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Overview

The Trenz Electronic TE0763 is the successor of TE0630 and TE0300. Therefore, it is fully mechanically and largely electrically backward compatible with these modules.

The TE0763 series are industrial grade micro FPGA modules integrating an AMD Artix 7 FPGA, a Mini USB 2.0 port, 1 Gbit DDR3 SDRAM, 256 Mbit QSPI flash memory for configuration and operation. Powerful switch-mode power supplies for all on-board voltages. A large number of configurable IOs are provided via B2B connectors. 

All this on a tiny footprint, smaller than a credit card, at the most competitive price. Hardware and software development environment as well as reference designs are available free of charge.

Refer to https://trenz.org/te0763-info for current online available documentation.

Key Features

  • Successor of TE0630 and TE0300
    • Pin compatible with TE0630 and TE0300
  • SoC/FPGA/Module
    • AMD Artix-7 FPGA :     XC7A200T
    • Speedgrade 1):             -1 / -2 / -3 / -1L / -2L
    • Temperature Range 1): C / E / I 1)
    • Package 1):                   FGG484 / FBG484
  • RAM/Storage
    • DDR3 SDRAM 1 Gbit (1x 64 M x 16 bit) 2)
    • QSPI Flash 256 Mbit (with XiP support) 2)
    • EEPROM 128 Kbit
  • On Board
    • Microcontroller with USB 2.0 PHY
    • Clocks for FPGA and FPGA DDR3 bank
    • Clock for FPGA auxiliary and Microcontroller with USB 2.0 PHY
    • Clock buffer for the aforementioned shared clock
    • LEDs : 4x user, green
  • Interface
    • Mini USB 2.0 port
    • Trenz 40.5 x 47.5 SoM 2x B2B connector (Hirose DF17) socket:
      • IO HR : 61x SE / 16x DIFF + 2 CLK DIFF @ 3.3 V
      • IO HR : 37 SE / 18 DIFF + 4x CLK DIFF @ variable voltage VCCIO0
    • 1x button - user definable
    • 4x DIP switches - 2x SoM configuration, 2x user definable
  • Power
    • Single Rail 5.0 V power supply
    • Supply over current protection
    • All voltage rails feature low noise power modules
  • Dimension
    • 40.5 mm x 47.5 mm
  • Notes
    1) Available as assembly variant or upon request.
    2) Other sizes/devices, which are pin/package-compatible, upon request.

Block Diagram


TE0763 block diagram

Main Components

TE0763 main components
  1. FPGA - AMD Artix-7 FPGA, U1
  2. DDR3 SDRAM, U2
  3. QSPI flash, U3
  4. Microcontroller with USB 2.0 PHY, U9
  5. EEPROM, U8
  6. Oscillator for FPGA and Microcontroller with USB 2.0 PHY, U5
  7. Oscillator for FPGA, U6
  8. Oscillator for FPGA DDR bank, Y1
  9. 1x user button, S1
  10. 4x DIP switches, S2
  11. Mini USB 2.0 connector, J1
  12. B2B - Hirose DF1, J4, J5

Initial Delivery State

Storage device name

Designator

Content

Notes

Dual QSPI Flash

U3

Not programmed


Microcontroller with USB 2.0 PHY

U9

Firmware

For further information see TE0763 USB Controller.

EEPROM

U8

Not programmed


Initial delivery state of programmable devices

Signals, Interfaces and Pins

Connectors

Connector Type

Designator

Interface

IO count

Notes

B2B

J4

IO HR

11x SE

Bank 14 @ 3.3 V

B2B

J4

IO HR

37x SE / 18x DIFF

Bank 15 @ variable voltage VCCIO0

B2B

J4

IO HR CLK

4x DIFF

Bank 15 @ variable voltage VCCIO0

B2B

J5

IO HR

10x SE

Bank 13 @ 3.3 V

B2B

J5

IO HR

6x SE

Bank 14 @ 3.3 V

B2B

J5

IO HR

45x SE / 22x DIFF

Bank 16 @ 3.3 V

B2B

J5

IO HR

34x SE / 16x DIFF

Bank 16 @ 3.3 V

B2B

J5

USB 2.0

1x DIFF


Mini USB 2.0

J1

USB 2.0

1x DIFF


Board connectors

Test Points

Test Point

Top

Bottom

Signal

Notes

TP1


x

CSO_B


TP2


x

CCLK


TP3


x

MOSI


TP4


x

MISO3


TP5


x

MISO2


TP6


x

MISO


TP7


x

24MHz_FPGA


TP8


x

24MHz_MCU


TP9


x

SYSCLK


TP10


x

PROG


TP11

x


SDA


TP12


x

SCL


TP13


x

Vusb


TP14


x

5Vb2b


TP15

x


5Vb2b


TP16


x

5V


TP17

x


5V


TP18


x

1.5V


TP19

x


1.5V


TP20


x

2.5V


TP21

x


2.5V


TP22


x

1.8V


TP23

x


1.8V


TP24


x

1.2V


TP25

x


1.2V


TP26


x

3.3V


TP27

x


3.3V


TP28


x

VREF1


TP29

x


VREF1


TP30


x

VCCCIO0


TP31

x


VCCCIO0


TP32


x

VCCINT


TP33

x


VCCINT


TP34


x

GND


TP35

x


GND


TP36


x

GND


TP37

x


GND


TP38


x

GND


TP39


x

GND


TP40


x

GND


TP41


x

GND


TP42


x

GND


TP43


x

GND


TP44


x

GND


TP45


x

S1


TP46


x

S2


TP47


x

SDA_F


TP48


x

SCL_F


TP49


x

SDA_SW


TP50


x

PS_EN


TP51


x

U10A.1 / S2B.2


TP52


x

AV0


TP53


x

AV1


TP54


x

AV2


TP55


x

AV3


TP56


x

PB


TP57


x

CFG_M2


TP58


x

DONE


TP59


x

INIT_B


Test points information

On-board Peripherals

Chip/Interface

Designator

Connected to

Notes

FPGA

U1

  • DDR3 SDRAM U2
  • QSPI flash, U3
  • Microcontroller with USB 2.0 PHY U9
  • Oscillator U5
  • Oscillator U6
  • Oscillator MEMS Y1
  • LEDs D1, D2, D3, D4
  • Button S1
  • 2x DIP switches - user definable , S2C, S2D
  • Processor supervisor U17
  • I2C
  • B2B J4, J5


DDR3 SDRAM

U2

  • FPGA U1


QSPI Flash

U3

  • FPGA U1
  • Microcontroller with USB 2.0 PHY U9


Microcontroller with USB 2.0 PHY

U9

  • FPGA U1
  • QSPI flash U3
  • Oscillator U5
  • EEPROM U8
  • DIP switches, S2A, S2B
  • Processor supervisor U17
  • I2C
  • Mini USB 2.0 connector

For further information see TE0763 USB Controller.

EEPROM

U8

  • Microcontroller with USB 2.0 PHY
  • DIP switch S2A
  • I2C


Processor supervisor

U17

  • Microcontroller with USB 2.0 PHY
  • FPGA via logical AND's D5, D6, D7
  • B2B J5


Oscillator

U5

  • FPGA U1
  • Microcontroller with USB 2.0 PHY U9

24 MHz

Oscillator

U6

  • FPGA U1

100 MHz

Oscillator MEMS

Y1

  • FPGA U1

200 MHz

On-board peripherals

Configuration and System Control Signals

Control signals represent hardware defined logic states, for final state consider the firmware and reference designs.

Control Signals and Buses

Signal Name

Connector.Pin

Direction 1)

Description

MR_N

J5.6

IN

Manual reset signal

RESET_N

J5.8

OUT

Inverted reset signal

RESET

J5.10

OUT

Reset signal

JTAG ( TDI / TDO / TCK / TMS )

J4.70 / J4.72 / J4.76 / J4.78

Signal dependent


1) Direction:

    • IN: Input from the point of view of this board.

    • OUT: Output from the point of view of this board.

    • INOUT: Bidirectional signal.
    • Signal dependent: A Signal can have different functions and directions as part of a Bus.
Control signals and buses

Button

Button

Signal

Voltage level

Function

Low

high

S1

PB

pressed

unpressed

User defined

Buttons

DIP switches

DIP switch group

DIP switch

Signal name

Connector.pin

Description

S1




S2A

SDA / SDA_SW

S2.1

Connect/Disconnect EEPROM U8 from I2C.

S2B

PS_EN / FX2_PS_EN

S2.2

Deactivate U15/FPGA power supply VCCINT and VCCBRAM.

S2C

S1

S2.3

User defined

S2D

S2

S2.4

User defined

DIP switches

Power and Power-On Sequence


Power Rails


Power Rail Name / Schematic Name

Connector.Pin

Direction 1)

Notes

5Vb2b

J5.1 / J5.2 / J5.3 / J5.4

IN

SoM supply

Vusb

J1.1

IN

SoM auxiliary supply

VCCIO0

J4.1 / J4.2 / J4.3 / J4.4

IN

IO bank 15 supply

3.3V

J5.35 / J5.36

OUT

External IO supply

2.5V

J5.53 / J5.54

OUT

External IO supply

1.2V

J5.73 / J5.74

OUT

External IO supply

3.3V

J4.33 / J4.34

OUT

External IO supply

2.5V

J4.53 / J4.54

OUT

External IO supply

1.2V

J4.73 / J4.74

OUT

External IO supply

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.
Power rails

Recommended Power up Sequencing


SequenceNet nameRecommended Voltage RangePull-up/downDescriptionNotes
0---Configuration signal setup.See Configuration and System Control Signals.
15Vb2b

5 V (± 5 %)

-

Power supply


Carrier power supply.

Vusb

5 V (± 5 %)

-

Auxiliary power supply
2VCCIO0

2.5 V to 3.3 V (±3 %)


Supply for IO bank 15


Power sequencing

Board to Board Connectors

Technical Specifications

Absolute Maximum Ratings *)

Power Rail Name/ Schematic Name

Description

Min

Max

Unit

5Vb2b

Main SoM supply

-0.3

6.0

V

Vusb

Auxiliary SoM supply

-0.3

6.0

V

VCCIO0

Bank 15 IO supply

–0.5

3.6

V

Absolute maximum ratings

*) Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Condition". Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

Recommended Operating Conditions

Temperature range

Trenz Electronic classifies modules into temperature range categories by subsumption of its component data (PCB, ICs, connectors, passive components). The temperature ranges are values for ambient air temperature and do not reflect the junction temperature of individual components.

The categories are:

  • Modules with commercial (C) temperature grade are equipped with components that cover at least the ambient temperature range of 0 °C to 70 °C.
  • Modules with extended (E) temperature grade are equipped with components that cover at least the ambient temperature range of 0 °C to 85 °C.
  • Modules with industrial (I) temperature grade are equipped with components that cover at least the ambient temperature range of -40 °C to 85 °C.

These categories do not take into account the entire custom system consisting of:

  • Customer FPGA design. The allowed main FPGA temperature range is specified from the vendor by junction temperature using corresponding classes (C, E, I). See vendor documentation.
  • Cooling solution, active and or passive cooling.
  • Climate or environmental conditions besides ambient temperature range.
  • Module orientation, neighbouring assemblies, neither other heat sources nor the FPGA as heat source to other components.

Classification of the module can be looked up here: AMD 7 Series Spartan, Artix and Kintex modules i.e.: TExxxx-xx-xx'I'xx, the 'I' indicates that all components are at least in Industrial temperature class.

The temperature of individual components should not exceed the specified range due to self-heating or heating by adjacent components. The actual operating temperature range will depend on the customer design, usage, environment and cooling solution. Consult Cooling Solutions for more information.

Voltage rails

The following table aims to be generic for all variants. The voltage ranges are consistent across assembly variants, but exceptions are possible (custom request).

Parameter

Min

Max

Units

Reference Document

5Vb2b

4.75

5.25

V

SoM Schematic

Vusb

4.75

5.25

V

SoM Schematic

VCCIO0

2.425

3.399

V

SoM schematic / AMD DS 181

Recommended operating conditions


Physical Dimensions

  • Module size: 40.5 mm x 47.5 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 8.0 mm.

  • PCB thickness: 1.523 mm.

Physical dimension

Currently Offered Variants 

Trenz shop TE0763 overview page*
English pageGerman page

*)  Module article name encoding table: AMD 7 Series Spartan, Artix and Kintex modules

Trenz Electronic shop overview

Revision History

Hardware Revision History

The hardware revision number can be found on the PCB board together with the module's model number, separated by a dash.

Board hardware revision number


Date

Revision

Changes

Documentation Link

2023-08

02

  1. Testpoint positions were corrected.
  2. Added S3 (JTAG only mode).
  3. CLK GEN DSC1123DL5-200.0000 (27130) replaced by SIT9121AI-2B1-XXE-200.00000
    (33457).
  4. Capacitor C47 330uF 1210 replaced by C47, C117, C118 100uF 0805.

REV02

2022-11

01

  • Initial release, changes to TE0630-02:
  1. Changed FPGA to Artix
  2. Changed PS DCDC to MPS parts


Hardware revision history


Document Change History

DateRevisionContributorDescription

  • Initial release

--

all

  • --
Document change history

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Product Disclaimer

Products (incl. Software and Firmware) are exclusively designed, manufactured, and distributed for industrial applications. They are not intended, authorized, or certified for use in critical safety applications, medical devices, aerospace, nuclear, life-support, traffic-control, military, or other environments where malfunction or failure could result in personal injury, death, or significant property or environmental damage.

Trenz Electronic GmbH (“Manufacturer”) excludes any liability for inappropriate use in such contexts. The Customer bears all responsibility for verifying suitability and compliance with applicable regulations when deploying in any critical-use scenario. The Customer also agrees to indemnify and hold harmless the Manufacturer from any third-party claims or liabilities arising from such use.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.



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