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Overview

The Trenz Electronic TEBT0808 is a test fixture for module TE0808(REV02, REV03) and TE0803(REV01) series.

Refer to http://trenz.org/tebt0808-info for the current online version of this manual and other available documentation.

Key Features

  • Modules
    • TE0808, TE0803
  • On Board
    • Done/Error/Status LEDs
    • MEMS Oscillator 125.00 MHz
    • Boot Mode DIP-Switch
    • 2x DIP-Switches to control TE080x power domains
  • Interface
    • Pin Header for TE0790 JTAG/UART Adapter
    • ARM JTAG header
    • Pin Header for I2C
    • Board to Board (B2B) Connectors
    • One PL GT with 4x SMA Connectors
    • One PS GT with 4x SMA Connectors
    • One pre-assembled TE0790 XMOD FTDI JTAG adapter
  • Power:
    • 3.3 V (Nominal Supply Voltage)
  • Dimension: 90mm x 90mm

Block Diagram


TEBT0808 Block Diagram

Main Components

TEBT0808 Main Components
  1. Uninsulated Power Jack. J7-J8
  2. SMA Coaxial straight. J6- J9...15
  3. Surface Mount Schottky Barrier Rectifier. D1
  4. ARM PJTAG Pin Header J16
  5. I2C Pin Header, J5
  6. Board to Board Connectors. J1...4
  7. MEMS Oscillator, U2
  8. On-Board LEDs, D2...4
  9. DIP-Switch, S1...3
  10. XMOD header, JX1

Initial Delivery State

Storage device name

Content

Notes

-

-

-

Initial delivery state of programmable devices on the module

Configuration Signals

Boot mode can be set by DIP-Switch S1.

M3M2M1M0BootmodeBootmodeNotes
ONONONON0b0000PS Main JTAG (TE0790 USB JTAG)DIPs are inverted
ONONOFFON0b0010SPI Flash (dual parallel, 4bit x 2, 32bit Addressing)DIPs are inverted
OFFONONON0b1000PJTAG(MIO29:26)DIPs are inverted
Boot Process.

Signal

B2BNote

PLL_RST

J2-89
SRST_BJ2-96Connected to PJTAG0_SRST - J16
Reset Process.

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

TEBT0808 has four B2B Connectors and each connector has 160 pins. Number of I/O signals and Interfaces connected to the B2B connectors is as following table:

B2B ConnectorInterfacesNumber of I/ONotes
J1

User I/O

46 Single Ended, 23 Differential

16 Single Ended, 8 Differential

16 Single Ended, 8 Differential

16 Single Ended, 8 Differential

4 Single Ended

IOs are Loop-Back

IOs are Loop-Back

IOs are Loop-Back

IOs are Loop-Back

PL_1V8

J2

User IO

28 Single Ended, 14 Differential

6 Single Ended, 3 Differential

IOs are Loop-Back

IOs are Loop-Back

Boot Mode 4 Single EndedMODE0...3
Control Signals25 Single Ended

PLL_SEL0, PLL_SEL1, PLL_RST, EN_GTR, EN_PL, PLL_LOLN, EN_PSGT, ERR_STATUS, ERR_OUT,SRST_B, INIT_B, PROG_B, EN_FPD , EN_LPD , DONE, EN_PLL_PWR, PLL_FINC ,PG_PLL_1V8, LP_GOOD, PG_DDR, PG_PL, PG_FPD, PG_PSGT, PG_GT_R, PG_GT_L

JTAG Interface7 Single EndedTCK, TDI, TMS, TDO, MR, Rxd, Txd
I22 Single EndedPLL_SCL, PLL_SDA
Clock

6 Single Ended, 3 Differential

CLK0, CLK7, CLK8

J3



User IO

24 Single Ended, 12 Differential

24 Single Ended, 12 Differential

Connected to Module FPGA, Bank 48

Connected to Module FPGA, Bank 47

Clock6 Single Ended, 3 DifferentialCLK228, CLK229, CLK230
PJTAG Interface4 Single EndedPJTAG0_TCK, PJTAG0_TDI, PJTAG0_TMS, PJTAG0_TDO,
MIO45 Single EndedMIO13..77
UART2 Single EndedTXD, RXD
Power Control Signals4 Single EndedPS_1V8, SI_PLL_1V8, VCCO_48, VCCO_47, PLL_3V3
J4User I/O

48 Single Ended, 24 Differential

48 Single Ended, 24 Differential

4 Single Ended

4 Single Ended

IOs are Loop-Back

IOs are Loop-Back

B64_T0...3

B65_T0...3

Power pins4 Single EndedVCCO_64, VCCO65
General PL I/O to B2B connectors information

SMA Coaxial Connectors

TEBT0808 is equipped with 8 SMD Coaxial Connectors. 

Designator SchematicB2B ConnectorNotes
J6B230_TX3_PJ1
J9B230_RX3_NJ1
J10B230_RX3_PJ1
J11B230_TX3_PJ1
J12B505_TX0_NJ2
J13B5050TX0_PJ2
J14B505_RX0_NJ2
J15B505_RX0_PJ2
SMD Coaxial Connectors

XMOD JTAG

JTAG access to the TEBT080X  is available through B2B connector JB2 using XMOD adapter TE0790.

JTAG Signal

B2B Connector

Notes
TMSJ2- 126
TDIJ2- 122
TDOJ2- 124
TCKJ2- 120
JTAG Pins Connection

The voltages 3.3V (VCC) and VIO (variable SC CPLD I/O-voltage) on TE0790 can be configured by the DIP-switch S2 which must be set as following. 

DIP Switch,S2DefaultDescription
1ONUpdate Mode JTAG access to SC CPLD only
2OFFMust be always in OFF state.
3OFFVIO is supplied from Module
4OFF3.3V is supplied by the carrier TEBT0808
Xmod Adapter DIP-Switch Setting Description

PJTAG

PJTAG access to the TEBT0808  is available through B2B connector JB3.

JTAG Signal

B2B Connector

Notes
PJTAG_TMSJ3- 94
PJTAG_TDIJ3- 90
PJTAG_TDOJ3- 92
PJTAG_TCKJ3- 88
PJTAG_SRSTJ2- 96Connected to SRST_B
PJTAG Pins Connection

Pin header

The I2C signals can be accessed through pin header J5.

Signals

B2B Connector

Pin HeaderNotes
PLL_SCLJ2- 90J5- 3
PLL_SDAJ2- 92J5- 7
I2C Connections

Test Points

Test Point

Signals

B2B Connector

Notes
TP 1DDR_1V2J2-135
TP 2PG_PSGTJ2-82
TP 3ERR_STATUSJ2-86
TP 4PLL_FDECJ2-94
TP 5EN_LPDJ2-108
TP 6EN_DDRJ2-112
TP 7PG_PLJ2-104
TP 8PG_PLL_1V8J2-80
TP 9N_PSGTJ2-84
TP 10ERR_OUTJ2-88
TP 11EN_FPDJ2-102
TP 12LP_GOODJ2-106
TP 13PG_FPDJ2-110
TP 14PG_DDRJ2-114
TP 15EN_PLL_PWRJ2-77
TP 16PLL_FINCJ2-81
TP 17PG_GT_RJ2-91
TP 18EN_GT_RJ2-95
TP 19EN_PLJ2-101
TP 20EN_GT_LJ2-79
TP 21PLL_SEL0J2-93
TP 22PG_GT_LJ2-97
TP 23INIT_BJ2-98
TP 24IN1_PJ2-4
TP 25PLL_SEL1J2-87
TP 26PLL_LOLNJ2-85
TP 27PLL_RSTJ2-89
TP 28DX_PJ2-119
TP 29DX_NJ2-121
TP 30IN1_NJ2-6
TP 31B505_CLK0_PJ2-10
TP 32B505_CLK0_NJ2-12
TP 33B505_CLK1_PJ2-16
TP 34B505_CLK1_NJ2-18
TP 35B128_CLK1_PJ2-22
TP 36B128_CLK1_NJ2-24
TP 37CLK0_NJ2-1
TP 38CLK0_PJ2-3
TP 39CLK8_PJ2-7
TP 40CLK8_NJ2-9
TP 41CLK7_PJ2-13
TP 42CLK7_NJ2-15
TP 43IN2_PJ3-66
TP 44IN2_NJ3-68
TP 45B230_CLK1_NJ3-59
TP 46B230_CLK1_PJ3-61
TP 47B229_CLK0_NJ3-65
TP 48B229_CLK0_PJ3-67
TP 49PLL_3V3J3-152
TP 50GNDJ3-155
TP 51PL_1V8J1-121
TP 52PS_1V8J3-147
TP 53SI_PLL_1V8J3-151
TP 54PROG_BJ2-100
TP 55...56GND-
Test Points Information

On-board Peripherals

Chip/InterfaceDesignatorNotes
DIP SwitchS1...3
LEDsD2...4Red LEDs
OscillatorU2125.00 MHz
On Board Peripherals

DIP Switch

There are three DIP Switches, S1, S2, S3.

The Boot Mode can be set through DIP Switch S1, refer to BootMode table.

DIP Switch S1Signals

B2B

Notes
S1AMODE0J2-109
S1BMODE1J2-107
S1CMODE2J2-105
S1DMODE3J2-103
DIP Switch S1

Control signals must be set using DIP Switch S2, S3.

DIP Switch S2SignalsB2BNotes
S2AEN_PSGTJ2-84Position OFF enables power rail
S2BEN_GT_RJ2-95Position OFF enables power rail
S2CEN_GT_LJ2-97Position OFF enables power rail
S2DEN_PLL_PWRJ2-77Position OFF enables power rail, connected to PG_PL
DIP Switch S2

DIP Switch S3SignalsB2BS3 switchNotes
S3AEN_DDRJ2-112S3APosition OFF enables power rail
S3BEN_LPDJ2-108S3BPosition OFF enables power rail
S3CEN_PLJ2-101S3CPosition OFF enables power rail
S3DEN_FPDJ2-102S3DPosition OFF enables power rail
DIP Switch S3

LEDs

DesignatorColorConnected toActive LevelNote
D2RedDONEActive HighNon User LED
D3RedERR_STATUSActive HighNon User LED
D4RedERR_OUTActive HighNon User LED
On-board LEDs

Clock Sources

DesignatorDescriptionFrequencyNote
U2MEMS Oscillator125.00 MHz
Osillators

Power and Power-On Sequence

Power Supply

2,0mm MC LB2Note
J73.3V direct modules power supply
J8GND
Power Consumption

Power Consumption

Minimum current depends mainly on design and cooling solution. Use Xilinx Power Estimator and/or Your Vivado Project to estimate min current. Minimum of 3A are recommanded for basic functionality.

Power Input PinTypical Current
3.3VTBD*
Power Consumption

* TBD - To Be Determined

Power Distribution Dependencies

Input oower sourced directly the module, Only one Diode D1 is used for inverse polarity protection.

Power Distribution

Power Rails

Power Rail Name

B2B J1 PinsB2B J2 PinsB2B J3 Pins

Directions

Note
PL_DCIN151, 153, 155, 157, 159--Output-
DCDCIN

-

154, 156, 158, 160,
153, 155, 157, 159

-Output-
LP_DCDC-138, 140, 142, 144-Output-
PS_BATT-125-Output-
GT_DCDC--157, 158, 159, 160Output-
PLL_3V3--152Output-
SI_PLL_1V8--151Input-
PS_1V8-99147, 148Input-
PL_1V891, 121--Input-
DDR_1V2-135-Input-
Module power rails.

Board to Board Connectors

5.2 x 7.6 cm UltraSoM+ modules use four Samtec Razor Beam LP Terminal Strip (ST5) on the bottom side.
  • 4x REF-192552-02 (160-pins)
    • ST5 Mates with SS5

5.2 x 7.6 cm UltraSoM+ carrier use four Samtec Razor Beam LP Socket Strip (SS5) on the top side.

  • 4x REF192552-01 (160-pins)
    • SS5 Mates with ST5
Features
  • Board-to-Board Connector 160-pins, 80 contacts per row
  • Ultrafine .0197" (0.50 mm) pitch
  • Narrow body design saves space on board
  • Lead style -03.5
  • Samtec 28+ Gbps Solution
  • Mates with: ST5
  • Insulator Material: Liquid Crystal Polymer, schwarz
  • Operating Temperature Range: -55°C bis +125°C
  • Lead-Free Solderable: Yes
  • RoHS Konform: Yes


Connector Stacking height

When using the standard type on baseboard and module, the mating height is 5 mm.

Other mating heights are possible by using connectors with a different height:

Order numberREF numberSamtec NumberTypeContribution to stacking heightComment
27219REF192552-01SS5-80-3.50-L-D-K-TRBaseboard connector3.5mm

Standard connector used on carrier

27018REF-189545-02 SS5-80-3.00-L-D-K-TRBaseboard connector3 mm 

Assembly option on request

27220REF-192552-02 ST5-80-1.50-L-D-P-TRModule connector1.5 mm

Standard connector used on modules

27017REF-189545-01 ST5-80-1.00-L-D-P-TRModule connector1 mm

Assembly option on request

Connectors.


The module can be manufactured using other connectors upon request.

Current Rating

Current rating of Samtec Razor Beam LP Terminal/Socket Strip ST5/SS5 B2B connectors is 1.5 A per pin (1 pin powered per row).

Connector Speed Ratings

The connector speed rating depends on the stacking height:

Stacking height

Speed rating

4 mm, Single-Ended13GHz/26Gbps
4 mm, Differential13.5GHz/27Gbps
5 mm, Single-Ended13.5GHz/27Gbps
5 mm, Differential20GHz/40 Gbps
Speed rating.

The SS5/ST5 series board-to-board spacing is currently available in 4mm (0.157"), 4.5mm (0.177") and 5mm (0.197") stack heights.

The data in the reports is applicable only to the 4mm and 5mm board-to-board mated connector stack height.

Manufacturer Documentation

  File Modified
PDF File hsc-report-sma_st5-ss5-04mm_web.pdf 30 05, 2017 by Susanne Kunath
PDF File hsc-report-sma_st5-ss5-05mm_web.pdf 30 05, 2017 by Susanne Kunath
PDF File REF-192552-01.pdf 13 11, 2017 by John Hartfiel
PDF File REF-192552-02.pdf 13 11, 2017 by John Hartfiel
PDF File ss5.pdf 13 11, 2017 by John Hartfiel
PDF File ss5-st5.pdf 13 11, 2017 by John Hartfiel
PDF File ss5-xx-x.xx-x-d-k-tr-mkt.pdf 13 11, 2017 by John Hartfiel
PDF File st5.pdf 13 11, 2017 by John Hartfiel
PDF File st5-xx-x.xx-x-d-p-tr-mkt.pdf 13 11, 2017 by John Hartfiel


Technical Specifications

Absolute Maximum Ratings

SymbolsMinMaxUnitNote
VIN-0.34V

VIN is connected directly to module

Storage Temperatur-40+85°CSee DIP Switch, CHS-04TA datasheet
PS absolute maximum ratings

Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

SymbolsMinMaxUnitNote
VIN3,143.47VCheck also TRM of the connected module
Operating Temperatur-40+85°C
Recommended operating conditions.

Physical Dimensions

  • Module size: 90 mm × 90 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 3.5 mm.

PCB thickness: 1.6 mm.

Physical Dimension

Currently Offered Variants 

Trenz shop TEBT0808 overview page
English pageGerman page
Trenz Electronic Shop Overview

Revision History

Hardware Revision History

DateRevisionChangesDocumentation Link
2016-05-3001Initial ReleaseREV01
Hardware Revision History

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Board hardware revision number.

Document Change History

DateRevisionContributorDescription

Vadim Yunitski

  • Updated block diagram
2020-05-11v.54John Hartfiel
  • add notes to DIP section

  • Correction on configuration signal section
2020-01-24v.49Pedram Babakhani
  • Initial Release

--

all

  • --
Document change history.

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

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Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

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To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.








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