some sources available on public doc TEBT0808 TRM
Template Revision 2.5
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Important General Note:
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Note for Download Link of the Scroll ignore macro:
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Table of Contents |
The Trenz Electronic TEBT0808-01 is a testboard for module TE0808 (REV 02 and 03) as well as for TE0803 (REV 01).
Refer to http://trenz.org/tebt0808-info for the current online version of this manual and other available documentation.
Notes :
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Supported Bootmodes are SPI and JTAG.
add drawIO object here.
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Notes :
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Notes : Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture. If there is no components which might have initial data ( possible on carrier) you must keep the table empty |
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Boot mode can be set by DIP-Switch S1.
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Notes :
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FPGA bank number and number of I/O signals connected to the B2B connector:
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JTAG access to the TExxxx SoM through B2B connector JMX.
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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic. Example:
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Notes :
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Notes : In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection |
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Notes : Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options. |
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Notes : Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3) |
The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.
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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:
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Power supply with minimum current capability of xx A for system startup is recommended.
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* TBD - To Be Determined
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? x ? modules use two or three Samtec Micro Tiger Eye Connector on the bottom side.
3 x REF-??????? (compatible to ????????), (?? pins, ?? per row)
Operating Temperature: -??°C ~ ??°C
Current Rating: ??A per ContactNumber of Positions: ??
Number of Rows: ??
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Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
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Module size: ?? mm × ?? mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: ? mm.
PCB thickness: ?? mm.
In 'Physical Dimension' section, top and button view of moduloe must be insterted, information regarding physical dimention can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part)for every SoM. For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:
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Set correct link to the shop page overview table of the product on English and German. Example for TE0728: ENG Page: https://shop.trenz-electronic.de/en/Products/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/ DEU Page: https://shop.trenz-electronic.de/de/Produkte/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/ if not available, set. |
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