<!--
Template Revision 1.67
(HTML comments will be not displayed in the document, no need to remove them. For Template/Skeleton changes, increase Template Revision number. So we can check faster, if the TRM style is up to date).
-->

<!--
General Notes:
If some section is CPLD firmware dependent, make a note and if available link to the CPLD firmware description. It's in the TE shop download area in the corresponding module -> revision -> firmware folder.
-->

<!--
General Notes:
Designate all graphics and pictures with a number and a description. For example "Figure 1: TE07xx-xx Block Diagram" or "Table 1: Initial delivery state". "Figure x" and "Table x" have to be formatted to bold.  
-->

Overview

<!--
Wiki Link: Go to Base Folder of the Module or Carrier, for example : https://wiki.trenz-electronic.de/display/PD/TE0712
 -->

Refer to https://wiki.trenz-electronic.de/display/PD/<name> for the current online version of this manual and other available documentation.

The Trenz Electronic TE0724 is an industrial-grade SoC module based on Xilinx Zynq-7010, which provides a dual core ARM Cortex A9 and a . It provides a gigabit ethernet transceiver, 1GByte of DDR3L SDRAM, 32 MByte Flash memory as configration and data storage. it includes strong pwerregulators for all needed voltages and a robust high-speed connector for in- and outputs. It has a 6 x 4 cm form factor.

Key Features

• Xilinx Zynq XC7Z010-1CLG400I or XC7Z020-1CLG400I
• Dual-core ARM Cortex-A9 MPCore
• Max. 667 MHz
• Shock proof an vibration resistant
• Size 6 x 4 cm
• Plug-On-Modul with 1 × 160 Pin High-Speed connector
• 1 GByte DDR3L SDRAM
• 32 MByte QSPI Flash Speicher
• 1 x GBit Ethernet PHY
• 1 x MAC-Address EEPROM
• 128 KBit EEPROM
• 1 x CAN Transceiver
• On-Board DC/DC-regulators
• Excellent signal integrity due to well dirstributed supply pins

Additional assembly options are available for cost or performance optimization upon request.

Block Diagramm

Main Components

Table 1: TE0724-02 main components.

1. XILINX ZYNQ XC7Z020-2CLG400C, U1
2. Gigabit Ethernet Transceiver Alaska 88E1512, U7
3. Power Manager Dialog DA9062, U4
4. 1GByte - 2x 4Gbit DDR3L RAM, U3, U5
5. 32MByte Spansion SPI Flash S25FL256, U13
6. 128KByte Serial EEPROM Microchip 24AA, U10
7.  CAN Transceiver MCP2542FDT, U2
8.  160 Pin Samtec B2B Connector ST5-80-1.50-L-D-P-TR, J1

Initial Delivery State

Table 1: Initial delivery state of programmable devices on the module.

Boot Process

Boot mode is selected via two pins at B2B connector J2. By default the TE0724 supports JTAG and SPI Boot Mode. Connecting a SD Card via B2B connector to MIO Pins 40 to 45 or MIO 46 to 51 gives the possibility to boot from SD Card.

Table 2: Boot mode selection.

Signals, Interfaces and Pins

<!--
Connections and Interfaces or B2B Pin's which are accessible by User
  -->

Board to Board (B2B) I/Os

I/O signals connected to the SoCs I/O bank and B2B connector: 

Table 3: General overview of PL I/O signals connected to the B2B connectors.

All PS MIO banks are powered by on-module DC-DC power rails. Valid VCCO_35 should be supplied from the carrier board.

For detailed information about the pin out, please refer to the Pin-out Tables. 

The configuration of the PS I/Os MIO40 to MIO51 depend on the carrier board peripherals connected to these pins.

<!--
TO-DO (future):
If Vivado board part files are available for this module, the standard configuration of the MIO pins by using this board part files should be mentioned here. This standard configuration of those pins are also apparent of the on-board peripherals of base-boards related to the module.
  -->

<!--
MGT lanes should be listed separately, as they are more specific than just general I/Os.  
  -->

JTAG Interface

JTAG access to the ZYNQ is provided through B2B connector J1 and testpoints.

Table 4: JTAG interface signals.

System Controller Pins

Special purpose pins are available for System Controller functions and have following default configuration:

Table 5: System Controller CPLD I/O pins.

<!--
For the detailed function of the pins and signals, the internal signal assignment and implemented logic, look to the Wiki reference page SC CPLD of this module or into the bitstream file of the SC CPLD.
Add link to the Wiki reference page of the SC CPLD, if available.
   -->

Quad SPI Interface

Following line is just an example, change it to your needs.

Quad SPI Flash (U14) is connected to the Zynq PS QSPI0 interface via PS MIO bank 500, pins MIO1 ... MIO6.

Note that table column says "Signal Name", it should match the name used on the schematic.

Table x: Quad SPI interface signals and connections.

SD Card Interface

Describe SD Card interface  shortly here if the module has one...

Table x: SD Card interface signals and connections.

Ethernet Interface

On board Gigabit Ethernet PHY is provided with ...

Ethernet PHY connection

Table x: ...

USB Interface

USB PHY is provided with ...

Table x: ...

The schematic for the USB connector and required components is different depending on the USB usage. USB standard A or B connectors can be used for Host or Device modes. A Mini USB connector can be used for USB Device mode. A USB Micro connector can be used for Device mode, OTG Mode or Host Mode.

I2C Interface

On-board I²C devices are connected to MIO.. and MIO.. which are configured as I²C... by default. I²C addresses for on-board devices are listed in the table below:

Table x: I²C slave device addresses.

On-board Peripherals

<!--
Components on the Module, like Flash, PLL, PHY...
  -->

System Controller CPLD

The System Controller CPLD (U2) is provided by Lattice Semiconductor LCMXO2-256HC (MachXO2 Product Family). The  SC-CPLD is the central system management unit where essential control signals are logically linked by the implemented logic in CPLD firmware, which generates output signals to control the system, the on-board peripherals and the interfaces. Interfaces like JTAG and I²C between the on-board peripherals and to the FPGA module are by-passed, forwarded and controlled by the System Controller CPLD.

Other tasks of the System Controller CPLD are the monitoring of the power-on sequence and to display the programming state of the FPGA module.

For detailed information, refer to the reference page of the SC CPLD firmware of this module.

<!--
Put in link to the Wiki reference page of the firmware of the SC CPLD.
  -->

DDR Memory

By default TE0xxx module has ... DDRx SDRAM chips arranged into 32-bit wide memory bus providing total of 1 GBytes of on-board RAM. Different memory sizes are available optionally.

Quad SPI Flash Memory

On-board QSPI flash memory (U14) on the TE0745-02 is provided by Micron Serial NOR Flash Memory N25Q256A with 256 Mbit (32 MByte) storage capacity. This non volatile memory is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used.

Gigabit Ethernet PHY

On-board Gigabit Ethernet PHY (U7) is provided with Marvell Alaska 88E1512 IC (U8). The Ethernet PHY RGMII interface is connected to the Zynq Ethernet0 PS GEM0. I/O voltage is fixed at 1.8V for HSTL signaling. The reference clock input of the PHY is supplied from an on-board 25.000000 MHz oscillator (U9), the 125MHz output clock signal CLK_125MHZ is connected to the pin J2-150 of B2B connector J2.

High-speed USB ULPI PHY

Hi-speed USB ULPI PHY (U32) is provided with USB3320 from Microchip. The ULPI interface is connected to the Zynq PS USB0 via MIO28..39, bank 501 (see also section). The I/O voltage is fixed at 1.8V and PHY reference clock input is supplied from the on-board 52.000000 MHz oscillator (U33).

MAC Address EEPROM

A Microchip 24AA025E48 serial EEPROM (U23) contains a globally unique 48-bit node address, which is compatible with EUI-48(TM) specification. The device is organized as two blocks of 128 x 8-bit memory. One of the blocks stores the 48-bit node address and is write protected, the other block is available for application use. It is accessible over I²C bus with slave device address 0x53.

RTC - Real Time Clock

An temperature compensated Intersil ISL...

Programmable Clock Generator

There is a Silicon Labs I²C programmable quad PLL clock generator on-board (Si5338A, U2) to generate various reference clocks for the module.

 Table : Programmable quad PLL clock generator inputs and outputs.

Oscillators

The module has following reference clock signals provided by on-board oscillators and external source from carrier board:

Table : Reference clock signals.

On-board LEDs

Table : On-board LEDs.

Power and Power-On Sequence

<!--
If power sequencing and distribution is not so much, you can join both sub sections together
  -->

Power Consumption

The maximum power consumption of a module mainly depends on the design running on the FPGA.

Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

Table : Typical power consumption.

 * TBD - To Be Determined soon with reference design setup.

Power supply with minimum current capability of ...A for system startup is recommended.

For the lowest power consumption and highest efficiency of the on-board DC-DC regulators it is recommended to power the module from one single 3.3V supply. All input power supplies have a nominal value of 3.3V. Although the input power supplies can be powered up in any order, it is recommended to power them up simultaneously.

The on-board voltages of the TE07xx SoC module will be powered-up in order of a determined sequence after the external voltages '...', '...' and '...' are available. All those power-rails can be powered up, with 3.3V power sources, also shared. <-- What?

Power Distribution Dependencies

Regulator dependencies and max. current.

Put power distribution diagram here...

Figure : Module power distribution diagram.

See Xilinx data sheet ... for additional information. User should also check related base board documentation when intending base board design for TE07xx module.

Power-On Sequence

The TE07xx SoM meets the recommended criteria to power up the Xilinx Zynq MPSoC properly by keeping a specific sequence of enabling the on-board DC-DC converters dedicated to the particular functional units of the Zynq chip and powering up the on-board voltages.

Following diagram clarifies the sequence of enabling the particular on-board voltages, which will power-up in descending order as listed in the blocks of the diagram:

Put power-on diagram here...

Figure : Module power-on diagram.

Voltage Monitor Circuit

If the module has one, describe it here...

Power Rails

NB! Following table with examples is valid for most of the 4 x 5 cm modules but depending on the module model and specific design, number and names of power rails connected to the B2B connectors may vary.

Table : Module power rails.

Different modules (not just 4 x 5 cm ones) have different type of connectors with different specifications. Following note is for Samtec Razor Beam™ LSHM connectors only, but we should consider adding such note into included file in Board to Board Connectors section instead of here.

Bank Voltages

Table : Module PL I/O bank voltages.

Board to Board Connectors

<!--
Generate new entry:
Replace with correct on for selected module series
  -->

Variants Currently In Production

<!--
Set correct link to the overview table of the product on english and german, if not available, set 
https://shop.trenz-electronic.de/de/Produkte/Trenz-Electronic/
https://shop.trenz-electronic.de/en/Products/Trenz-Electronic/
  -->

Technical Specifications

Absolute Maximum Ratings

Table : Module absolute maximum ratings.

Recommended Operating Conditions

Table : Module recommended operating conditions.

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Extended grade: 0°C to +85°C.

Industrial grade: -40°C to +85°C.

Module operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Physical Dimensions

• Module size: ... mm × ... mm.  Please download the assembly diagram for exact numbers.

• Mating height with standard connectors: ... mm.

• PCB thickness: ... mm.

• Highest part on PCB: approx. ... mm. Please download the step model for exact numbers.

All dimensions are given in millimeters.

Put mechanical drawings here...

Figure : Module physical dimensions drawing.

Revision History

Hardware Revision History

Table : Module hardware revision history.

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Put picture of actual PCB showing model and hardware revision number here...

Figure : Module hardware revision number.

Document Change History

<!--
Generate new entry:
1.add new row below first
2.Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number
3.Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description.
  -->

Date	Revision	Contributors	Description
		John Hartfiel	Rework chapter currently available products
02 Feb 2018	v.60	John Hartfiel	Remove Link to Download
2017-05-30	v.1	Jan Kumann	Initial document.
	all	Jan Kumann, John Hartfiel

Table : Document change history.

Disclaimer

02 Sept 2017