Skip to end of metadata
Go to start of metadata

Download PDF version of this document.

Table of Contents

Overview


The Trenz Electronic TEB0729 is a Carrier Board designed especially for the TE0729 Zynq-7000 SoM. The board exposes the module's B2B connector pins to accessible connectors and provides on-board peripheral components to test and evaluate TE Zynq-7000 SoMs and for developing purposes..

The Carrier Board provides soldering-pads for VG96 connectors as place-holders to get access to the PL-IO-banks and other functional units of the mounted SoM.

Key Features

  • Barrel jack for 5V power supply
  • 2x RJ45 10/100-BaseT Ethernet MagJack with 2 integrated LEDs
  • 1x RJ45 Gigabit Ethernet MagJack with 2 integrated LEDs.
  • 2x Configuration EEPROM's, connected to SoM's I²C interface
  • XMOD compatible header to connect the TE0790 USB2.0 adapter board
  • JTAG and UART interface over XMOD header
  • MicroSD Card socket, can be used to boot system
  • USB2.0 socket (Option: USB Type A or Micro USB2.0 B)
  • 4-bit DIP switch for SoM configuration (SoM's JTAG access and Bootmode)
  • VG96 connector soldering-pads J8 for access to SoM's PL-IO-bank-pins, usable as LVDS-pairs
  • VG96 connector soldering-pads J9 for access to further interfaces and IO's of the SoM
  • 1 x user LED (red) routed to SoM
  • 1 x user push-button routed to SoM (Reset function at standard configuration)
  • Pin headers to set PL-IO-bank's VCCIO with jumper

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

Figure 1: TEB0729-03 block diagram.

Main Components

 

Figure 2: TEB0729-03 main components (picture shows PCB REV02).

  1. 5V barrel jack, J12
  2. RJ-45 Gigabit Ethernet MegJack, J3
  3. RJ-45 10/100-BaseT Ethernet MegJack, J4
  4. RJ-45 10/100-BaseT Ethernet MegJack, J5
  5. VG96 connector placeholder, J9
  6. XMOD (TE0790) header, JB3
  7. 2-pin header for VBAT-IN supply-voltage, J2
  8. 2x6 pin header for setting VCCIO_33, J6
  9. 2x6 pin header for setting VCCIO_13, J7
  10. MicroSD Card socket, J1
  11. Red LED, D1
  12. Push Button, S1
  13. Micro USB2.0 B Receptacle (optional USB2.0 Type A socket)
  14. VG96 connector placeholder, J8
  15. B2B Connector, JB1
  16. B2B Connector, JB2
  17. 4-bit DIP-switch, S2

Initial Delivery State

Storage device name

Content

Notes

Configuration EEPROM, U1

Empty

Not programmed
Configuration EEPROM, U2EmptyNot programmed

Table 1: Initial delivery state of programmable devices on the module.

Signals, Interfaces and Pins

B2B Connector

The TEB0729 Carrier Board's Board-to-Board Connectors (B2B) have the same pin-assignment as the mounted Zynq SoM. By this connectors, the MIO- and PL-IO-bank's pins and further interfaces of the Zynq SoM can be accessed. A large quantity of these I/O's are also usable as LVDS-pairs. The connectors provide also VCCIO voltages to operate the I/O's properly.

Following table gives a summary of the available I/O's, interfaces and LVDS-pairs of the B2B connectors JB1 and JB2:

B2B ConnectorInterfacesCount of IO'sNotes
JB1User IO24 single ended-
48 single ended or 24 differential-
JB2

User IO

54 single ended-
10 single ended or 5 differential-
I²C2-
SD IO7-
UART2-
USB2.06-
2x 10/100-BaseT Ethernet12-
GbE MDI and SGMII14-
JTAG4-

Table 2: General overview of PL I/O signals and SoM's interfaces connected to the B2B connectors.

VG96 Connector

The TEB0729 Carrier Board has soldering pads provides as place-holders to mount VG96 connectors J8 and J9 to get access the PL-IO-bank's pins and further interfaces of the Zynq SoM. With mounted VG96 connectors, SoM's IO's are available to the user, a large quantity of these I/O's are also usable as  LVDS-pairs.

On the VG96 connector J9 are signals assigned to control the SoM and the interfaces of the SoM's Zynq device and of its on-module peripherals:

Following table gives a summary of the pin-assignment, available interfaces and functional IO's of the VG96 connectors J8 and J9:

VG96 ConnectorControl Signals and InterfacesCount of IO'sNotes
J8User IO24 single ended-
48 single ended or 24 differential-
J9

User IO

54 single ended-
10 single ended or 5 differential-
'NRST_IN' (pin J9-A29), 'RST_STATUS' (pin J9-B30)2

These pins are dedicated to the specific Reset-functionality of the TE0729 SoM.

'BOARD_STAT' (pin J9-B32)1-
'BOOT_MODE1' (pin J9-C31), 'BOOT_MODE2' (pin J9-C32)2Binary bootmode code of SoM, also connected to DIP S2
I²C2I²C1 interface of module
GbE SGMII4SGMII interface of on-module GbE PHY

Table 3: General overview of PL I/O signals, SoM's interfaces and control signals  connected to the VG96 connectors.

JTAG Interface

JTAG access to the mounted SoM is provided through B2B connector JB2 and is also routed to the XMOD header JB3. With the TE0790 XMOD USB2.0 to JTAG adapter, the Zynq device on the mounted SoM can be programed via USB2.0 interface.

JTAG Signal

B2B Connector Pin

XMOD Header JB3Note
TCKJB2-119JB3-4-
TDIJB2-115JB3-10-
TDOJB2-117JB3-8-
TMSJB2-113JB3-12-
JTAGSELJB2-111-Select SoM's JTAG programming mode on DIP-switch S2-1.

Table 4: JTAG interface signals.

UART Interface

UART interface is available on B2B connector JB2. With the TE0790 XMOD USB2.0 adapter, the UART signals can be converted to USB2.0 interface signals:

UART Signal Schematic NameB2BXMOD Header JB3Note
USART0_RXJB2-94JB3-7UART receive line
USART0_TXJB2-96JB3-3UART transmit line

Table 5: UART interface signals.

I²C Interface

Two I²C interfaces are provided on B2B connector JB2. I²C0 interface is connected to the Configuration EEPROMs U1 and U2 and is dedicated to these on-board peripherals. Interface I²C1 is routed to the VG96 connector J9 and is available to the user for general purposes:

I²C Signal Schematic NameB2BConnected toNote
I2C0_SDAJB2-90EEPROMs U1, U2I²C data line
I2C0_SCLJB2-92EEPROMs U1, U2I²C clock line
I2C1_SDAJB2-93J9-A30I²C data line
I2C1_SCLJB2-95J9-A31I²C clock line

Table 6: I²C interface signals.

SD IO Interface

The SD IO interface of the SoM's Zynq device (MIO-bank) is routed to the on-board MicroSD Card socket J1. By this interface, the Zynq device can be booted from an inserted MicroSD Card:

SD IO Signal Schematic NameB2BConnected toNote
ESD_DAT0JB2-108J1-7SD IO data
ESD_DAT1JB2-110J1-8SD IO data
ESD_DAT2JB2-100J1-1SD IO data
ESD_DAT3JB2-102J1-2SD IO data
ESD_CLKJB2-106J1-5SD IO clock
ESD_CMDJB2-104J1-3SD IO command
MIO0JB2-87J1-9Card Detect signal

Table 7: SD IO interface signals.

USB2.0 Interface

The TEB0729 Carrier Board is equipped with a Micro USB2.0 B (receptacle) socket J11 with board-revision TEB0729-03B, USB2.0 Type A socket is fitted on board-revision TEB0729-03A.

The differential data signals of the USB2.0 socket are routed to the B2B connector JB2, where they can be accessed by the USB2.0 transceiver of the mounted SoM. The USB2.0 connector can be used for Device mode, OTG Mode or Host Modes. For USB Host mode, the Carrier Board is additionally equipped with a power distribution switch U3 to provide the USB2.0 interface with the USB supply voltage USB-VBUS with nominal value of 5V. OTG mode is not available with USB2.0 Type A socket.

Following table gives an overview of the USB2.0 interface signals:

USB2.0 Signal Schematic NameB2BConnected toNote
OTG-D_N

JB2-103

J11-2, (J10-2)USB2.0 data
OTG-D_PJB2-101J11-3, (J10-3)USB2.0 data
OTG-IDJB2-109J11-4Ground this pin for A-Device (host),  left floating this pin for B-Device (peripheral).
VBUS_V_ENJB2-97U3, pin 4Enable USB-VBUS.
USB-VBUSJB2-107J11-1, (J10-1)USB supply voltage in Host mode.
USB_OCJB2-48, J9-B29U3, pin 5USB-VBUS over current signal: current-limit threshold exceeded by the connected USB device in USB Host mode.

Table 8: USB2.0 interface signals and connections.

Gigabit Ethernet Interface

The TEB0729 Carrier Board is fitted with one RJ-45 Gigabit Ethernet Magnetic jack J3. The MegJack has two integrated LEDs (both green), its signals are routed as MDI (Media Dependent Interface) to the B2B connector JB2, where they can be accessed by the GbE PHY transceiver of the mounted SoM:

GbE PHY Signal Schematic NameB2BConnected toNotes
PHY_MDI0_P

JB2-84

J3-2 -
PHY_MDI0_NJB2-82J3-3-
PHY_MDI1_PJB2-78J3-4-
PHY_MDI1_NJB2-76J3-5-
PHY_MDI2_PJB2-72J3-6-
PHY_MDI2_NJB2-70J3-7-
PHY_MDI3_PJB2-66J3-8-
PHY_MDI3_NJB2-64J3-9-
PHY_LED0JB2-59Green MegJack J3 LED-
PHY_LED1JB2-57Green MegJack J3 LED-

Table 9: GbE interface signals and connections.


For the same GbE transceiver PHY on the mounted SoM, on the Carrier Board is also SGMII (Serial Gigabit Media Independent Interface) available. The SGMII pins are available on VG96 connector J9:

GbE PHY Signal Schematic NameB2BConnected toNotes
SIN_P

JB2-52

J9-A16 -
SIN_NJB2-54J9-A17-
SOUT_PJB2-58J9-A19-
SOUT_NJB2-60J9-A20-

Table 10: GbE SGMII signals and connections.

10/100-BaseT Ethernet Interface

The TEB0729 Carrier Board is also fitted with two additional RJ-45 MegJacks providing 10/100-BaseT Ethernet interfaces. This interfaces are routed to the B2B connector JB2

10/100-BaseT PHY Signal Schematic NameB2BConnected toNotes
ETH1_RX_P

JB2-26

J4-3 -
ETH1_RX_NJB2-28J4-6-
ETH1_TX_PJB2-20J4-1-
ETH1_TX_NJB2-22J4-2-
ETH1_LED0JB2-34Yellow MegJack J4 LED-
ETH1_LED1JB2-32Green MegJack J4 LED-




ETH2_RX_PJB2-8J5-3-
ETH2_RX_NJB2-10J5-6-
ETH2_TX_PJB2-2J5-1-
ETH2_TX_NJB2-4J5-2-
ETH2_LED0JB2-16Yellow MegJack J5 LED-
ETH2_LED1JB2-14Green MegJack J5 LED-

Table 11: 10/100-BaseT Ethernet interfaces signals and connections.

XMOD FTDI JTAG-Adapter Header

The JTAG interface of the mounted SoM can be accessed via header JB3, which has a 'XMOD FTDI JTAG Adapter'-compatible pin-assignment. So in use with the XMOD-FT2232H adapter-board TE0790 the mounted SoM can be programmed via USB interface. The TE0790 board provides also an UART interface to the Zynq SoM which can be accessed by the USB2.0 interface of the adapter-board while the signals between these serial interfaces will be converted. The adapter-board offers also two GPIO's, one with an indication LED (pin JB3-9 (E)) and another one with a low-active push button (pin JB3-11 (G)).

Following table describes the signals and interfaces of the XMOD header JB3:

JB3 pinSignal Schematic Net NameB2BNote
C (pin 4)TCKJB2-119-
D (pin 8)TDOJB2-117-
F (pin 10)TDIJB2-115-
H (pin 12)TMSJB2-113-
A (pin 3)USART0_TXJB2-96-
B (pin 7)USART0_RXJB2-94-
E (pin 9)BOARD_STATJB2-112also connected to VG96 connector pin J9-B32
G (pin 11) 2)NRST_INJB2-89

also connected to VG96 connector pin J9-A29

Table 12: XMOD header signals and connections.  2) Pin connected to push button S1 on XMOD FTDI JTAG Adapter

When using XMOD FTDI JTAG Adapter TE0790, the adapter-board's VCC and VCCIO will be sourced by the Carrier Board. Set the DIP-switch with the setting:

XMOD DIP-switchesPosition
Switch 1ON
Switch 2OFF
Switch 3OFF
Switch 4ON

Table 13: XMOD adapter board DIP-switch positions for voltage configuration.

Use Xilinx compatible TE0790 adapter board (designation TE0790-xx with out 'L') to program the Zynq device.

The TE0790 adapter board's CPLD have to be configured with the Standard variant of the firmware. Refer to the TE0790 Resources Site for further information and firmware download.

On-board Peripherals

Configuration EEPROM

The TEB0729 Carrier Board is equipped with two Configuration EEPROMs U1 and U2 from Microchip.

  • U1: Microchip 24LC128: 128 KBit memory density (8 pages a 16 KBit), 400 KHz max. clock frequency
    • I²C-Address: 1010 101
  • U2: Microchip 24AA025E48T: 2 KBit memory density (2 block of 128 x 8-bit words), 400 KHz max. clock frequency
    • I²C-Address: 1010 011

The Configuration EEPROMs are connected to the I²C0 interface of the Zynq's MIO-bank via B2B connector JB2.

4-bit DIP-switch

Table below describes DIP-switch S2 settings for configuration of the mounted SoM:

DIP-switches S2Signal Schematic Net NameFunctionNote
S2-1JTAGSEL

Select Zynq device or SC CPLD programming of mounted SoM:

OFF:  Zynq device in JTAG chain
ON:    CPLD in JTAG chain

Refer also to the TE0729 SC CPLD documentation for detailed information about JTAG update
S2-2BOOT_MODE1Select first bit of boot mode codeRefer to TE0729 TRM and SC CPLD documentation for detailed information about boot modes
S2-3BOOT_MODE2Select second bit boot mode code
S2-4xxnot used

Table 14: DIP-Switch S2 SoM configuration settings


Boot ModeS2-2S2-3
JTAGONON
SDOFFOFF
QSPIONOFF

Table 15Boot Modes configuration via DIP-switch S2 with default TE0729 CPLD Firmware

VCCIO Selection Jumper

The Carrier Board VCCIO for the PL IO-banks of the mounted SoM are selectable by the jumpers J6 and J7.

Following table describes how to configure the VCCIO of the SoM's banks with jumpers:

VCCIO
vs. Voltage Levels
VCCIO_13VCCIO_33Note
1.8VJ7: pins 1-2J6: pins 1-2-
2.5VJ7: pins 3-4J6: pins 3-4-
3.3VJ7: pins 5-6J6: pins 5-6-

Table 16: VCCIO jumper settings.

RTC Buffer Voltage Supply Header

The buffer voltage of the SoM's RTC can be supplied through the header J2. Refer to the SoM's TRM for recommended voltage range and absolute maximum ratings.

Push Button

The Carrier Board's push button S1 is connected to the 'NRST_IN' signal, the function of the button is to trigger a reset of the mounted SoM by driving the reset-signal 'NRST_IN' to ground.

On-board LEDs

LED ColorConnected toDescription and Notes
D1Red'MIO9', pin JB2- 88user LED

Table 17: On-board LEDs.

Power and Power-On Sequence

Power Consumption

The maximum power consumption of the Carrier Board depends mainly on the mounted SoM's FPGA design running on the Zynq device.

Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

Power InputTypical Current
5VINTBD*

Table 18: Typical power consumption.

 * TBD - To Be Determined soon with reference design setup.

Power supply with minimum current capability of 3A for system startup is recommended.

To avoid any damage to the module, check for stabilized on-board voltages and VCCIO's before put voltages on PL I/O-banks and interfaces. All I/Os should be tri-stated during power-on sequence.

Power Distribution Dependencies

The Carrier Board needs one single power supply voltage with a nominal value of 5V. Following diagram shows the distribution of the input voltage '5VIN' to the on-board components on the mounted SoM:



Figure 3: Board power distribution diagram.

Power Rails

The voltage direction of the power rails is directed at on-board connectors' view:

Module Connector (B2B) DesignatorVCC / VCCIODirectionPinsNotes
JB1

VIN33

Out

1, 2, 3, 4, 5, 6

3.3V module supply voltage
VCCIO_13Out101, 102PL IO-bank VCCIO
VCCIO_33Out29, 30PL IO-bank VCCIO
3.3VIn65, 66voltage output from module
JB2

1.8V

In

49

voltage output from module
2.5VIn13voltage output from module
USB-VBUSOut107USB Host supply voltage
VBAT_INOut118RTC buffer voltage

Table 19: Power pin description of B2B Module Connector.


Jumper / Header DesignatorVCC / VCCIODirectionPinsNotes
J6VCCIO_33In2, 4, 6-
1.8VOut5-
2.5VOut3-
3.3VOut1-
J7

VCCIO_13

In2, 4, 6-
1.8VOut5-
2.5VOUt3-
3.3VOut1-

Table 20: Power Pin description of VCCIO selection jumper pin header.


Main Power Jack and Pins DesignatorVCC / VCCIODirectionPinsNotes
J125VINIn

1

-
J95VINIn / OutA1, A2also usable as '5VIN' power supply to the Carrier Board as alternative to J12
J2VBAT_INIn1Attention: Pin 2 connected to ground. VBAT_IN voltage on this pin cause short-circuit.

Table 21: Main Power jack and pins description.


Peripheral Socket DesignatorVCC / VCCIODirectionPinsNotes
J10 / J11USB-VBUSIn / Out1Direction depends on USB2.0 mode
J1VIN33Out4MikroSD Card socket VDD

Table 22: Power pin description of peripheral connector.


XMOD Header DesignatorVCC / VCCIODirectionPinsNotes
JB33.3V-5not connected
VIOOut6connected to VIN33

Table 23: Power pin description of XMOD/JTAG Connector.

Board to Board Connectors

The TE0729 module has two 120-pin double-row REF-189019-02 connectors on the bottom side which are compatible with Samtec BSE-060-01-L-D-A connectors. Mating connectors on the baseboard are REF-189019-01, which are compatible with Samtec BTE-060-01-L-D-A connectors.

Order
number

REF NumberSamtec NumberTypeMated HeightData sheetComment
-REF-189019-02BTE-060-01-L-D-A-K-TRModule connector5 mmhttp://suddendocs.samtec.com/catalog_english/bte.pdfStandard connector
used on module
26663REF-189019-01BSE-060-01-L-D-A-TRBaseboard connector5 mmhttp://suddendocs.samtec.com/catalog_english/bse.pdfStandard connector
used on board

Table 24: B2B Connectors.


Connector SpecificationsValue
Insulator materialLiquid crystal polymer
Stacking height5 mm
Contact materialPhosphor-bronze
PlatingAu or Sn over 50 μ" (1.27 μm) Ni
Current rating2 A per pin (1 pin powered per row)
Operating temperature range-55 °C to +125 °C
Voltage rating225 VAC with 5 mm stack height
Max cycles100
RoHS compliantYes

Table 25: B2B Connector specifications.

Variants Currently In Production

 Module Variant

Operating Temperature

USB SocketTemperature Range
TEB0729-03-A-40°C to +125°CUSB2.0 Type A socket fittedIndustrial
TEB0729-03-B-40°C to +125°CMicro USB2.0 B socket fittedIndustrial

Table 26: Board variants.

Technical Specifications

Absolute Maximum Ratings

Parameter

MinMax

Units

Reference Document

5VIN supply voltage

 -0.3 7

V

MP5010A, EN6347QI data sheet

Storage temperature

 -65

150

°C

-

Table 27: Module absolute maximum ratings.

Recommended Operating Conditions

ParameterMinMaxUnitsReference Document
5VIN supply voltage 4.755.25 VUSB2.0 specification concerning 'VBUS' voltage
Operating temperature -40125°C-

Table 28: Module recommended operating conditions.

Operating Temperature Ranges

Industrial grade: -40°C to +85°C.

The TEB0729 Carrier Board itself is capable to be operated at industrial grade temperature range.

Please check the operating temperature range of the mounted SoM, which determine the relevant operating temperature range of the overall system.

Physical Dimensions

  • Board size: 107.70 mm × 100 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 8 mm.

  • PCB thickness: ca. 1.65mm.

  • Highest part on the PCB is the Ethernet RJ-45 jack, which has an approximately 17 mm overall height. Please download the step model for exact numbers.

All dimensions are given in millimeters.


       

Figure 4: Board physical dimensions drawing.

Revision History

Hardware Revision History

DateRevision

Notes

PCNDocumentation Link
-

01

  • First Production Release
 -TEB0729-01
-02
  • Second Production Release
  • HW-Modification since 22.08.2017
  • Refer to Changes list in Schematic

    for further details in changes to REV01

-TEB0729-02
-03
  • Rework Reset-Signals by Pin-Swap
  • Refer to Changes list in Schematic for
    further details in changes to REV02
-TEB0729-03

Table 29: Module hardware revision history.


Hardware revision number can be found on the PCB board together with the module model number separated by the dash.


Figure 5: Module hardware revision number.

Document Change History

Date

Revision

Contributors

Description

Ali Naseri
  • update TRM to board revision 03

2017-10-27

v.14
Ali Naseri
  • initial document to board revision 02

Table 30: Document change history.

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.



  • No labels