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Overview

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Refer to https://wiki.trenz-electronic.de/display/PD/TE0706+TRM for the current online version of this manual and other available documentation.

The Trenz Electronic TE0706 Carrier Board provides functionalities for testing, evaluation and development purposes of company's 4 x 5 cm SoMs. The Carrier Board is equipped with various components and connectors for different configuration setups and needs. The interfaces of the SoM's functional units and PL I/O-banks are connected via board-to-board connectors to the Carrier Board's components and connectors for easy user access.

See "4 x 5 cm carriers" page for more information about supported 4 x 5 cm SoMs.

Key Features

• 3 x Samtec LSHM Series Board to Board Connectors
• VG96 connector (mounting holes and solder pads, J6) and 50-pin IDC male connector socket (J5) for access to PL I/O-bank pins
• Micro SD card socket
• SDIO port expander with voltage-level translation
• USB2.0 type A connector, optionally Micro USB 2.0 connector
• 1 x user-push button S2, by default configured as system reset button
• 1 x RJ45 GbE MagJack J3, connected via MDI to B2B connector JB1
• 1 x Marvell Alaska 88E1512 GbE PHY, providing Ethernet interface in conjunction with RJ45 GbE MagJack J2
• 5V power supply barrel jack
• 4 A High-Efficiency Power SoC DC-DC Step-Down Converter (Enpirion EN6347) for 3.3V power supply
• XMOD JTAG- / UART-header JX1
• DIP-switch S1 to set Som's System Controller CPLD control signals
• 3 x VCCIO selection jumper J10, J11 and J12 to set SoM's PL I/O-bank voltages

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

Figure 1: TE0706-02 block diagram.

Main Components

Figure 2: TE0706-02 Carrier Board

1. 5V power connector jack, J1
2. Reset switch, S2
3. USB2.0 type A receptacle, J7
4. Micro SD card socket with Card Detect, J4
5. 50 pin IDC male connector, J5
6. 1000Base-T Gigabit RJ45 Ethernet MagJack, J3
7. 1000Base-T Gigabit RJ45 Ethernet MagJack, J2
8. XMOD JTAG- / UART-header, JX1
9. User DIP-switch, S1
10. VCCIO selection jumper block, J10 - J12
11. External connector (VG96) placeholder, J6
12. Samtec Razor Beam™ LSHM-150 B2B connector, JB1
13. Samtec Razor Beam™ LSHM-150 B2B connector, JB2
14. Samtec Razor Beam™ LSHM-130 B2B connector, JB3

Initial Delivery State

Board is shipped in following configuration:

• VCCIO voltage selection jumpers are all set to 1.8 V.
• S2 switch configured as reset button.
• One VG96 connector (not soldered to the board, but included in the package as separate component)

Different delivery configurations are available upon request.

Signals, Interfaces and Pins

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B2B Connector

With the TE0706 Carrier Board's Board-to-Board Connectors (B2B) the MIO- and PL I/O-bank's pins and further interfaces of the mounted SoM can be accessed. A large quantity of these I/O's are also usable as LVDS-pairs. The connectors provide also VCCIO voltages to operate the I/O's properly.

Following table gives a summary of the available I/O's, interfaces and LVDS-pairs of the B2B connectors JB1, JB2 and JB3:

Table 1: General overview of PL I/O signals and SoM's interfaces connected to the B2B connectors.

On-board Connector

The TE0706 Carrier Board has and a 50-pin IDC male connector J5 and soldering pads as place-holder to mount a VG96 connectors J6 to get access the PL I/O-bank's pins and further interfaces of the mounted SoM. With these connectors, SoM's PL-I/O's are available to the user, a large quantity of these I/O's are also usable as  differential pairs.

Following table gives a summary of the pin-assignment, available interfaces and functional I/O's of the connectors J5 and J6:

Table 2: General overview of PL I/O signals, SoM's interfaces and control signals connected to the on-board connectors.

JTAG Interface

JTAG access to the mounted SoM is provided through B2B connector JB2 and is also routed to the XMOD header JX1. With the TE0790 XMOD USB2.0 to JTAG adapter, the device of the mounted SoM can be programed via USB2.0 interface.

Table 3: JTAG interface signals.

UART Interface

UART interface is available on B2B connector JB1 and is usually established by MIO-pins of the PS-bank of the mounted SoM's Zynq device. With the TE0790 XMOD USB2.0 adapter, the UART signals can be converted to USB2.0 interface signals:

Table 4: UART interface signals.

I²C Interface

One of the SoM's I²C interface is routed to the on-board connector J5 and is available to the user for general purposes:

Table 5: I²C interface signals.

SD IO Interface

The SD IO interface of the mounted SoM is routed to the on-board Texas Instruments TXS02612 SDIO port expander U4. This IC provides a necessary VDD/VCCIO translation between the MicroSD Card socket J4 (3.3V) and the SoM's Zynq device MIO-bank (1.8V):

Table 6: SD IO interface signals.

USB2.0 Interface

TE0706-02 board has one physical USB2.0 type A socket J7, the differential data signals of the USB2.0 socket are routed to the B2B connector JB3, where they can be accessed by the corresponding USB2.0 PHY transceiver of the mounted SoM.

There is also the option to equip the board with a Micro USB 2.0 type B (receptacle) socket (J8) to the board as alternative fitting option. With this fitting option (Micro USB2.0 type B), the USB2.0 interface can also be used for Device mode, OTG and Host Modes.

For USB2.0 Host mode, the Carrier Board is additionally equipped with a power distribution switch U5 to provide the USB2.0 interface with the USB supply voltage USB-VBUS with nominal value of 5V. OTG mode is not available with USB2.0 Type A socket.

Following table gives an overview of the USB2.0 interface signals:

Table 7: USB2.0 interface signals and connections.

Gigabit Ethernet Interface

The TE0706 Carrier Board is equipped with a Marvell Alaska 88E1512 Gigabit Ethernet PHY (U6), which provides in conjunction with the Gigabit Ethernet MagJack J2 a 1000Base-T Ethernet (GbE) interface. The I/O Voltage is fixed at 1.8V. The reference clock input of the PHY is supplied by on-board 25MHz oscillator (U7).

The GbE MegJack J2 has two integrated LEDs (both green), its signals are routed as MDI (Media Dependent Interface) to the GbE PHY.

Table 8: GbE interface signals and connections.

RJ45 Gigabit Ethernet MagJack J3

The TE0706-02 carrier board is also equipped with a second Gigabit-Ethernet MagJack J3, which is connected via MDI to the B2B connector JB1.

There is usually a corresponding Gigabit Ethernet PHY on 4 x 5 SoMs (e.g. TE0715 or TE0720), which can be used in conjunction with the baseboard MagJack J3.

Table 9: RJ45 GbE MagJack signals and connections.

XMOD FTDI JTAG-Adapter Header

The JTAG interface of the mounted SoM can be accessed via XMOD header JX1, which has a 'XMOD FTDI JTAG Adapter'-compatible pin-assignment. So in use with the XMOD-FT2232H adapter-board TE0790 the mounted SoM can be programmed via USB2.0 interface. The TE0790 board provides also an UART interface to the SoM's Zynq device which can be accessed by the USB2.0 interface of the adapter-board while the signals between these serial interfaces will be converted.

Following table describes the signals and interfaces of the XMOD header JX1:

Table 10: XMOD header signals and connections.

When using XMOD FTDI JTAG Adapter TE0790, the adapter-board's VCC and VCCIO will be sourced by the mounted SoM's 'VCCJTAG' (pin JB2-92). Set the DIP-switch with the setting:

Table 11: XMOD adapter board DIP-switch positions for voltage configuration.

On-board Peripherals

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4-bit DIP-switch

Table below describes DIP-switch S1 settings for configuration of the mounted SoM:

Table 12: DIP-switch S1 SoM configuration settings.

Figure 3: User DIP-switch S1

VCCIO Selection Jumper

The Carrier Board VCCIO for the PL I/O-banks of the mounted SoM are selectable by the jumpers J10, J11 and J12.

Following table describes how to configure the VCCIO of the SoM's PL I/O-banks with jumpers:

Table 13: VCCIO jumper settings.

Figure 4: Base-board supply-voltages (VCCIOA, VCCIOB, VCCIOC) selection jumpers.

Only one supply-source is allowed to configure the base-board supply-voltages, either by jumper, by 0-Ohm-resistor or by connector J6. If a supply-voltage is configured by 0-Ohm-resistor or connector J6, then the corresponding configuration-jumper has to be removed. There aren't 0-Ohm-resistors and supply-voltages by connector J6 allowed if the corresponding base-board supply-voltage is configured by jumper. Vice versa jumpers and 0-Ohm-resistors have to be removed if supplying corresponding base-board supply-voltage by connector J6.

Note: If supplying base-board supply-voltages by connector J6, the module's internal 3.3V voltage-level on pins 9 and 11 of B2B-connector JB2 has to be reached stable state.

RTC Buffer Voltage Supply Header

The buffer voltage of the SoM's RTC can be supplied through the header J9 (VBAT-pin). Refer to the SoM's TRM for recommended voltage range and absolute maximum ratings.

Push Button

The Carrier Board's push button S2 is connected to the 'RESIN' signal, the function of the button is to trigger a reset of the mounted SoM by driving the reset-signal 'NRST_IN' to ground.

Power and Power-On Sequence

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Power Consumption

The maximum power consumption of the Carrier Board depends mainly on the mounted SoM's FPGA design running on the Zynq device.

Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

Table 14: Typical power consumption.

 * TBD - To Be Determined soon with reference design setup.

Power supply with minimum current capability of 3A for system startup is recommended.

Power Distribution Dependencies

The Carrier Board needs one single power supply voltage with a nominal value of 5V. Following diagram shows the distribution of the input voltage '5VIN' to the on-board components on the mounted SoM:

Figure 5: Board power distribution diagram.

Power Rails

The voltage direction of the power rails is from board and on-board connectors' view:

Table 15: Power pin description of B2B module connector.

Table 16: Power Pin description of on-board connector.

Table 17: Power Pin description of VCCIO selection jumper pin header.

Table 18: Main Power jack and pins description.

Table 19: Power pin description of peripheral connector.

Table 20: Power pin description of XMOD/JTAG Connector.

Board to Board Connectors

Variants Currently In Production

Table 21: Board variants.

Technical Specifications

Absolute Maximum Ratings

Table 22: Module absolute maximum ratings.

Recommended Operating Conditions

Table 23: Module recommended operating conditions.

Operating Temperature Ranges

Industrial grade: -40°C to +85°C.

The TE0706 Carrier Board itself is capable to be operated at industrial grade temperature range.

Please check the operating temperature range of the mounted SoM, which determine the relevant operating temperature range of the overall system.

Physical Dimensions

• Board size:  PCB 100mm ×  64.5mm. Notice that the USB type A socket on the left and the Ethernet RJ-45 jacks on the right are hanging slightly over the edge of the PCB making the total width of the longer side approximately 106mm. Please download the assembly diagram for exact numbers.

• Mating height of the module with standard connectors: 8mm

• PCB thickness: 1.65mm

• Highest parts on the PCB are USB type A socket and the Ethernet RJ-45 jacks, approximately 15mm. Please download the step model for exact numbers.

 All dimensions are given in millimeters.

Figure 6: Board physical dimensions drawing.

Revision History

Hardware Revision History

Table 24: Module hardware revision history.

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Figure 7: Board hardware revision number.

Document Change History

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Date	Revision	Contributors	Description
		Ali Naseri	TRM revision to new common style
2017-07-06	v.52	Ali Naseri, Jan Kumann	Hardware revision 02 specific changes.
2017-01-06	v.1	Ali Naseri	initial document to board revision 02

Table 25: Document change history.

Disclaimer

02 Sept 2017