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Overview

The Trenz Electronic TE0841 is a 4 x 5 cm SoM integrating AMD Kintex UltraScale, QSPI Flash for configuration and operation, DDR4 SDRAM and powerful switch-mode power supplies for all on-board voltages.
Numerous configurable I/Os are provided via B2B connectors. All Trenz Electronic 4 x 5 cm SoMs are mechanically compatible.

Refer to http://trenz.org/te0841-info for current online available documentation.

Key Features

  • FPGA
    • Kintex UltraScale FPGA: XCKU035 / XCKU040 1)
    • Speedgrade: -1 / -2 / -3 / -1L 1)
    • Temperature Range: C / I 1)
    • Package: A784
  • RAM/Storage
    • 2x DDR4 SRAM 2 GByte 2)
    • QSPI Flash 64 MB (with XiP support) 2)
  • On Board
    • System Controller LCMX02
    • Clock Generator
    • Clocks for FPGA, DDR4 and Clock Generator
    • LED 1x for SoM Status green
  • Interface
    • Trenz 4 x 5 SoM 3x B2B Connector (Samtec LSHM) socket:
      • IO HP: 84x SE / 41x DIFF
      • IO HR: 60x SE / 28x DIFF
      • MGT: 8x MGT and 2x MGT CLK
  • Power
    • Single Rail power supply possible
    • All power supplies on-board
    • Monitoring for most Voltage Rails
  • Dimension
    • 40 mm x 50 mm
  • Notes
    1) Available as assembly variant or upon request.
    2) Other sizes/devices, which are pin/package-compatible, upon request.

Block Diagram

TE0841 block diagram

Main Components

 


TE0841 main components
  1. AMD Kintex UltraScale FPGA, U1
  2. QSPI Flash, U6
  3. DDR4 SDRAM, U4, U5
  4. System Controller CPLD, U18
  5. LED status green, D1
  6. Clock Generator, U2
  7. Oscillator for Clock Generator 25 MHz, U3
  8. Oscillator for FPGA 200 MHz, U11
  9. Oscillator for FPGA 25 MHz, U20
  10. Voltage Monitor, U21
  11. B2B connector, JM1, JM2, JM3

Initial Delivery State

Storage device name

Content

Notes

SPI Flash Memory

Not programmed


DDR4 SDRAM

Not programmed


System Controller

Firmware

Refer to TE0841 CPLD Firmware / TE0841 CPLD for more information.

Programmable Clock Generator

Programmed

Refer to Programmable Clock Generator for more information.
Initial delivery state of programmable devices on the module

Programmable Clock Generator

The programmable Clock Generator (Si5338A) is used to generate four different clocks from 25 MHz oscillator connected to pin IN3.

The Si5338 output frequency clocks are programmable by FPGA via I2C bus. Refer to TE0841 Reference Designs for more information.


Programmable clock generator


Clock GeneratorCLK Output I Net Name I Destination Device.Pin

Default frequency in MHz

Notes
InputIN3 | U3.3

25


OutputCLK0A/B | CLK1_P/N | U1C.R23 / U1C.P23

100

Not programmed in SoM REV01.
CLK1A/B | CLK2_P/N | MGT_CLK1_P/N | U1K.V6 / U1K.V5

125


CLK2B/B | CLK3_P/N | MGT_CLK3_P/N | U1K.AB6 / U1K.AB5

156.25


CLK3A/B | CLK0_P/N | U1C.T24 / U1C.T25

156.25

Not programmed in SoM REV01.

 Signals, Interfaces and Pins

Connectors

Connector Type

Designator

Interface

IO count

Notes

B2B

JM1

MGT

3x MGT (TX/RX)


B2B

JM3

MGT

5x MGT (TX/RX)


B2B

JM3

MGT CLK

2x DIFF


B2B

JM1

IO HR

48x SE / 24x DIFF

Bank 64

B2B

JM1

IO HR

8x SE / 1x DIFF

Bank 65

B2B

JM3

IO HR

4x SE / 2x DIFF

Bank 65

B2B

JM3

IO HP

16x SE / 8x DIFF

Bank 66

B2B

JM2

IO HP

50x SE / 24x DIFF

Bank 67

B2B

JM2

IO HP

18x SE / 9x DIFF

Bank 68

Board Connectors


Test Points

Test Point

Top

Bottom

Signal

Notes

TP1

x


PLL_SCL


TP2

x


PLL_SDA


TP3

x


3.3VIN


TP4

x


PL_1V8


TP5

x


B64_VCO


TP6

x


B66_VCO


TP7

x


B67_VCO


TP8

x


B68_VCO


TP9

x


VBAT_IN


TP10

x


VBATT


TP11

x


MGTAUX


TP12

x


GND


TP13

x


PROG_B


TP14

x


DONE


TP15

x


INIT_B


TP16

x


GND


TP17


x

PLL_SCL


TP18


x

PLL_SDA


TP19


x

PL_GT_1V42


TP20


x

PL_GT_1V2


TP21


x

DDR_2V5


TP22


x

DDR_1V2


TP23


x

0.95V


TP24


x

MGTAVCC


TP25


x

MGTAVTT


TP26


x

VBATT


TP27


x

MGTAUX


TP28


x

AVCC


TP29


x

PROG_B


TP30


x

DONE


TP31


x

INIT_B


TP32


x

GND


TP33


x

PG_ALL


TP34


x

A_DDR4-TEN


TP35


x

VREFA


TP36


x

VREFA2


TP37


x

B_DDR4-TEN



Test Points Information

On-board Peripherals

Chip/Interface

Designator

Connected to

Notes

FPGA

U1

  • DDR4 SDRAM, U4, U5
  • SPI Flash, U6
  • Clock generator, U2
  • System Controller, U18
  • B2B, JM1, JM2, JM3


DDR4 SDRAM

U4 / U5

  • FPGA, U1


QSPI Flash

U6

  • FPGA, U1


Clock Generator

U2

  • FPGA, U1


System Controller

U18

  • FPGA, U1
  • LED SoM status, D1
  • B2B, JM1, JM2, JM3

Refer to TE0841 CPLD Firmware / TE0841 CPLD for more information.

Oscillator

U3

  • Clock Generator, U2

25 MHz

Oscillator

U11

  • FPGA DDR4 Banks, U1

200 MHz

Oscillator

U20

  • FPGA, U1

25 MHz

On board peripherals

Configuration and System Control Signals


Signal Name

Connector.Pin

Direction 1)

Description

SC1JM1.32-

System Controller Signal 1. Firmware dependent 2)

SC2JM1.30INOUTPGOOD Pin. Firmware dependent 2)
SC3JM1.28INPower Enable Pin. Firmware dependent 2)
SC4JM1.7-System Controller Signal 4. Firmware dependent 2)

I2C (SDA / SCL)

JM1.93 / JM1.95

Signal dependent

FPGA design dependent 3)

JTAGMODE

JM1.89

IN

Select JTAG access between FPGA or System Controller.

Firmware dependent 2)

nRST_SC0

JM2.18

IN

SoM reset. Firmware dependent 2)

JTAG (TMS / TDI / TDO / TCK)

JM2.93 / JM2.95 / JM2.97 / JM2.99

Signal dependent


1) Direction:

    • IN: Input from the point of view of this board.

    • OUT: Output from the point of view of this board.

    • INOUT: Bidirectional signal.
    • Signal dependent: A Signal can have different functions and directions as part of a bus.

2) Refer to TE0841 CPLD Firmware / TE0841 CPLD for more information.

3) Refer to TE0841 Reference Designs for more information.

Controller signal.

Power and Power-On Sequence


Power Rails

Power Rail Name / Schematic Name

Connector.Pin

Direction 1)

Notes

VIN

JM1.1 / JM1.3 / JM1.5
JM2.2 / JM2.4 / JM2.6 / JM2.8

IN

Main SoM supply

3.3VIN

JM1.13 / JM1.15

IN

Management supply

3.3V

JM2.10 / JM2.12 / JM2.91

OUT

 Output to power external IO

PL_1V8

JM1.39

OUT

 Output to power external IO

B64_VCO

JM1.9 / JM1.11

IN

Bank 64 IO power supply

B66_VCO

JM2.1 / JM2.3

IN

Bank 66 IO power supply

B67_VCO

JM2.7 / JM2.9

IN

Bank 67 IO power supply

B68_VCO

JM2.5

IN

Bank 68 IO power supply

VBAT_IN

JM1.79

IN

Backup batterie power supply

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.
Module power rails.

Recommended Power up Sequencing


SequenceNet nameRecommended Voltage RangePull-up/downDescriptionNotes
0---

Configuration SoM signal setup.

See Configuration and System Control Signals.

1

3.3VIN

3.3 V ±5 %-Apply Management supply.

VIN


3.3 V

-3 % / +5 %

-Apply main SoM supply.
5.0 V ±5 %-
2

SC3 1)

--Enable SoM system.
 3

SC2 1)

--

PGOOD signal shows that bank voltages can be supplied.

The SoMs internal power-on sequence is complete when these voltages reach their nominal values.

4

B64_VCO

1.14 V to 3.4 V-Apply FPGA bank IO supplies.

B66_VCO

0.95 V to 1.89 V-

B67_VCO

0.95 V to 1.89 V-

B68_VCO

0.95 V to 1.89 V-

1) Firmware dependent signal. Refer to TE0841 CPLD Firmware / TE0841 CPLD for more information.

Baseboard Design Hints

Board to Board Connectors

These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.

4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.

  • 2 x REF-189016-02 (compatible to LSHM-150-04.0-L-DV-A-S-K-TR), (100 pins, "50" per row)
  • 1 x REF-189017-02 (compatible to LSHM-130-04.0-L-DV-A-S-K-TR), (60 pins, "30" per row) (depending on module)
Connector Mating height

When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height

Order numberConnector on baseboardcompatible toMating height
23836REF-189016-01LSHM-150-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-150-03.0-L-DV-A-S-K-TRLSHM-150-03.0-L-DV-A-S-K-TR7.0 mm
23838REF-189016-02LSHM-150-04.0-L-DV-A-S-K-TR8.0 mm

LSHM-150-06.0-L-DV-A-S-K-TRLSHM-150-06.0-L-DV-A-S-K-TR10.0mm
26125REF-189017-01LSHM-130-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-130-03.0-L-DV-A-S-K-TRLSHM-130-03.0-L-DV-A-S-K-TR7.0 mm
24903 REF-189017-02LSHM-130-04.0-L-DV-A-S-K-TR8.0 mm

LSHM-130-06.0-L-DV-A-S-K-TRLSHM-130-06.0-L-DV-A-S-K-TR10.0mm
Connectors.

The module can be manufactured using other connectors upon request.

Connector Speed Ratings

The LSHM connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
12 mm, Single-Ended7.5 GHz / 15 Gbps
12 mm, Differential

6.5 GHz / 13 Gbps

5 mm, Single-Ended11.5 GHz / 23 Gbps
5 mm, Differential7.0 GHz / 14 Gbps
Speed rating.
Current Rating

Current rating of  Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).

Connector Mechanical Ratings
  • Shock: 100G, 6 ms Sine
  • Vibration: 7.5G random, 2 hours per axis, 3 axes total


Manufacturer Documentation

  File Modified
PDF File hsc-report_lshm-lshm-05mm_web.pdf High speed test report Apr 07, 2016 by Thorsten Trenz
PDF File lshm_dv.pdf LSHM catalog page Apr 07, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf Recommended layout and stencil drawing Apr 07, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf Technical drawing Apr 07, 2016 by Thorsten Trenz
PDF File REF-189016-01.pdf Technical Drawing Apr 07, 2016 by Thorsten Trenz
PDF File REF-189016-02.pdf Technical Drawing Apr 07, 2016 by Thorsten Trenz
PDF File REF-189017-01.pdf Technical Drawing Apr 07, 2016 by Thorsten Trenz
PDF File REF-189017-02.pdf Technical Drawing Apr 07, 2016 by Thorsten Trenz
PDF File TC0923--2523_report_Rev_2_qua.pdf Design qualification test report Apr 07, 2016 by Thorsten Trenz
PDF File tc0929--2611_qua(1).pdf Shock and vibration report Apr 07, 2016 by Thorsten Trenz



Technical Specifications

Absolute Maximum Ratings *)

Power Rail Name/ Schematic Name

Description

Min

Max

Unit

VIN

Main SoM supply

-0.3

6.0

V

3.3VIN

Management supply

-0.3

3.4

V

B64_VCO

Bank 64 IO supply

-0.5

3.4

V

B66_VCO

Bank 66 IO supply

-0.5

2.0

V

B67_VCO

Bank 67 IO supply

-0.5

2.0

V

B68_VCO

Bank 68 IO supply

-0.5

2.0

V

VBAT_IN

Backup battery supply

-0.3

6.0

V

Absolute maximum ratings

*) Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Condition". Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

Recommended Operating Conditions

Temperature range

Trenz Electronic classifies modules into temperature range categories by subsumption of its component data (PCB, ICs, connectors, passive components). The temperature ranges are values for ambient air temperature and do not reflect the junction temperature of individual components.

The categories are:

    Modules with commercial (C) temperature grade are equipped with components that cover at least the ambient temperature range of 0 °C to 70 °C.
    Modules with extended (E) temperature grade are equipped with components that cover at least the ambient temperature range of 0 °C to 85 °C.
    Modules with industrial (I) temperature grade are equipped with components that cover at least the ambient temperature range of -40 °C to 85 °C.

These categories do not take into account the entire custom system consisting of:

    Customer SoC design. The allowed main SoC temperature range is specified from the vendor by junction temperature using corresponding classes (C, E, I). See vendor documentation.
    Cooling solution, active and or passive cooling.
    Climate or environmental conditions besides ambient temperature range.
    Module orientation, neighbouring assemblies, neither other heat sources nor the SoC as heat source to other components.

Classification of the module can be locked up here: Article Number Information i.e.: TExxxx-xx-xx'I'xx, the 'I' indicates that all components are at least in Industrial temperature class.

The temperature of individual components should not exceed the specified range due to self-heating or heating by adjacent components. The actual operating temperature range will depend on the customer design, usage, environment and cooling solution. Consult Cooling Solutions for more information.

Voltage rails

The following table aims to be generic for all variants. The voltage ranges are consistent across assembly variants, but exceptions are possible (custom request).

Parameter

Min

Max

Units

Reference Document

VIN


3.201

3.465

V

SoM Schematic

4.75

5.25

V

SoM Schematic

3.3VIN

3.135

3.465

V

SoM Schematic

B64_VCO

1.14

3.40

V

AMD DS892

B66_VCO

0.95

1.89

V

AMD DS892

B67_VCO

0.95

1.89

V

AMD DS892

B68_VCO

0.95

1.89

V

AMD DS892

VBAT_IN

2.2

5.5

V

AMD DS892

Recommended operating conditions.


Physical Dimensions

  • Module size: 40 mm × 50 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 8 mm.

  • PCB thickness: 1.74 ±10 % mm.

 


Physical Dimension

Currently Offered Variants 

Trenz shop TE0841 overview page*
English pageGerman page

*)  Module article name encoding table: Ultrascale+ and Ultrascale Kintex, Artix and Spartan based modules

Trenz Electronic Shop Overview

Revision History

Hardware Revision History

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

 


Board hardware revision number.


DateRevisionChangesDocumentation Link
2024-0503
  1. L1 , L2 , L3 , L4 , L5 , L6 were changed from BKP0603HS121-T to MPZ0603S121HT000
  2. D2 was added
  3. Q1 TPS27082LDDCR was changed to MP5077GG-Z
  4. U21 STM6710LWB6F was added
  5. U7 and U14 were changed from EN63A0QI to LTM4638EY
  6. Signal trace lengths were changed. PCB routing was improved
  7. Legal Notices and Power diagram pages were added
  8. System Overview was added on page TE0841.SchDoc
  9. Net names for pins 4 and 5 for U11 were swapped
  10. C70 , C71 , C72 , C73 , C74 , C75 , C76 , C77 , C78 , C79 , C80 , C81 , C82 , C83, C84 and C89 were added
  11. R79 , R80 , R81 , R82 , R83 were added
  12. R35 was changed from 4.7k to 2.37k
  13. C49 was changed from 4u7 6.3V 0402 to 10u 16V 0603
  14. TP3 - TP37 were added
  15. R25 , R26 , R52 , R57 were changed from 4k7 to 23k7
  16. U11 was changed from DSC1123DL5-200 to SIT9121AI-2B1-XXE-200.00000
  17. All SCH symbols and PCB footprints were updated from library
  18. R11 was changed from 110k to 124k, net "PL_GT_1V35" was renamed to "PL_GT_1V42"
  19. R71 setted as "DNP"

REV03

PCN

2018-0502
  1. U4 / U5: changed DDR4 chip: NT5AD256M16B2-GN -> K4A4G165WE-BCRC (K4A8G165WB-BIRC)
  2. Fixed sense connection on DCDC
  3. U6: changed SPI flash chip: N25Q256A11E1240E-> N25Q512A11G1240E
  4. Full update LIB
  5. Added additional resistors for support 16GBit DDR chips
  6. Added strong pull-down to EN_PL
  7. Added additional testpoints for I2C bus
  8. Added additional MEMS oscillator (25MHz)
  9. Changed pull-up power supply VIN -> 3.3VIN on the PG_DDR net
  10. Added pull-down on the EN_DDR (04.05.2022)
  11. S/N Track-it pad set not fitted
  12. Change Resistor value R27 (49k9 -> 80k6), rename net "PL_GT_1V05 -> PL_GT_1V2" ----- (23.10.2023)

REV02

PCN

PCN

PCN

2015-12

01

1. Initial revision

2. U1: changed schematic symbol. Next pins swapped to match same polarity order:

  • AE13 (IO_L6P_T0U_N10_AD6P_64)/AE12 (IO_L6N_T0U_N11_AD6N_64)
  • J5 (IO_L18P_T2U_N10_AD2P_66)/J4 (IO_L18N_T2U_N11_AD2N_66)

3. Net names changed (no electrical changes):
JM1: swapped signals B64_L6:

  • B64_L6_N - pin 40 (was pin 42)
  • B64_L6_P - pin 42 (was pin 40)

JM3: swapped signals B64_L6:

  • B66_L18_N - pin 52 (was pin 54)
  • B66_L18_P - pin 54 (was pin 52)
REV01
Hardware Revision History


Document Change History

Date

Revision

Contributors

Description

  • Updated to TRM Template 4.3.3

2024-06-13

v.72

John Hartfiel

  • Update oscillator section with additional CLK

2019-12-10

v.71

John Hartfiel

  • Correction delivery section
  • Update key features, document history
2018-08-07v.69Ali Naseri
  • Updated pictures main components
2018-07-13v.68Ali Naseri
  • PCB REV02

2018-07-10

v.58

John Hartfiel
  • Update links

2018-03-13

v.57Jan Kumann, Ali Naseri
  • Initial document.
--all


  • --

Table 18: Document change history

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Product Disclaimer

Products (incl. Software and Firmware) are exclusively designed, manufactured, and distributed for industrial applications. They are not intended, authorized, or certified for use in critical safety applications, medical devices, aerospace, nuclear, life-support, traffic-control, military, or other environments where malfunction or failure could result in personal injury, death, or significant property or environmental damage.

Trenz Electronic GmbH (“Manufacturer”) excludes any liability for inappropriate use in such contexts. The Customer bears all responsibility for verifying suitability and compliance with applicable regulations when deploying in any critical-use scenario. The Customer also agrees to indemnify and hold harmless the Manufacturer from any third-party claims or liabilities arising from such use.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.




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