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Overview

The Trenz Electronic ZynqBerryZero / TE0727 is a commercial grade SoC module based on AMD Zynq™ 7010 FPGA with a form factor of the Raspberry Pi Zero. The SoC features dual-core Arm Cortex-A9 MPCore and a FPGA with 28k logic cells.

Furthermore, the 3.0 cm x 6.5 cm small board is equipped with 512 MByte DDR3L SDRAM, 16 MByte Flash and various connectors, such a micro USB to JTAG/UART port, a micro USB OTG port, a micro SD card slot, a mini HDMI, a 40 pin HAT header and a CSI-2 connector (camera).

Refer to https://trenz.org/te0727-info for current online available documentation.

Key Features

  • SoC
    • AMD Zynq 7010 SoC  -  XC7Z010-1CLG225C
  • RAM/Storage
    • 1x DDR3L SDRAM 4 Gbit (256 M x 16 bit)
    • QSPI Flash 128 Mbit (with XiP support)
    • EEPROM to store the programmer configuration
  • On Board
    • USB 2.0 to JTAG/UART bridge with programmer configuration
    • USB OTG PHY
    • 3x LEDs - user, green
    • Clocks for SoC PL, USB OTG PHY and JTAG/UART bridge
  • Interface
    • 2x Micro USB 2.0 Type B for OTG interface and JTAG/UART bridge
    • MicroSD Card with insertion detection
    • Mini HDMI Type C
    • ZIP FPC 0.5 mm for CSI Camera @ 3.3 V
    • Pin headers 2.54 mm (not populated):
      • 40x with 24x SE / 12x DIFF @ 3.3 V, I2C, 3.3 V and 5.0 V
      • 2x for Power
      • 2x for Reset
    • 1x DIP switch to set the boot source
  • Power
    • Single Rail 5.0 V power supply
    • Power multiplexer with Over Voltage protection and current limiting
  • Dimension
    • 30.0 mm x 65.0 mm

Block Diagram


TE0727 block diagram

Main Components

 

TE0727 main components
  1. SoC, U1
  2. DDR3L SDRAM, U8
  3. QSPI Flash, U5
  4. Oscillator for SoC PS, U14
  5. USB 2.0 to JTAG/UART converter, U3
  6. EEPROM for programmer configuration, U6
  7. Oscillator for JTAG/UART converter, U12
  8. USB OTG PHY, U18
  9. Oscillator for USB OTG PHY, U15
  10. USB VBUS switch, U2
  11. Power multiplexer, U10
  12. Voltage monitor, U22
  13. LED green user, D1
  14. LED green user, D2
  15. LED green user, D3
  16. Micro USB 2.0 Type B for JTAG/UART converter, J1
  17. Micro USB 2.0 Type B for OTG interface, J3
  18. MicroSD Card socket, J9
  19. Mini HDMI Type C, J4
  20. ZIP FPC 0.5 mm for CSI Camera, J2
  21. 40x pin header 2.54 mm - 26x IO, I2C and 5.0 V power
  22. 2x pin header 2.54 mm - 5.0 V power, J5
  23. 2x pin header 2.54 mm - Reset, J13

Initial Delivery State

Storage device name

Designator

Content

Notes

QSPI Flash Memory

U5

Not programmed


EEPROM

U6

Programmer configuration

Do not overwrite!

Initial delivery state of programmable devices

Signals, Interfaces and Pins

Connectors

Connector Type

Designator

Interface

IO count

Notes

Pin header 2.54 mm

J8

IO HR

26x SE / 12x DIFF


ZIP FPC 0.5 mm

J2

IO HR

3x DIFF


ZIP FPC 0.5 mm

J2

IO HR

2x SE


Micro USB Type B

J1

JTAG/UART

1x DIFF


Micro USB Type B

J3

USB OTG

1x DIFF


MicroSD socket

J9

SD IO

7x SE


Mini HDMI Type C

J4

HDMI data

4x DIFF


Board connectors

Test Points

Test

Point

REV04 / REV02

REV01

Signal


Notes

Top

Bottom

Signal

TP1


x

TDI


TP2


x

3.3V


TP3


x

TDO


TP4


x

1.8V


TP5


x

TCK


TP6


x

1.0V


TP7


x

TMS


TP8


x

1.35V


TP9


x

5V


TP10


x

GND


TP11


x

GND


TP12


x

GND


TP13

x


PI0_DQ3/M3

Not used


TP14


x

POR_B


TP15

x


GND

Not used


Test points information

On-board Peripherals

Chip/Interface

Designator

Connected to

Notes

SoC

U1

  • DDR3L SDRAM U8
  • QSPI Flash U5
  • USB 2.0 to JTAG/UART U3
  • USB OTG PHY U18
  • I2C Multiplexer U13
  • Voltage Monitor U22
  • DCDCs U11 / U13
  • MicroSD card socket
  • Mini HDMI Type C J4
  • Pin header GPIO J8
  • Pin header 5.0 V / VIN power J5
  • Pin header EXTRST / reset J13
  • CSI Camera connector J2


DDR3L SDRAM

U8

  • SoC U1


QSPI Flash

U5

  • SoC U1
  • DIP switch S1


USB 2.0 to JTAG/UART converter

U3

  • SoC U1
  • EEPROM programmer configuration U6
  • Oscillator U12
  • Micro USB Type B J1


EEPROM Programmer Configuration

U6

  • USB 2.0 to JTAG/UART converter


USB OTG PHY

U18

  • SoC U1
  • Oscillator U12
  • Micro USB Type B J1


I2C Multiplexer

U16

  • SoC U1
  • Pin header J8
  • CSI connector J2

U16 - 0x70

Power Multiplexer

U10

  • Pin header power J5
  • All DCDCs U9 / U11 / U12 / U13


Voltage monitor

U22

  • SoC U1
  • Voltage Rails 3.3 V and 1.0 V
  • Pin header reset J13


HDMI ESD protection

U4

  • SoC U1
  • Mini HDMI Type C connector J4


Oscillator

U14

  • SoC U1

33 ⅓ MHz

Oscillator

U12

  • USB 2.0 to JTAG/UART converter

12 MHz

Oscillator

U15

  • USB OTG PHY

52 MHz

On-board peripherals

Configuration and System Control Signals

Control signals represent hardware defined logic states, for final state consider the firmware and reference designs.

Control Signals and Buses

Signal Name

Connector.Pin

Direction 1)

Description

EXTRST

J13.2

IN

External reset signal

USB 2.0 JTAG/UART

J1

INOUT


I2C ( ID_SDA / ID_SCL )

J8.27 / J8.28

Signal dependent

External IO I2C

I2C ( CSI_SDA / CSI_SCL )

J2.2 / J2.3

Signal dependent

CSI camera I2C

I2C ( SDA_B / SCL_A )

J4.SCL / J4.SDA

Signal dependent

HDMI I2C 

1) Direction:

    • IN: Input from the point of view of this board.

    • OUT: Output from the point of view of this board.

    • INOUT: Bidirectional signal.
    • Signal dependent: A Signal can have different functions and directions as part of a Bus.
Control signals and buses

DIP switches

DIP switch

Signal Name

Boot mode selection

JTAG

QSPI

S1

BOOT_MODE0

ONOFF
DIP switches

Power and Power-On Sequence


Power Rails


Power Rail Name / Schematic Name

Connector.Pin

Direction 1)

Notes

USB_B_Vbus

J1.1 / J3.1

IN

Supply via USB power from J1 or J3. Over voltage protection threshold is 5.55 V.

VIN

J5.1

IN

Supply via pin header J5. Over voltage protection threshold is 5.55 V.

USB_Vbus

J3.1

INOUT

USB OTG Vbus voltage.

5V

J8.2 / J8.4

OUT

External IO supply

3.3V

J8.1 / J8.17

OUT

External IO supply

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.
Power rails

Recommended Power up Sequencing


SequenceNet nameRecommended Voltage RangePull-up/downDescriptionNotes
0---Configuration signal setup.See Configuration and System Control Signals.
1

USB_B_Vbus

VIN

5 V (± 5 %)

5 V (± 5 %)

-

-

Power supply. 

Carrier power supply via USB J1 or pin header J5.

Power sequencing

Board to Board Connectors

Technical Specifications

Absolute Maximum Ratings *)

Power Rail Name/ Schematic Name

Description

Min

Max

Unit

USB_B_Vbus

Supply via USB

-0.3

24

V

VIN

Supply via pin header

-0.3

24

V

USB_Vbus

USB OTG BUS voltage

0

5.3

V

Absolute maximum ratings

*) Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Condition". Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

Recommended Operating Conditions

Temperature range

Trenz Electronic classifies modules into temperature range categories by subsumption of its component data (PCB, ICs, connectors, passive components). The temperature ranges are values for ambient air temperature and do not reflect the junction temperature of individual components.

The categories are:

  • Modules with commercial (C) temperature grade are equipped with components that cover at least the ambient temperature range of 0 °C to 70 °C.
  • Modules with extended (E) temperature grade are equipped with components that cover at least the ambient temperature range of 0 °C to 85 °C.
  • Modules with industrial (I) temperature grade are equipped with components that cover at least the ambient temperature range of -40 °C to 85 °C.

These categories do not take into account the entire custom system consisting of:

  • Customer SoC design. The allowed main SoC temperature range is specified from the vendor by junction temperature using corresponding classes (C, E, I). See vendor documentation.
  • Cooling solution, active and or passive cooling.
  • Climate or environmental conditions besides ambient temperature range.
  • Module orientation, neighbouring assemblies, neither other heat sources nor the SoC as heat source to other components.

Classification of the module can be looked up here: AMD 7 Series Zynq-7000 based modules i.e.: TExxxx-xx-xx'I'xx, the 'I' indicates that all components are at least in Industrial temperature class.

The temperature of individual components should not exceed the specified range due to self-heating or heating by adjacent components. The actual operating temperature range will depend on the customer design, usage, environment and cooling solution. Consult Cooling Solutions for more information.

Voltage rails

The following table aims to be generic for all variants. The voltage ranges are consistent across assembly variants, but exceptions are possible (custom request).

Parameter

Min

Max

Units

Reference Document

USB_B_Vbus

4.75

5.25

V

Module Schematic

VIN

4.75

5.25

V

Module Schematic

USB_Vbus

4.75

5.25

V

Module Schematic

Recommended operating conditions

Physical Dimensions

  • Module size: 30.0 mm × 65.0 mm.  Please download the assembly diagram for exact numbers.

  • PCB thickness: 1.606 mm ±10 %.

Physical dimension

Currently Offered Variants 

Trenz shop TE0727 overview page*
English pageGerman page

*)  Module article name encoding table: AMD 7 Series Zynq-7000 based modules

Trenz Electronic shop overview

Revision History

Hardware Revision History

The hardware revision number can be found on the PCB board together with the module's model number separated by a dash.

The picture shows a revision 02 module.

Board hardware revision number


Date

Revision

Changes

Documentation Link

2024-04










2024-07


2026-03

04

  1. J5 and J13 connectors changed back.
  2. Power Supply Sequencing was changed according to DS187.
  3. Test points TP16, TP17, TP18 removed.
  4. U10 Current limit changed 1.24A → 2.037A, R28 replaced by 56K (was 100K).
  5. U7(SiT8008AI-73-XXS-12.000000E) replaced by SiT8008BI-73-XXS-12.000000E.
  6. U14(SiT8008AI-73-XXS-33.333333E) replaced by SiT8008BI-73-XXS-33.333333E.
  7. U15 (SiT8008AI-73-XXS-52.000000E) replaced by SiT8008BI-73-XXS-52.000000E.
  8. Green LEDs D1, D2, D3 replaced by 19-213/G6C-BM1N2/DT.
  9. The capacitors were replaced:
    - C51: 470nF ---> 10μF
    - C55, C56: 470nF ---> 47μF
  10. The capacitors C13, C25 (0805) replaced by (0402) (BOM optimisation);
  11. Added resistor R140 according to UG933.
  12. U5 is EOL and replaced by S25FL128LAGMFI013 (created new assembly variant).

  13. Digilent License has been removed.
  14. Resistor R63 is populated and replaced with 12K (was 0).

  15. J2 ZIF FPC 54548-2271 is EOL and replaced with 687122183722 in assembly variant.

REV04
PCN

2023-05

03

  1. EOL components U11 , U12 (EP53A7LQI), U9 , U13 (EP53A7HQI) were replaced by MPM3834CGPA.
  2. EOL component U16 (PCA9540BGD,125) was replaced by PCA9540BDP,118.
  3. EOL components L1 - L7, L10 BKP0603HS121-T replaced by MPZ0603S121HT000.
  4. Added S1 switch and R53 for "JTAG only mode" enable.
  5. The signals were renamed:
    - SPI-DQ0/M0 ---> SPI-DQ0/M3
    - SPI-DQ3/M3 ---> SPI-DQ3/M0
    according to AMD Table 6-4.
  6. Power supply rail of Bank 35 was changed from 1.8V to 3.3V.
  7. Added decoupling capacitors C52, C53, C73, C85 according to AMD specification (UG
    933).
  8. The capacitors were replaced:
    - C7, C16, C54, C71, C93: 47μF (0805) ---> 47μF (0603),
    - C1, C4, C12, C15, C18, C19, C24, C35, C57, C63, C65, C79, C81, C87, C89 4.7μF (0402)---> 10μF (0402),
    - C29, C32, C33, C41, C42, C43, C44, C47: 10μF (0402) ---> 22μF (0603).
  9. Capacitor C86 replaced by 47μF (was 10μF).
  10. Added power diagram.
  11. Added Block diagram.
  12. Added Test Points TP16, TP17, TP18.
  13. J5 and J13 connectors are polarity changed.

-

2020-11

02

  1. Fixed I2C connection, added I2C MUX (U16).
  2. Added optional pin-header connector for select JTAG boot mode.
  3. Added 2x user LEDs.
  4. Changed obsolete DDR3 chip.
  5. Fixed wrong type connector for CSI.
  6. Full update library.

REV02
PCN

2019-02

01

  • Initial release

REV01

Hardware revision history


Document Change History

DateRevisionContributorDescription

  • Main Components / Hardware Revision History - updated pictures

2026-07-20

v.17

Kilian Jahn

  • Initial release

--

all

  • --
Document change history

Disclaimer

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The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

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Products (incl. Software and Firmware) are exclusively designed, manufactured, and distributed for industrial applications. They are not intended, authorized, or certified for use in critical safety applications, medical devices, aerospace, nuclear, life-support, traffic-control, military, or other environments where malfunction or failure could result in personal injury, death, or significant property or environmental damage.

Trenz Electronic GmbH (“Manufacturer”) excludes any liability for inappropriate use in such contexts. The Customer bears all responsibility for verifying suitability and compliance with applicable regulations when deploying in any critical-use scenario. The Customer also agrees to indemnify and hold harmless the Manufacturer from any third-party claims or liabilities arising from such use.

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No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.



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