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Table of Contents

Overview

The Trenz Electronic TEC0850 is an industrial-grade MPSoC SoM integrating a Xilinx Zynq UltraScale+ MPSoC, with 64-bit wide SODIMM DDR4 SDRAM, max. Dual 512 MByte Flash memory for configuration and operation. 24 Gigabit transceivers on PL side and 4 PS side. Powerful switch-mode power supplies for all onboard voltages. A large number of configurable I/Os. 3U form factor.

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Key Features

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Main Components





  1. ...
  2. ...

Initial Delivery State

Storage device nameContentNotes
........

Boot Process

Signals, Interfaces and Pins

USB-C

Front panel USB-C Interface connected to USB FIFO bridge chip FT601Q. 32-bit FIFO bridge provides a simple high-speed interface to Zynq UltraScale+ PL.

FT601Q SignalFPGA Pin
FIFO_CLK
...

See FT600Q-FT601Q IC Datasheet for interface details.


MicroUSB

Front panel Micro-USB Interface provides access to UART and JTAG functions via FTDI FT2232 chip. Use of this feature requires that USB driver is installed on your host PC. UART0 with MIO 22 .. 23 should be selected in "Zynq UltraScale+ MPSoC" configuration.

The Digilent plug-in software and cable drivers must be installed on your machine for you to be able to use JTAG interface.


SD

There are some limitations to use SD card Interface in Linux.

To force Linux driver not to use this features add following instructions to device tree file.

&sdhci1 {

no-1-8-v;
disable-wp;
};

RJ45 -Ethernet

cPCIe

...

MGT

The TEC0850 board has 30 MGT lines routed to backplane connectors.

BankConnectorLanes
PL 128J4G and J4H4
PL 129J5A and J5B4
PL 130J5C and J5D4
PL 230J4G and J4H4
PL 229J5A and J5B4
PL 228J5C and J5D4
PS 505J1A4

MGT reference clocks are connected to banks 129, 229 and 505. Banks 128 and 130 should share clock from bank 129, banks 230 and 228 from bank 229.


USB Interface

Zynq UltraScale+ USB controller connected to backplane connector J1C via USB PHY chip U11.


DDR4 SODIMM Socket

The Zynq UltraScale+ DDRC hard memory controller is wired to the DDR4 SODIMM Socket U3.

Circular Push Pull Connector

PicoBlade Connector

Pin Heater 2,54mm (2x5)

Battery holder

On-board Peripherals

Zynq UltraScale XCZU15EG MPSoC

The TEC0850 board is populated with the Zynq UltraScale+ XCZU15EG-1FFVB1156E MPSoC.

Main IO interfaces are shown on the image below.


PS MIO Configuration

MIOInterface
MIO 0...12QSPI Flash Memory
MIO 20...21I2C 1
MIO 22...23UART 0
MIO 26...37GEM 0
MIO 46...51SD 1
MIO 52...63USB 0
MIO 64...75USB 1
MIO 76...77MDIO 0

Table 10: Default MIO Configuration

MAX10 System Controller

System controller chip is Intel MAX10 10M08SAU169C8G Chip with board control firmware.


Programmable Clock Generators


I2C

The onboard I2C bus is connected to MIO 20...21 pins. Devices on the bus shown in the table below.

I2C addressChipDescription
0x69U14 Si5345Clock generator and distributor

Oscillators

FTDIs

FT2232H

FT601Q-B-T

Quad-SPI Flash Memory

Board has two N25Q512A11G1240E connected in a dual parallel mode.

EEPROMs

I2C

The onboard I2C bus is connected to MIO 20...21 pins. Devices on the bus shown in the table below.

I2C addressChipDescription
0x50U63 24AA128T-I/ST128K Serial EEPROM
0x53U64 24AA025E48T-I/OT2K Serial EEPROM with EUI-48™ or EUI-64™ Node Identity

USB PHY

Gigabit Ethernet PHY

Board has Marvell Alaska 88E1512 Ethernet PHY which use MDIO address 1.


8Bit DACs

Board has 4 8-bit parallel Texas Instruments THS5641 DACs with up to 100 MSPS Update Rate. 


DIP-Switches

S1

SwitchDescription
1Boot Mode 0
2Boot Mode 1
3Boot Mode 2
4Boot Mode 3

See Zynq UltraScale+ Device Technical Reference Manual page 236 for full boot modes description. Most common modes are

Boot ModeSW1:4SW1:3SW1:2SW1:1
JTAG Boot ModeONONONON
Quad-SPIONONONOFF
SD CardONONOFFOFF

S2

SwitchDescription
1SC JTAGEN
2EEPROM WP (Write protect)
3FPGA PUDC
4SC Switch (Reserved for future use)


Buttons

LEDs

LEDSignalChipPinDescription
Front panel LED 1 (Red)LED_FP_1FPGA U1AF15PL User defined LED
Front panel LED 2 (Green)LED_FP_2FPGA U1AG15PL User defined LED
Front panel LED 3 (Green)LED_FP_3FPGA U1AE15PL User defined LED
Front panel LED 4 (Green)LED_FP_4SC U18M4Power Good


Power and Power-On Sequence

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Power Consumption

The maximum power consumption of a module mainly depends on the design running on the FPGA.

Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

Power InputTypical Current

TBD*

Table : Typical power consumption.

Power Distribution Dependencies



Power-On Sequence


Power Rails

Bank Voltages

Variants Currently In Production

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Technical Specifications

Absolute Maximum Ratings

Parameter

MinMax

Units

Reference Document

supply voltage...



V

-

Storage temperature



°C

-

Table : Module absolute maximum ratings.

Recommended Operating Conditions

ParameterMinMaxUnitsReference Document
supply voltage...



Operating temperature



Table : Module recommended operating conditions.

Physical Dimensions

All dimensions are given in millimeters.


Revision History

Hardware Revision History

DateRevision

Notes

PCNDocumentation Link
-02current available board revision-TEC0850-02
-

01

First production release

--

Table 24: Module hardware revision history

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.


Document Change History

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Table 25: Document change history

Date

Revision

Contributors

Description



  • Initial document

all




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