CompanyTrenz Electronic GmbH
PCN NumberPCN-20241204
TitleTEB0835-02 to TEB0835-03 Hardware Revision Change
SubjectHardware Revision Change
Issue Date

2025-02-07

Products Affected

This change affects all Trenz Electronic TEB0835 Carrier: TEB0835-02*.

Affected Product

Replacement
TEB0835-02-ATEB0835-03-A

Changes

#1 Changed DCDC (U1, U4) from TPS82085SIL to TPS62913RPUR, changed input power supply from voltage rail "5V" to "12V" and adapted circuit accordingly. Added switch (SW1) for DCDC (U4) enable signal.

Type: Schematic Change

Reason: Changed input voltage range.

Impact: None. Minor changes in electrical characteristics.

#2 Changed load switch TPS27081ADDCR (Q1) to MP5077GG-Z and adapted circuit.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None. Increased current output capability. Minor changes in electrical characteristics.

#3 Changed battery supply circuit.

  • Changed output voltage for net "PSBATT" from 1.8 V to 1.2 V.
  • Changed placement order for battery holder (B1), diode (D13) and LDO (U18).
  • Changed LDO (U18) from TPS780180300DRV to TPS7A0212PDBVR.
  • Changed diode (D13) from SDMG0340LC-7-F to BAS70-05W.
  • Changed capacitor (C86) from 4.7 µF to 470 nF.

Type: Schematic Change

Reason: Decrease output voltage from 1.8 V to 1.2 V to follow AMD recommendation.

Impact: None. Reduced battery voltage for power rail "PSBATT".

#4 Added optional not assembled DCDC (U8) enable switch (SW3, R271).

Type: Schematic Change

Reason: Provide possibility to disable DCDC (U8) manually.

Impact: None. Improved optional manual power handling.

#5 Added optional not assembled DCDC (U8) mode selection switch (SW2, R272).

Type: Schematic Change

Reason: Provide possibility to use forced continuous mode.

Impact: None. Improve DCDC handling.

#6 Changed 10 nF capacitor (C37, C40) to 1 nF to adjust inrush current.

Type: BOM Change

Reason: Adjust inrush current.

Impact: Improved inrush current behaviour.

#7 Renamed module power rail "5V" to "V_MODULE".

Type: Documentation Change

Reason: Separate voltage rail name from voltage to use different voltages for voltage rail.

Impact: None. Follow net name structure to provide possibility to supply net with 5 V (default) or 12 V (assembly option).

#8 Added assembly option to supply power net "V_MODULE either from power net "V_5V0" via ferrite bead (L36, L37) (default) or from power net "12V" via ferrite bead (L38, L39) (assembly option). Added capacitor (C202 ... 207).

Type: Schematic Change

Reason: Improve power supply for module.

Impact: None. Minor changes in electrical characteristics.

#9 Changed LED connection architecture.

  • Connected B2B connector signal (J18 [REV02] / JB2 [REV03]) signal ([Pin - Signal name], [122 - B49_L5_P], [124 - B49_L5_N], [126 - B49_L6_P], [128 - B49_L6_N]) to connector J45.

  • Connected B2B connector signal (J18 [REV02] / JB2 [REV03]) signal ([Pin - Signal name], [122 - B49_L5_P], [124 - B49_L5_N], [126 - B49_L6_P], [128 - B49_L6_N], [130 - B49_L7_P]) via 33 Ohm resistor to added MOSFET (T2, T37, T38) [REV03] switching LEDs.

  • Changed LED designator (D6 → LED0, D7 → LED1, D8 → LED2, D9 → LED3, D10 → LED4, D12 → LED5).

  • Removed LED (D11).

  • Changed 330 Ohm resistor (R216 ... R221) to 33 Ohm.

  • Added resistor (R134, R191, R234, R237 ... R239, R280 ... R283, R286) [REV03]. 

Type: Schematic Change

Reason: Insert dual function possibility for connector signals.

Impact: None. Use signals for LED and/or for connector interfacing.

#10 Changed RF (J1, J3, J5, J7, J9, J11)[REV02] connector from SMA (5-1814400-1) to SMP (734060241).

Type: Schematic Change

Reason: Harmonize RF connectors.

Impact: Connectors are mechanically not connectable to old cables.

#11 Changed RF connector (J2, J4, J6, J8, J10, J12 ... J16)[REV02] from U.FL (U.FL-R-SMT-1) to SMP (734060241).

Type: Schematic Change

Reason: Harmonize RF connectors.

Impact: Connectors are mechanically not connectable to old cables.

#12 Changed balun from TCM2-33WX+ to TCM2-43X+ and changed designators from "T" (T2 ... T17) [REV02] to "TR" (TR1 ... TR16) [REV03] with number decreased by one e.g. T2 → TR1.

Type: BOM Change

Reason: Increase bandwidth.

Impact: Changes in electrical characteristics.

#13 Changed RF designators from "J" (J1 ... J16) [REV02] to "XS" (XS1 ... XS16) [REV03] e.g. J1 → XS1.

Type: Documentation Change

Reason: Improve readability and documentation.

Impact: None.

#14 Changed ADC input filter.

Resistor Designator

Old resistor value

(TEB0835-02-A)

New resistor value

(TEB0835-03-A)

R7, R8, R35, R36,

R21, R22, R49, R50,

R14, R15, R42, R43,

R28, R29, R56, R57

590 Ohm1 MOhm (DNP)

R6, R9, R34, R37,

R20, R23, R48, R51,

R13, R16, R41, R44,

R27, R30, R55, R58

17.4 Ohm0 Ohm

Type: Schematic Change

Reason: Improve signal quality.

Impact: Changes in electrical characteristics.

#15 Changed DAC output filter.

Resistor DesignatorOld ValueNew Value

R63, R64, R70, R71,

R77, R78, R84, R85,

R91, R92, R98, R99,

R105, R106, R112, R113

590 Ohm1 MOhm

R62, R65, R69, R72,

R76, R79, R83, R86,

R90, R93, R97, R100,

R104, R107, R111, R114

17.4 Ohm0 Ohm

Type: Schematic Change

Reason: Improve signal quality.

Impact: Changes in electrical characteristics.

#16 Changed ADC (ADCx_IN to ADC_INx for x = 0 ... 7) and DAC (DACx_OUT to DAC_OUTx for x = 0 ... 7) net names.

Type: Documentation Change

Reason: Improve readability and documentation.

Impact: None.

#17 Added shield 3670412 (Shield1, Shield2).

Type: Schematic Change.

Reason: Improve signal quality.

Impact: Changes in electrical characteristics.

#18 Set ADC and DAC clock alternative input circuit to not assembled (J20, J27, J32 ... J35, J38, T26 ... T32, R160, R162, R163, R167, R168, R176, R177, R227, R228, R230, R231, R233, R236)[REV03].

Type: BOM Change

Reason: BOM reduction.

Impact: None.

#19 Changed connector (J36) from U.FL (U.FL-R-SMT-1) to SMA (R125426000).

Type: Schematic Change

Reason: Improve connectivity.

Impact: Changes in electrical characteristics. Connectors are mechanically not connectable to old cables.

#20 Added RFSoC multi-tile clock via signals "B65_L11_(P/N)" from PLL (U5) signals "CLKOUT8_(P/N)" or via optional external source with not assembled circuit components (J42, T34, R241, R158, R159, C124, C126).

Type: Schematic Change

Reason: Enable ADC/DAC syncronization.

Impact: None.

#21 Added RFSoC multi-tile clock via signals "B65_L12_(P/N)" from PLL (U5) signals "CLKOUT7_(P/N)" or via optional external source with not assembled circuit components (J43, T35, R242, R243, R244, C129, C131).

Type: Schematic Change

Reason: Enable ADC/DAC syncronization.

Impact: None.

#22 Added syncronisation option for PLL on RFSoC module (TE0835) via signals "EXT_CLK_IN1_P/N". Default single ended clock supply supported via SMA R125426000 (J46), resistor (R224, R287) and signal "EXT_CLK_IN1_P". GND is connected to signal "EXT_CLK_IN1_N" via resistor (R290) in default connection. Optional circuit modification via components (T36, R266, R267) possible.

Type: Schematic Change

Reason: Enable PLL syncronization option for RFSoC module (TE0835).

Impact: None.

#23 Changed FireFly connector (J22, J24) from UEC5-019-2-H-D-RA-1 to UEC5-019-1-H-D-RA-1-A and changed pinout (name and order) for high-speed lanes.

Type: Schematic Change

Reason: Fix high-speed lane pinout.

Impact: Enabled PCIe communication and usage of parts with CDR but reduced data throughput from 28 Gpbs to 16 Gbps. 

#24 Changed FireFly connector (J23, J25) from ECUO to PCUO version.

Type: Schematic Change

Reason: Enable PCIe via FireFly.

Impact: None.

#25 Added slide switch (S7, R192, R387, R390, R409, R410, R415)[REV03] for FireFly configuration.

Type: Schematic Change

Reason: Follow Firefly specification. Enable manually setting for FireFly cable present signal "CPRSNT#".

Impact: None.

#26 Added load switch (Q2, C175 ... C178, C198 ... C201, C212 ... C216, R276, L34, L35) to supply VCC_1.8 FireFly connector (J23 - Pin 9, J25 - Pin 9) power rail.

Type: Schematic Change

Reason: Follow Firefly specification to enable optical Gen 4 FireFly usage.

Impact: None.

#27 Added FireFly termination resistor (R246 ... R261, R284, R285,  R305, R311, R314, R315, R318, R325, R326, R330 ... R336). Resistor (R246, R248, R250, R252, R254, R256, R258, R260, R285, R305, R315, R318, R330, R331, R334, R335) are not assembled.

Type: Schematic Change

Reason: Enable impedance matching option.

Impact: None.

#28 Added FireFly resistor (R337 ... R384) detect network.

Type: Schematic Change

Reason: Enable PCIe Detect feature for FireFly interface.

Impact: None.

#29 Added termination resistor (R296 ... R299, R302, R303, R307 ... R310, R312, R313, R317, R320, R403 ... R405, R408) for FireFly connector (J22, J24).

Type: Schematic Change

Reason: Follow FireFly specification.

Impact: None. Improve system performance.

#30 Changed signal names, added pull-up resistor and changed pull-up resistor designator for FireFly signals.

Old net name

(TEB0835-02-A)

New net name

(TEB0835-03-A)

Old pull-up

resistor designator

(TEB0835-02-A)

New pull-up

resistor designator

(TEB0835-03-A)

FFA_MPRSFF0_PRESENT#R191R289
FFA_MSELFF0_SELECT#--
FFA_INTLFF0_CPERST#-R409
FFA_RSTLFF0_CPRSNT#-R410
FFB_MPRSFF1_PRESENT#R194R288
FFB_MSELFF1_SELECT#--
FFB_INTLFF1_CPERST#-R390
FFB_RSTLFF1_CPRSNT#-R387

Type: Schematic Change

Reason: Follow FireFly specification and improve readability.

Impact: None.

#31 Changed capacitor designators for FireFly connectors (J23, J25) and changed 100 nF capacitors from 6.3 V, 0201 to 25 V, 0402.

Type: Schematic Change

Reason: BOM Optimization.

Impact: None. Minor changes in electrical characteristics.

#32 Changed clock source for signal "SYSREFCLK_P/N" from "CLKOUT7_P/N" [REV02] to "CLKOUT9_P/N" [REV03].

Type: Schematic Change

Reason: Simplify routing.

Impact: Trenz Reference Design reflects it but custom firmware needs to be checked and updated by customer.

#33 Connect clock signal "CLKOUT9A_P/N" to B2B connector signal "B65_L13_P/N" and removed it from PLL (U5) feedback clock input. Connected capacitor (C47, C170) at PLL (U5) feedback clock input.

Type: Schematic Change

Reason: Simplify routing.

Impact: Trenz Reference Design reflects it but custom firmware needs to be checked and updated by customer.

#34 Changed termination for clock signal "CLKIN0_P/N" via capacitor C47 [REV02] PLL (U5) and resistor (R119 [REV02], R120 [REV02]).

Type: Schematic Change

Reason: Follow Silicon Labs recommendation.

Impact: None. Minor changes in electrical characteristics.

#35 Connected PLL (U5) VDD via inductor (L17 [REV03]) to 1.8V instead of using multiple inductors (L17 [REV02], L19 [REV02], L22 [REV02]).

Type: Schematic Change

Reason: BOM Optimization.

Impact: None. Minor changes in electrical characteristics.

#36 Added pull-up resistor (R294) for signal "DSPLL0_LOL_N".

Type: Schematic Change

Reason: Improve signal handling.

Impact: Improve circuit reliability.

#37 Changed B2B connector designators:

Old designator

(TEB0835-02-A)

New designator

(TEB0835-03-A)

J17JB1
J18JB2

Type: Documentation Change

Reason: Improve readability and documentation.

Impact: None.

#38 Changed B2B connector J17 [REV02] / JB1 [REV03] pinout:

Pin

Old net

(TEB0835-02-A)

New net

(TEB0835-03-A)

Connected to

connector J44

17Not connectedMIO17B18
19Not connectedMIO18B17
21Not connectedMIO19B16
23Not connectedMIO20B14
25Not connectedMIO21A14
27Not connectedMIO22B13
29Not connectedMIO23A13
31Not connectedMIO24B12
33Not connectedMIO13/25A8
35Not connectedMIO38A12
37Not connectedMIO39A7
38Not connectedMIO26B8
39Not connectedMIO40A9
40Not connectedMIO27B5
41Not connectedMIO41A5
42Not connectedMIO30B7
44Not connectedMIO31B3
46Not connectedMIO34B4
47Not connectedMIO44B9

Type: Schematic Change

Reason: Increase interface options.

Impact: None.

#39 Changed B2B connector J18 [REV02] / JB2 [REV03] pinout:

Pin

Old net

(TEB0835-02-A)

New net

(TEB0835-03-A)

Connected to


1Not connectedGNDGND
2Not connectedGNDGND
36Not connectedCLKA_PJ45 Pin A2
38Not connectedCLKA_NJ45 Pin B1
15Not connectedB65_L1_PJ45 Pin B7
17Not connectedB65_L1_NJ45 Pin A8
6Not connectedB65_L2_PJ45 Pin B13
4Not connectedB65_L2_NJ45 Pin A14
3Not connectedB65_L3_PJ45 Pin B12
5Not connectedB65_L3_NJ45 Pin A12
14Not connectedB65_L4_PJ45 Pin B16
12Not connectedB65_L4_NJ45 Pin A17
10Not connectedB65_L5_PJ45 Pin B15
8Not connectedB65_L5_NJ45 Pin A15
11Not connectedB65_L6_PJ45 Pin B9
13Not connectedB65_L6_NJ45 Pin A9
19Not connectedB65_L8_PJ45 Pin B6
21Not connectedB65_L8_NJ45 Pin A6
7Not connectedB65_L9_PJ45 Pin B10
9Not connectedB65_L9_NJ45 Pin A11
22Not connectedB65_L11_PCLKOUT8_N via C118
20Not connectedB65_L11_NCLKOUT8_P via C127
18Not connectedB65_L12_PCLKOUT7_N via C128
16Not connectedB65_L12_NCLKOUT7_P via C137
25Not connectedB65_L13_PCLKOUT9A_P via C132
23Not connectedB65_L13_NCLKOUT9A_N via C133
24Not connectedB65_L16_PB18
26Not connectedB65_L16_NA18
156Not connectedEXT_CLK_IN1_PJ46 via R224 and R287 (default) or
J46 via R224 and T36 Pin 1 (optional)
158Not connectedEXT_CLK_IN1_NGND via R290 (default) or
GND via T36 Pin 3

Type: Schematic Change

Reason: Increase interface options.

Impact: None.

#40 Added 100 Ohm clock termination resistor for signals "CLKD_P/N" (R120 [REV03]), "CLKE_P/N" (R291) and "CLKF_P/N" (R193 [REV03]).

Type: Schematic Change

Reason: Improve signal integrity.

Impact: None.

#41 Changed power supply structure for FTDI (U12) interface.

  • Changed USB net name "USB_VBUS" to "5V_VBUS".

  • Added power supply circuit (U19, D6, D7, C220, C217, L19 [REV03], C171, R273 (optional), R274 (optional)) to provide power rail "3.3V_FTDI" to FTDI chip (U12).

  • Possible power supply for LDO (U19) via power rail "5V_VBUS" (D6) or/and "V_5V0" (D7).

  • Supply EEPROM (U15), oscillator (U16) and FTDI chip (U12) from power net "3.3V_FTDI".

Type: Schematic Change

Reason: BOM Optimization. Improve USB interfacing.

Impact: None.

#42 Changed buffer (U13, U14) from SN74LVC1G07DRL to SN74AVC4T774RSVR and adapted according circuits. Used buffer (U13) for tri-stating JTAG signals and buffer (U14) for UART signal voltage translation. Removed series resistor (R237 ... R240) for JTAG signals.

Type: Schematic Change

Reason: JTAG and UART handling improvement.

Impact: None.

#43 Added optional connection between FTDI chip (U12) signal ADBUS4 and power net 3.3V_FTDI via pull-up resistor (R124).

Type: Schematic Change

Reason: Improve JTAG interfacing.

Impact: None.

#44 Added USB filter (L25) for FTDI USB signals.

Type: Schematic Change

Reason: Improve signal integrity.

Impact: None. Minor changes in electrical characteristics.

#45 Removed FTDI EEPROM AMD-Licence key (MISC1).

Type: Firmware Change

Reason: Change according to FTDI programming method released by AMD with Tool Version 2022.2 and newer (UG980- Chapter: Programming FTDI Devices for Vivado Hardware Manager Support)

Impact: AMD Licence key is compatible with AMD Tools greater and equal 2017.1 release. Programmer will be identified as Xilinx device with prefix 'TE' ,see AMD FTDI JTAG Programmer#IdentificationofAMD/TrenzLicence

#46 Set resistor (R223) as not assembled to set USB mode.

Type: Schematic Change

Reason: Improve USB interfacing.

Impact: None.

#47 Added connector (J44, J45, L26 (default: not assembled), L27, L40, L41, C183 ... C185, C208 ... C211).

Type: Schematic Change

Reason: Increase interfacing options.

Impact: None.

#48 Added TE0835 front panel (MECH1), screws (MECH3, MECH4) and PCB Spacer (MP1 ... MP4).

Type: BOM Change

Reason: Improve board handling.

Impact: None.

#49 Added light pipe (LP1).

Type: Schematic Change

Reason: Improve board handling.

Impact: None.

#50 Changed MEMS oscillator (U16) from SiT8008AI-73-XXS-12.000000E to SiT8008BI-73-XXS-12.000000E.

Type: Schematic Change

Reason: EOL of Component.

Impact: None. Clock revision changed.

#51 Changed LED (D1 ... D3) from SML-P11MTT86R to LG R971-KN-1-0-20-R18.

Type: Schematic Change

Reason: BOM Optimization

Impact: None. Minor changes in electrical characteristics.

#52 Disconnected mounting hole (MH1, MH5) from GND.

Type: Schematic Change

Reason: Improve analog/digital GND separation.

Impact: None.

#53 Changed MOSFET (T18 ... T21) from SIS444DN-T1-GE3 to SIS4604LDN-T1-GE3.

Type: Schematic Change

Reason: EOL of Component.

Impact: None. Minor changes in electrical characteristics.

#54 Changed following resistors:

  1. 4.7 kOhm resistor (R157, R202) from 0.05 W, 0201 to 0.063 W, 0402.

  2. 33 Ohm resistor (R208) from 0.05 W, 0201 to 0.063 W, 0402.

Type: Schematic Change

Reason: BOM Optimization

Impact: None. Minor changes in electrical characteristics.

#55 Changed ferrite bead (L12) from BKP0603HS121-T to BLM15PX121SN1D.

Type: Schematic Change

Reason: EOL of Component.

Impact: None. Minor changes in electrical characteristics.

#56 Changed ferrite bead (L10, L11) from LI0402E300R-10 to BLM15PX121SN1D.

Type: Schematic Change

Reason: BOM Optimization

Impact: None. Minor changes in electrical characteristics.

#57 Changed inductor (L4, L5, L7, L8) from VLS3012HBX-1R0M to LPWI252010S1R0T.

Type: Schematic Change

Reason: BOM Optimization

Impact: None. Minor changes in electrical characteristics.

#58 Changed  following capacitors:

  1. 100 nF capacitor (C4 ... C35, C47, C50, C52 ... C54, C56, C57, C68, C77, C104, C106 ... C112, C115 ... C118, C143, C144, C146, C149, C150, C153, C154, C157, C158, C161, C162, C165, C166, C169) from 6.3 V, X5R, 0201 to 50 V, X7R, 0402.

  2. 100 nF capacitor (C88 ... C97) from X5R to X7R.

  3. Capacitor (C123) from 100 nF, 6.3 V, X5R, 0201 to 220 nF, 50 V, X7R, 0603.

  4. 470 nF capacitor (C145) from 0201 to 0402.

  5. Capacitor (C135) from 100 nF, 0201 to 1 µF, 0402.

  6. Capacitor (C44, C46, C48, C49, C132, C133) from 10 V, 0201 to 50 V, 0402.

Type: Schematic Change

Reason: BOM Optimization

Impact: None. Minor changes in electrical characteristics.

#59 Changed unused MOSFET (T33B) inputs from short to GND to floating pins.

Type: Schematic Change

Reason: Simplify routing.

Impact: None.

#60 Changed I2C signal names and designators for I2C pull-up resistors.

Old net name

(TEB0835-02-A)

New net name

(TEB0835-03-A)

Old pull-up

resistor designator

(TEB0835-02-A)

New pull-up

resistor designator

(TEB0835-03-A)

FFB_SCLFF0_SCLR196R262
FFB_SDAFF0_SDAR195R263
FFA_SCLFF1_SCLR193R264
FFA_SDAFF1_SDAR192R265

Type: Schematic Change

Reason: Improve FireFly naming readability.

Impact: None.

#61 Added test point (TP22 ... TP34, TP45).

Type: Schematic Change

Reason: Improve voltage measurement possibilities.

Impact: None.

#62 Changed fiducials to standard fiducial type.

Type: Schematic Change

Reason: Use standard fiducials.

Impact: None.

#63 Added UKCA-logo.

Type: PCB Change

Reason: Improve product classification.

Impact: None.

#64 Added I2C address table, power overview and clock overview. Updated legal notices, system overview and revision history. Updated page count and order.

Type: Documentation Update

Reason: Documentation Improvement.

Impact: None.


Method of Identification

The revision number is shown on the top side of the PCB.

Production Shipment Schedule

This change takes place with immediate effect. If the new revision is not suitable for your application and still the former revision of the board is needed, please contact us.

Contact Information

If you have any questions related to this PCN, please contact Trenz Electronics Technical Support at

Disclaimer

Any projected dates in this PCN are based on the most current product information at the time this PCN is being issued, but they may change due to unforeseen circumstances.  For the latest schedule and any other information, please contact your local Trenz Electronic sales office, technical support or local distributor.

This PCN follows JEDEC Standard J-STD-046.