TE0808 TRM (prelimanary draft)

Overview

The Trenz Electronic TE0808 is an industrial-grade MPSoC UltraSoM integrating a Xilinx Zynq UltraScale+, 4 x 4 Gbit (256 MByte) DDR4 SDRAM with 16-bit databus width, 2 x 256 MBit (32 MByte) Flash memory for configuration and operation, 20 Gigabit transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

Block Diagram

Figure 1: TE0808-03 Block Diagram

Main Components

Figure 2: TE0808-03 MPSoC module

1. Xilinx ZYNQ UltraScale+ XCZU9EG MPSoC, U1
2. Low-power programmable oscillator @ 33.333333 MHz (PS_CLK), U32
3. Red LED (DONE), D1
4. 256Mx16 DDR4-2400 SDRAM, U12
5. 256Mx16 DDR4-2400 SDRAM, U9
6. 256Mx16 DDR4-2400 SDRAM, U2
7. 256Mx16 DDR4-2400 SDRAM, U3
8. 12A PowerSoC DC-DC converter, U4
9. Quartz crystal, Y1
10. Low-power programmable oscillator @ 25.000000 MHz (IN0 for U5), U25
11. 10-channel programmable clock generator, U5
12. Ultra fine 0.50 mm pitch, Razor Beam™ LP Slim Terminal Strip with 160 contacts, J4
13. Ultra fine 0.50 mm pitch, Razor Beam™ LP Slim Terminal Strip with 160 contacts, J2
14. Ultra fine 0.50 mm pitch, Razor Beam™ LP Slim Terminal Strip with 160 contacts, J3
15. Ultra fine 0.50 mm pitch, Razor Beam™ LP Slim Terminal Strip with 160 contacts, J1
16. Quartz crystal, Y2
17. 256 Mbit serial NOR Flash memory, U7
18. 256 Mbit serial NOR Flash memory, U17

Key Features

• MPSoC: ZYNQ UltraScale+ ZU9EG 900 pin package
• Memory
  - 64-Bit DDR4, 8 GByte maximum
  - Dual SPI boot Flash in parallel, 512 MByte maximum
• User I/O
  - 65 x MIO, 48 x HD (all),  156 x HP (3 banks)
  - Serial transceiver: 4 x GTR + 16 x GTH
  - Transceiver clocks inputs and outputs
  - PLL clock generator inputs and outputs
• Size: 52 x 76 mm, 3 mm mounting holes for skyline heat spreader
• B2B connectors: 4 x 160 pin
• Si5345 - 10 output PLL
• All power supplies on board, single 3.3V power source required
  - 14 on-board DCDC regulators and 13 LDOs
  - LP, FP, PL separately controlled power domains
• Support for all boot modes (except NAND) and scenarios
• Support for any combination of PS connected peripherals

Initial Delivery State

Table 1: Initial Delivery State of the flash memories

Signals, Interfaces and Pins

Board to Board (B2B) connectors

The TE0808 MPSoC UltraSoM has four Board to Board (B2B) connectors with 160 contacts per connector.

Each connector has a specific arrangement of the signal-pins, which are grouped together in categories related to their functionalities and to their belonging to particular units of the Zynq Ultrascale+ MPSoC like I/O banks, interfaces and Gigabit transceivers
or to the on-board ICs of the UltraSoM.

Table 2: B2B Connector pin assignment of the TE0808-03 UltraSoM

For detailed information about the B2B pin-out, please refer to the Pin-out table.

Quad-SPI Flash memory

The TE0808-03 UltraSoM is equipped with two Micron Serial NOR Flash Memory with 256 Mbit (32 Mbyte) storage capacity each. The flash memory ICs with the schematic designators U7 and U17 are connected to bank 500 (PSMIO) of the Zynq MPSoC module via QSPI interface.

Following table shows the mapping of the MIO-pins to the flash memory ICs.

Table 3: Flash memory QSPI-interface

DDR4-2400 SDRAM

The TE0808-03 UltraSoM is equipped with with four Nanya NT5AD256M16B2-GN DDR4-2400 SDRAM modules with 4 Gbit (256 MByte) memory density. The SDRAM modules are connected to the PS DDR controller (bank 504) with 16 bit databus width respectively.

LEDs

TE0808 has one red LED (D1) which reflects MPSoC's 'DONE' signal. This LED goes ON when power has been applied to the module and stays ON until MPSoC's programmable logic is configured properly.

Clocking

Programmable Clock Generator

Following table illustrates on-board Si5345A programmable clock multiplier chip inputs and outputs:

Power and Power-On Sequence

The TE0808-03 module with the Xilinx Zynq Ultrascale+ MPSoC delivers a heterogeneous multi-processing system with integrated programmable logic and independently operable elements and is designed to meet embedded system power management requirement by advanced power management features. This features allow to offset the power and heat constraints against overall performance and operational efficiency.

This features allowing highly flexible power management is achieved by establishing Power Domains for power isolation. The Zynq Ultrascale+ MPSoC is composed of multiple power domains, whereby each power domain requires their particular extern DCDC converters.

The Processing System contains three Power Domains:

• Battery Power Domain, needed for BBRAM and RTC
• Full-Power Domain, needed for Application Processing Unit, DDR Controller, Graphics Processing Unit and High-Speed Connectivity
• Low-Power Domain, needed for Real-Time Processing Unit, Security and Configuration Unit, Platform Management Unit, System Monitor and General Connectivity

The fourth Power Domain is for the Programmable Logic (PL). If individual Power Domain control is not required, power rails can be shared between domains.

The following diagram shows the sequence of enabling the on-board DCDC converters dedicated to the particular Power Domains and powering up the needed voltages.

On the TE0808-03 SoM, following Power Domains can be powered up individually with power rails available on the B2B connectors:

• Full-Power Domain, supplied by power rail 'DCDCIN'
• Low-Power Domain, supplied by power rail 'LP_DCDC'
• Programmable Logic, supplied by power rail 'PL_DCIN'
• Battery Power Domain, supplied by power rail 'PS_BATT'

Each Power Domain has its own "Enabling"- and "Power Good"-signal. The power rail 'GT_DCDC' generates the supply voltages for the high speed Gigabit Transceivers units of the Zynq Ultrascale+ MPSoC.

For the absolute maximum ratings and the recommended operating conditions of the power rails, see section 'Technical Specifications'.

Figure 3: TE0808-03 Power-On sequence diagram

B2B connectors

Technical Specifications

Absolute Maximum Ratings

Recommended Operating Conditions

Physical Dimensions

• Module size: 52 mm × 76 mm.  Please download the assembly diagram for exact numbers

• Mating height with standard connectors: 4mm

• PCB thickness: 1.6mm

• Highest part on PCB: approx. 3mm. Please download the step model for exact numbers

All dimensions are given in millimeters.

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

-40 ... 125 TPS82085SIL data sheet

The module operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Weight

17 g - Plain module

Revision History

Hardware Revision History

Hardware revision number is written on the PCB board together with the module model number separated by the dash.

Document Change History

Date	Revision	Contributors	Description
2017-02-06		Jan Kumann	Initial document.

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