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Overview

Refer to https://wiki.trenz-electronic.de/display/DRAFT/TE0722+TRM for downloadable version of this manual and additional technical documentation of the product.

The Trenz Electronic TE0722-02 is a DIPFORTy1 "Soft Propeller" based on the Xilinx Zynq-7000 SoC.

Key Features

• Xilinx Zynq XC7Z010 SoC
• Dual-core ARM A9+ (TE0722-02-07S-1C variant has single-core ARM A9+)
• 16 MByte quad SPI Flash
• Micro SD Card socket with card detect signal
• 34 I/Os on DIP40 header pins
• System status LED (DONE)
• RGB LED connected to PL I/O
• Green user LED connected to ARM CPU GPIO
• Proximity and ambient light sensor
• DIP40 form factor (size 18 x 51 mm)

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

Figure 1: TE022-02 block diagram.

Main Components

Figure 2: TE0722-02 PCB top side.

Figure 3: TE0722-02 PCB bottom side.

1. Xilinx Zynq XC7Z010 or Zynq XC7Z007S SoC, U1
2. Micro SD card socket with card detect, J8
3. Red LED, D3
4. Green LED, D2
5. Red LED, D6
6. 20-pin connector placeholder, P1
7. Red LED, D5
8. Proximity/ambient light sensor, U4
9. RGB LED, D4
10. Red LED, D1
11. 20-pin connector placeholder, P2
12. Ultra-low supply-current voltage monitor, U4
13. 2 x 5-pin connector placeholder, J1
14. 2 x 5-pin connector placeholder, J2
15. 2 x 5-pin connector placeholder, J3
16. 16 MByte QSPI Flash memory, U5
17. Low-power programmable oscillator @ 33.333333 MHz, U8
18. 1A PowerSoC DC-DC converter (1.0V), U2
19. 1A PowerSoC DC-DC converter (1.8V), U3

Initial Delivery State

Table 1: .

Boot Process

By default the ... supports QSPI and SD Card boot modes which is controlled by the MODE input signal from the B2B connector JM..

Table 2: Selecting power-on boot device.

Signals, Interfaces and Pins

I/O Signals

Overview of the PL I/O banks signals routed to the external connectors:

Table 3: PL I/O signals overview.

JTAG Interface

JTAG access to the Xilinx ZYNQ XC7Z010 SoC is provided through J2 connector.

Table 4: JTAG interface signals.

Quad SPI Interface

Quad SPI Flash (U5) is connected to the Zynq PS QSPI0 interface via PS MIO bank 500, pins MIO1 ... MIO6.

Table 3: Quad SPI interface signals and connections.

SD Card Interface

TE0723 module has on-board 3.3V SD Card socket (J10) with card detect switch wired to the SoC PS MIO bank 500.

Table 4: SD card socket signals.

I2C Interface

I²C interface pins SCL and SDA from the Zynq SoC PL bank 34 are connected to the connector J1. There are no on-board I2C slave devices.

Table 7: Zynq SoC I²C interface.

I2C Interface

I²C interface pins SCL and SDA from the Zynq SoC PL bank 34 are connected to the connector J1. There are no on-board I2C slave devices.

Table 7: Zynq SoC I²C interface.

Default PS MIO Mapping

Table 5: .

On-board Peripherals

Quad SPI Flash Memory

Proximity and Ambient Light Sensor

Oscillators

On-board LEDs

Table 6: .

Power and Power-On Sequence

Power Consumption

The maximum power consumption of the module mainly depends on the design running on the Zynq SoC's FPGA.

Xilinx provide a power estimator excel sheets to calculate power consumption. It is also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

Table 7: Typical power consumption.

 * TBD - To Be Determined.

Power supply with minimum current capability of 1A for system startup is recommended.

Power-On Sequence

... diagram will be here soon ...

Variants Currently in Production

Table 8: Module variants.

Technical Specifications

Absolute Maximum Ratings

Table 9: Module absolute maximum ratings.

Recommended Operating Conditions

Table 10: Module recommended operating conditions.

Physical Dimensions

• Module size: 18 mm × 51 mm.  Please download the assembly diagram for exact numbers.

• PCB thickness: 1.6 mm.

• Highest part on PCB approx. 4 mm. Please download the step model for exact numbers.

 All dimensions are given in millimeters.

Figure 4: TE0722-02 physical dimensions.

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Revision History

Hardware Revision History

Table 11: TE0722 module hardware revision history.

Hardware revision number is printed on the PCB board together with the module model number separated by the dash.

Figure 5: TE0722 module hardware revision number.

Document Change History

Date	Revision	Contributors	Description
		Jan Kumann	Initial document.

Table 12: Document change history.

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