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Overview

The Trenz Electronic TE0729 is an industrial-grade SoC module integrating an AMD Zynq™ 7020 with a Gigabit Ethernet transceiver, 2 x 100 Mbit Ethernet, DDR3L SDRAM, Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable IOs is provided via rugged high-speed stacking strips.

Refer to https://trenz.org/te0729-info for the current online version of this manual and other available documentation.

Key Features

  • SoC
    • AMD Zynq 7000 SoC 1): XC7Z020
    • Speedgrade 1):               -1 / -2 / -3
    • Temperature Range 1):  C / E / I
    • Package 1):                    CL484 / CLG484
  • RAM/Storage
    • 1x DDR3 SDRAM 4 Gbit (1x 256 M x 16 bit) 2)
    • QSPI Flash 256 Mbit (with XiP support) 2)
    • e.MMC 8 GByte 2) 3)
    • 3x EEPROM with unique EUI-48 ™ / MAC address
  • On Board
    • 1x 10/100/1000 BASE-T/X Ethernet PHY with option for external SGMII interface
    • 2x 10/100 BASE-T/X Ethernet PHY
    • USB 2.0 ULPI PHY with full OTG support
    • Real Time Clock - Temperature compensated, with interrupt
    • Clocks for SoC PS, Ethernet PHYs and USB 2.0 PHY
    • LEDs: 1x user orange / 1x status green
  • Interface
    • Trenz 5.2 x 7.6 SoM 2x B2B Connector (Samtec BTE) socket:
      • MIO:        2x SE @ 3.3 V
      • IO HR: 126x SE / 24x DIFF @ 3.3 V
                     10x SE / 5x DIFF @ 2.5 V
  • Power
    • Single Rail 3.3 V power supply
    • DCDC converters for all voltage rails
  • Dimension
    • 52 mm x 76 mm
  • Notes
    1) Available as assembly variant or upon request.
    2) Other sizes/devices, which are pin/package-compatible, upon request.
    3) Onboard e.MMC or external SD interface dependent on SDIO mux U15.

Block Diagram


TE0729 block diagram

Main Components

TE0729 main components
  1. SoC, U2
  2. 1x DDR3 SDRAM, U1
  3. QSPI Flash, U13
  4. e.MMC, U5
  5. Clock for SoC PS, U14
  6. System Controller, U6
  7. 10/100/1000 BASE-T/X Ethernet PHY, U3
  8. 10/100 BASE-T/X Ethernet PHY, U17, U19
  9. Clocks for Ethernet PHYs, U10
  10. EEPROM with MAC, U8, U9, U20
  11. USB 2.0 ULPI PHY, U11
  12. Clock for USB 2.0 PHY, U12
  13. Real Time Clock, U22
  14. LED - Status green, D2
  15. LED - User orange, D8
  16. B2B connectors, J1, J2

Initial Delivery State

Storage device name

Designator

Content

Notes

System Controller

U6

Firmware

For further information see TE0729 CPLD Firmware / TE0729 CPLD.

QSPI Flash

U13

Not programmed


e.MMC

U5

Not programmed


EEPROMs with MAC

U8 / U9 / U20

MAC is burned-in by the manufacturer.


Real Time Clock

U22

Not programmed


Initial delivery state of programmable devices

Signals, Interfaces and Pins

Connectors

Connector Type

Designator

Interface

IO count

Notes

B2B

J1

IO HR

48x SE / 24x DIFF

Bank 13, 3.3 V

B2B

J1

IO HR

48x SE

Bank 33, 3.3 V

B2B

J2

IO HR

10x SE / 5x DIFF

Bank 34, 2.5 V

B2B

J2

IO HR

30x SE

Bank 35, 3.3 V

B2B

J2

1000 ETH MDI

4x DIFF


B2B

J2

1000 ETH SGMII

2x DIFF


B2B

J2

100 ETH MDI

2x DIFF


B2B

J2

100 ETH MDI

2x DIFF


B2B

J2

IO MIO

2x SE

Bank 500 (MIO0/9), 3.3 V.

B2B

J2

SDIO

6x SE

1.1 V to 3.3 V

B2B

J2

USB 2.0 OTG

1x DIFF


Board connectors

Test Points

Test

Point

REV03

REV02

Signal


Notes

Top

Bottom

Signal

TP1

x


3.3V / VCCIO_13




N
o
t

u
s
e
d







N
o
t

u
s
e
d






N
o
t

u
s
e
d










N
o
t

u
s
e
d


TP2


x

3.3V / VCCIO_13


TP3

x


AVDD18


TP4


x

AVDD18


TP5

x


AVDD3


TP6


x

AVDD3


TP7

x


1V


TP8


x

1V


TP9

x


2.5V


TP10


x

2.5V


TP11

x


1.8V


TP12


x

1.8V


TP13

x


DDR_VDD


TP14


x

DDR_VDD


TP15

x


1.8V / VCCPLL


TP16


x

1.8V / VCCPLL


TP17

x


3.3V / VCCIO_33


TP18


x

3.3V / VCCIO_33


TP19

x


VDDIM


TP20


x

VDDIM


TP21

x


VDDA_3.3V_ETH1


TP22


x

VDDA_3.3V_ETH1


TP23

x


VDDA_3.3V_ETH2


TP24


x

VDDA_3.3V_ETH2


TP25

x


VIN


TP26


x

3.3V


TP27

x


3.3V


TP28


x

VBAT_IN


TP29

x


VBAT_IN


TP30


x

VTTREF


TP31

x


VTTREF


TP32


x

AVCC


TP33

x


AVCC


TP34


x

PS-CLK


TP35


x

ETH_CLKIN


TP36


x

ETH1_1.2V_CORE


TP37

x


ETH1_1.2V_CORE


TP38


x

ETH2_1.2V_CORE


TP39

x


ETH2_1.2V_CORE


TP40


x

GND


TP41


x

GND


Test points information

On-board Peripherals

Chip/Interface

Designator

Connected to

Notes

FPGA

U2

  • DDR3 SDRAM U1
  • SPI Flash U13
  • e.MMC U5
  • 1000 Ethernet PHY U3
  • 100 Ethernet PHY U17
  • 100 Ethernet PHY U19
  • EEPROMs with MAC U8 / U9 / U20
  • SDIO mux U15
  • I2C
  • LEDs - User D8 / Status D2
  • B2B connectors J1 / J2


DDR3 SDRAM

U1

  • SoC U2


QSPI Flash

U13

  • SoC U2
  • System Controller U6


e.MMC

U5

  • SDIO mux U15


System Controller

U6

  • SoC U2
  • QSPI Flash U13
  • B2B J2

For further information see TE0729 CPLD Firmware / TE0729 CPLD.

1000 Ethernet PHY

U3

  • SoC U2
  • Oscillator for PHYs U10
  • B2B J2


100 Ethernet PHY

U17

  • SoC U2
  • Oscillator for PHYs U10
  • B2B J2


100 Ethernet PHY

U19

  • SoC U2
  • Oscillator for PHYs U10
  • B2B J2


SDIO mux

U15

  • SoC U2
  • e.MMC U5
  • B2B J2


Voltage Monitor and Watchdog

U21

  • SoC U2
  • System Controller U6
  • B2B J2


EEPROMs with MAC

U8 / U9 / U20

  • I2C


Real Time Clock

U22

  • SoC
  • I2C


Oscillator for SoC

U14

  • SoC U2

33 ⅓ MHz

Oscillator for Ethernet PHYs

U10

  • 1000 Ethernet PHY U3
  • 100 Ethernet PHY U17
  • 100 Ethernet PHY U19

25 MHz

Oscillator for USB PHY

U12

  • USB PHY U11

52 MHz

On-board peripherals

Configuration and System Control Signals

Control signals represent hardware defined logic states, for final state consider the firmware and reference designs.

Control Signals and Buses

Signal Name

Connector.Pin

Direction 1)

Description

nRST

J2.89

OUT

Reset From Watchdog, and to B2B

nRST_in

J2.91

IN

External Reset

JTAGSEL

J2.111

IN

JTAG target select signal, high = System Controller, low = SoC

BOARD_STAT 2)

J2.112

OUT

Signals WD restart and can be used as user IO.

BOOT_MODE2 2) / BOOT_MODE1 2)

J2.114 / J2.116

IN

Select the boot source.

UART ( USART0_RX / USART0_TX )

J2.94 / J2.96

Signal dependent

SoC UART

I2C ( I2C0_SDA / I2C0_SCL)

J2.90 / J2.92

Signal dependent

I2C to SoC, RTC and EEPROMs.

I2C ( I2C1_SDA / I2C1_SCL)

J2.93 / J2.95

Signal dependent

I2C bus with only the SoC.

JTAG ( TMS / TDI / TDO / TMK )

J2.113 / J2.115 / J2.117 / J2.119

Signal dependent

JTAG to SoC and System Controller.

USB ( VBUS_V_EN / USB-VBUS / OTG-ID )

J2.97 / J2.107 / J2.109

Signal dependent

USB 2.0 OTG control signals

1) Direction:

    • IN: Input from the point of view of this board.

    • OUT: Output from the point of view of this board.

    • INOUT: Bidirectional signal.
    • Signal dependent: A Signal can have different functions and directions as part of a Bus.

2) Firmware dependent signal. Refer to TE0729 CPLD Firmware / TE0729 CPLD for more information.

Control signals and buses


Power and Power-On Sequence


Power Rails


Power Rail Name / Schematic Name

Connector.Pin

Direction 1)

Notes

VIN

J1.1 / J1.2 / J1.3 / J1.4 / J1.5 / J1.6

IN

SoM supply

3.3V

J1.65 / J1.66

OUT

External IO

2.5V

J2.13

OUT

External IO

1.8V

J2.49

OUT

External IO

VBAT_IN

J2.118

IN

RTC backup supply

VCCIO_13

J1.101 / J1.102

OUT

External IO

VCCIO_33

J1.29 / J1.30

OUT

External IO

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.
Power rails

Recommended Power up Sequencing

SequenceNet nameRecommended Voltage RangePull-up/downDescriptionNotes
0---Configuration signal setup.See Configuration and System Control Signals.
1VIN

3.3 V (± 5 %)

-

Power supply. 

Carrier power supply.

Power sequencing

Board to Board Connectors

5.2 x 7.6 cm SoM modules use two Samtec BTE connectors on the bottom side.
  • 2x REF-189019-02 (120-pins)
    • BTE Mates with BSE

5.2 x 7.6 cm SoM carrier use two Samtec BSE on the top side.

  • 2x REF-189019-01 (120-pins)
    • BSE Mates with BTE
Features
  • Board-to-Board Connector 120-pins
  • Insulator Material: Liquid Crystal Polymer
  • Max cycles 100
  • Operating Temperature Range: -55°C bis +125°C
  • Lead-Free Solderable: Yes
  • RoHS Conform: Yes
Connector Stacking height

When using the standard type on baseboard and module, the mating height is 5 mm.

Order
number

REF NumberSamtec NumberTypeMated HeightComment
-REF-189019-02BTE-060-01-L-D-A-K-TRModule connector5 mmStandard connector
used on module
26663REF-189019-01BSE-060-01-L-D-A-TRBaseboard connector5 mmStandard connector
used on board
Current Rating

Current rating of Samtec Basic Blade & Beam Header & Socket BTE/BSE B2B connectors is  2 A per pin (2 pin powered).

Connector Speed Ratings
Stack HeightSignal TypSpeed rating
5 mmSingle-Ended8 GHz / 16 Gbps
5 mmDifferential5 GHz / 10 Gbps
 Manufacturer Documentation

  File Modified
PDF File hsc-report_bte-bse-05mm_web.pdf Nov 21, 2017 by John Hartfiel
PDF File bte.pdf Nov 21, 2017 by John Hartfiel
PDF File bse.pdf Nov 21, 2017 by John Hartfiel

Technical Specifications

Absolute Maximum Ratings *)

Power Rail Name/ Schematic Name

Description

Min

Max

Unit

VIN

SoM supply

-0.3

3.75

V

VBAT_IN

RTC backup supply

-0.3

6.0

V

Absolute maximum ratings

*) Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Condition". Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

Recommended Operating Conditions

Temperature range

Trenz Electronic classifies modules into temperature range categories by subsumption of its component data (PCB, ICs, connectors, passive components). The temperature ranges are values for ambient air temperature and do not reflect the junction temperature of individual components.

The categories are:

  • Modules with commercial (C) temperature grade are equipped with components that cover at least the ambient temperature range of 0 °C to 70 °C.
  • Modules with extended (E) temperature grade are equipped with components that cover at least the ambient temperature range of 0 °C to 85 °C.
  • Modules with industrial (I) temperature grade are equipped with components that cover at least the ambient temperature range of -40 °C to 85 °C.

These categories do not take into account the entire custom system consisting of:

  • Customer SoC design. The allowed main SoC temperature range is specified from the vendor by junction temperature using corresponding classes (C, E, I). See vendor documentation.
  • Cooling solution, active and or passive cooling.
  • Climate or environmental conditions besides ambient temperature range.
  • Module orientation, neighbouring assemblies, neither other heat sources nor the SoC as heat source to other components.

Classification of the module can be looked up here: Article Number Information i.e.: TExxxx-xx-xx'I'xx, the 'I' indicates that all components are at least in Industrial temperature class.

The temperature of individual components should not exceed the specified range due to self-heating or heating by adjacent components. The actual operating temperature range will depend on the customer design, usage, environment and cooling solution. Consult Cooling Solutions for more information.

Voltage rails

The following table aims to be generic for all variants. The voltage ranges are consistent across assembly variants, but exceptions are possible (custom request).

Parameter

Min

Max

Units

Reference Document

VIN

3.135

3.465

V

SoM schematic.

VBAT_IN

1.8

5.5

V

SoM schematic.

Recommended operating conditions


Physical Dimensions

  • Module size: 52.0 mm × 76.0 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 5 mm.

  • PCB thickness: 1.471 mm ± 10 %.


Physical dimension

Currently Offered Variants 

Trenz shop TE0729 overview page*
English pageGerman page

*)  Module article name encoding table: AMD Zynq Ultrascale+ based modules (MPSoC, RFSoC)

Trenz Electronic shop overview

Revision History

Hardware Revision History

The hardware revision number can be found on the PCB board together with the module's model number, separated by a dash.

Board hardware revision number


DateRevisionChangesDocumentation Link
2017-1003
  1. Changed DCDC ( U24 , U25 , U26 ) from EN5311QI to MPM3834C.
  2. Changed DCDC ( U23 ) from EN6347QI to MPM3860GQW-Z.
  3. Changed load switch ( Q1 ) from TPS27082LDDCR to MP5077GG-Z.
  4. Added power supervisor ( U4 ).
  5. Changed power net name from 1.5V to DDR_VDD .
  6. Changed power sequencing.
    6.1) Voltage supervisor ( U4 ) enables 1V voltage rail (DCDC U23 ) via signal EN_Module .
    6.2) 1V DCDC ( U23 ) enables 1.8V voltage rail (DCDC U25 ) via signal PG_1V0 .
    6.3) 1.8V DCDC ( U25 ) enables 2.5V (DCDC U24 ) and DDR_VDD (DCDC U26 ) voltage rails via signal PG_1V8 .
    6.4) Voltage rail 3.3V (load switch Q1 ) is logical AND-enabled via
    6.4.1) power good signal PG_2V5_3V3 from voltage rail 2.5V DCDC ( U24 ) and DDR_VDD DCDC ( U26 ) via diode ( D4 )
    6.4.2) CPLD ( U6 ) signal EN_3V3 via diode ( D5 ).
  7. Added level shifter in signal FPGA_IO ( U7 , C185 , C186 ) to separate power domains. Added resistor R91 as fallback.
  8. Added diode D3 between U21 pin 3 net nRST_in and voltage rail 3.3V .
  9. Added option to improve noise immunity for signal nRST_in via capacitor C187 (default: not assembled).
  10. Connected exposed pad to GND for SDIO port expander ( U15 ).
  11. Added decoupling capacitors:
    11.1) C166 for U2I .
    11.2) C178 for U2H .
    11.3) C167 and C173 for U11 .
    11.4) C168 ... C171 for U3C .
    11.5) C172 and C179 for U5B .
    11.6) C174 for U15 .
    11.7) C175 for U8 .
    11.8) C176 for U9 .
    11.9) C177 for U20 .
  12. Changed 10 μF capacitors ( C36 , C86 ) to 22 μF.
  13. Changed 22 μF capacitors ( C117 , C121 , C125 , and C127 ) from size 0805 to 0603.
  14. Changed capacitor C144 from 470 nF, 6.3 V, X5R, 20 % to 100 nF, 16 V, X7R, 10 %.
  15. Pulled-up board revision signal ( U2D pin H17) and added board revision documentation.
  16. Changed fiducials to standard fiducials.
  17. Removed serial number S/N.
  18. Added test-points TP1 ... TP41 .
  19. Added serial number box on bottom overlay.
  20. Changed signal trace length.
  21. Added revision history, block and power overview and additional information. Updated page count and order.

REV03

PCN
PCN

-02
  1. Change DDR3 RAM (U1) from IM4G16D3FABG-125I to IS43TR16256BL-125KBLI
  2. Change e.MMC (U5) from MTFC4GACAJCN-4M IT to IS21ES08G-JCLI
  3. Clock Revision Change (U10, U12, U14) SiT8008AI-... to SiT8008BI-...
  4. Change e.MMC (U5) from IS21ES08G-JCLI to SDINBDG4-8G-XI2

REV02

PCN
PCN

-01
  • Initial release
-
Hardware revision history


Document Change History

DateRevisionContributorsDescription

  • Updated to TRM template 4.3.8

2023-12-11

v.32

ED

  • Changed Xilinx to AMD.
  • Updated to REV03.
  • Minor changes.

2022-07-13

v.30

Martin Rohrmüller

  • corrected VIN range table

2018-08-29

v.29John Hartfiel
  • update Links
2017-11-06v.28Ali Naseri
  • Updated B2B connector section.
2017-06-18
v.22
Jan Kumann
  • New product images.
2017-06-07
v.21
Jan Kumann
  • Minor re-formatting.

2017-05-22

v.12

Jan Kumann

  • Sections rearranged for common style.
  • New physical dimension images.
  • Hardware revision image added.
  • New block diagram.
2017-03-24v.11John Hartfiel
  • Correction: Boot Mode settings.
2016-06-14v.10

Ali Naseri

  • Initial release.

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Product Disclaimer

Products (incl. Software and Firmware) are exclusively designed, manufactured, and distributed for industrial applications. They are not intended, authorized, or certified for use in critical safety applications, medical devices, aerospace, nuclear, life-support, traffic-control, military, or other environments where malfunction or failure could result in personal injury, death, or significant property or environmental damage.

Trenz Electronic GmbH (“Manufacturer”) excludes any liability for inappropriate use in such contexts. The Customer bears all responsibility for verifying suitability and compliance with applicable regulations when deploying in any critical-use scenario. The Customer also agrees to indemnify and hold harmless the Manufacturer from any third-party claims or liabilities arising from such use.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.




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