kumann

TRM revision

2015-06-050.1
initial version

Disclaimer

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Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

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The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

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Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

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To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.


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