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Overview

The Trenz Electronic TEI0006 is an industrial grade module based on Intel® Cyclone 10 GX. Intel® Cyclone 10 GX device family delivers higher core, transceiver, and I/O performance than the previous generation of low cost FPGAs.

Refer to http://trenz.org/tei0006-info for the current online version of this manual and other available documentation.

Key Features

  • Intel® Cyclone 10 GX Industrial [10CX220YF780I5G]
    • Package: FBGA-780
    • Speed Grade: 5 (Fastest)
    • Temperature: -40°C to 100°C
    • Package compatible device 10CX150 and 10CX105 as assembly variant on request possible
  • 2x SDRAM DDR3L Memory IC 8 Gbit (1 GByte), Half rate: 533 MHz; Quarter rate: max. 800 MHz
  • 2x SPI Flash, 1 Gbit (128 MByte)
  • 1x Gigabit Ethernet
  • Programmable Oscillator
  • Intel® MAX 10 as System Controller (CPLD)
  • 2 Kbit EEPROM Memory
  • 4x User LED 

  • I/O interfaces: 226/94/46 (IOs/DIFF. Pairs/LVDS Pairs)
  • Board to Board (B2B) Connection: Plug-on module with 3 x 160-pin Samtec Razor Beam (ST5) connectors

  • 5 V Power Supply

  • Dimension: 80m x 60m

Block Diagram


TEI0006 block diagram

Main Components

TEI0006 main components
  1. Intel® MAX 10, U18
  2. DC/DC convertor, U4...11
  3. SDRAM DDR3 Memory, U12 - U13
  4. User LEDs, D1...4
  5. Ethernet Transceiver, U2
  6. SPI Flash Memory, U1 - U3
  7. Intel® Cyclone 10 GX, U23
  8. EEPROM, U64
  9. Buffer, U16
  10. Clock, U14

Initial Delivery State

Storage device name

Content

Notes

Quad SPI Flash

Not Programmed


EEPROMProgrammed

Ethernet MAC

DDR3 SDRAMNot Programmed


Initial delivery state of programmable devices on the module

Configuration Signals

The TEI0006 module can be configured using different modes. Mode selection can be done using MSEL[2:0]. MSEL2 is connected to GND so mode selection can be done using MSEL[1:0] which are connected to Bank 3 of Intel Max 10.

MODE Signal State

MSEL2MSEL1MSEL0Boot Mode

MSEL[2:0]

010

AS / Fast

011

AS / Standard

000PS and FPP / Fast
001PS and FPP / Standard
Boot process.

By tying the CONF_DONE, NSTATUS, and NCONFIG pins together, the devices initialize and enter user mode at the same time. If any device in the chain detects an error, configuration stops for the entire chain and you must reconfigure all the devices. For example, if the first device in the chain flags an error on the NSTATUS pin, it resets the chain by pulling its NSTATUS pin low.

SignalsConnected toDescriptionNote
NCONFIG1.8VConfiguration triggerFrom U18 (Intel MAX 10) - Bank 3
CONF_DONE1.8VConfiguration done To U18 (Intel MAX 10) - Bank 3
NSTATUS1.8VConfiguration status To U18 (Intel MAX 10) - Bank 3
DCLKU1Configuration clock 

To U1 (Flash Memory)

From U18 (Intel MAX 10) - Bank 3

AS_DATA0...3U1Configuration dataFrom U1 (Flash Memory)
Configuration signals.

Signal

B2BConnected toNote

PERST

J2-99Bank A2
Reset process.

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

FPGAFPGA BankB2B ConnectorI/O Signal CountVoltage LevelNotes

Intel Cyclone 10 GX

Bank 1C

J3

24 Single ended (12 Diff pair)

0.95V

GXBL1C_RX0...5 N/P, GXBL1C_TX0...5 N/P

Bank 1D

J3

24 Single ended (12 Diff pair)

0.95V

GXBL1D_RX0...5 N/P, GXBL1D_TX0...5 N/P

Bank 2A

J2

2 Single ended

1.8V

PERST, CLKUSR

Bank 2J

J2

46 Single ended (23 Diff pair)

VCCIO2J


Bank 2K

J1

46 Single ended (23 Diff pair)

VCCIO2K


Bank 2L

J1

48 Single ended (24 Diff pair)

VADJ up to 3 V


Bank 3A

-

-

1.35V

VDD_DDR

Bank 3B

-

-

1.35V

VDD_DDR

Intel Max 10

Bank 1A

J2

8 Single ended

3.3V


Bank 1B

J2

5 Single ended

3.3V


Bank 2

J3

2 Single ended

1.8VIO


Bank 3

-

-

1.8VIO


Bank 5

J2

4 Single ended

3.3V


Bank 6

J2

2 Single ended

3.3V


Bank 8

J2

24 Single ended

3.3V


General PL I/O to B2B connectors information


JTAG Interface

JTAG access to the TEI0006 SoM through B2B connector J2. JTAGEN is pulled up to 3.3V and after power on, JTAG will be enabled.

JTAG Signal

B2B Connector

Note
TMSJ2-160
TDIJ2-159
TDOJ2-158
TCK

J2-157


JTAGENJ2-105Pulled up to 3.3V.
JTAG pins connection

MIO Pins


MIO PinConnected toB2BNotes
MAX_IO1...20, 22U18 (Intel MAX 10) - Bank 8J2
MAX_IO23...26U18 (Intel MAX 10) - Bank 5
J2
MIOs pins


On-board Peripherals

Chip/InterfaceDesignatorNotes

QSPI Flash Memory

U1 - U3U1- AS configuration
EEPROMU64
DDR3 SDRAM MemoryU12 - U13
Ethernet PHYU2

Intel Max 10U18System controller

User LEDs

D1...4D1 (Red), D2...4 (Green)
OscillatorsU14, U15, U17, U21
On board peripherals

QSPI Flash Memory

The TEI0006 is equipped with two Micron SPI flash memory. On-board SPI flash memory is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency.

DesignatorSchematicConnected toNotes
U1



NCSOCSS Bank (Configuration Bank)Used when you are not configuring using AS
DCKDCLKAS Configuration Clock
AS_DATA0CSS Bank (Configuration Bank)
AS_DATA1CSS Bank (Configuration Bank)
AS_DATA2CSS Bank (Configuration Bank)
AS_DATA3CSS Bank (Configuration Bank)
U3QSPI_CSBank 2A
QSPI_CKBank 2A
QSPI_DATA0Bank 2A
QSPI_DATA1Bank 2A
QSPI_DATA2Bank 2A
QSPI_DATA3Bank 2A
Quad SPI interface MIOs and pins

EEPROM

Schematic

U64 EEPROM Pin

B2B

U18 Intel Max 10 Pin

Notes
I2C_SCLSCLJ3-135Bank 2 - K2
I2C_SDASDAJ3-137Bank 2 - L2
I2C EEPROM interface MIOs and pins

PinsI2C AddressDesignatorNotes
I2C_SCL, I2C_SDA0x53U64
I2C address for EEPROM

DDR3 SDRAM

The TEI0006 SoM has two 1 GByte volatile DDR3 SDRAM IC provided by Integrated Silicon Solution Inc for storing user application code and data.

  • Part number: IS43TR16512BL
  • Supply voltage: 1.35 V
  • Speed: Half rate: 533 MHz; Quarter rate: max. 800 MHz
  • Temperature: -40 °C to 95 °C

Ethernet PHY

Signal NameConnected toB2BSignal Description

PHY1_MDI0_P

PHY1_MDI0_N

-

-

J2-93

J2-91


PHY1_MDI1_P

PHY1_MDI1_N

-

-

J2-87

J2-85


PHY1_MDI2_P

PHY1_MDI2_N

-

-

J2-81

J2-79


PHY1_MDI3_P

PHY1_MDI3_N

-

-

J2-75

J2-73


ETH1_RSTU23, Bank 2A-Pulled-up to DVDDH Voltage.
ETH1_MDCU23, Bank 2A-Pulled-up to DVDDH Voltage.
ETH1_MDIOU23, Bank 2A-Pulled-up to DVDDH Voltage.
ETH1_TXD0...7U23, Bank 2A-8 bit Transfer
ETH1_RXD0...7U23, Bank 2A-8 bit Receive
ETH1_GTXCKU23, Bank 2A-
ETH1_TXCLKU23, Bank 2A-
ETH1_TXENU23, Bank 2A-
ETH1_TXERU23, Bank 2A-
ETH1_RXCKU23, Bank 2A-Pulled-down to GND.
ETH1_RXDVU23, Bank 2A-Pulled-down to GND.
PHY1_INT--Pulled-up to DVDDH Voltage.
PHY1_LED1U18, Bank 2

-

Pulled-up to DVDDH Voltage.
PHY1_LED2U18, Bank 2-Pulled-down to GND.
ETH1_CRSU23, Bank 2A-
ETH1_XTAL_INETH_CLKIN-From U21 (25 MHz Oscillator)
Ethernet PHY to Intel Cyclone 10 GX SoC connections

Intel MAX 10

The TEI0006 is equipped with an Intel MAX 10 device which is a single-chip, non-volatile low-cost programmable logic device (PLD) to integrate the optimal set of system components. Intel MAX 10 (U18) is power and configuration controller on TEI0006 SoM. 

Intel Max 10 BankSignalsConnected to DescriptionNotes
Bank 1AAIN0...7B2B- J2

Bank 1BTCK, TDO, TMS, TDI, JTAGENB2B- J2

Bank 2

PHY1_LED1

PHY1_LED2

Ethernet PHY, U2

Ethernet PHY, U2

Ethernet LED

Ethernet LED

Pulled-up to DVDDH.

Pulled-down to GND.

F_TCK, F_TDO, F_TDI, F_TMSIntel Cyclone 10 GX (U23) - Bank CSSIntel Cyclone 10 JTAG signals
I2C_SDA, I2C_SCL

EEPROM, U64

B2B, J3 

Programmable Oscillator, U14

I2C EEPROM signals
PLL_RST

Programmable Oscillator, U14

Oscillator reset signal
Bank 3NSTATUS, NCONFIG, CONF_DONEIntel Cyclone 10 GX (U23) - Bank CSSIntel Cyclone 10 Configuration signals
DCLK

Intel Cyclone 10 GX (U23) - Bank CSS

SPI Flash, U1

Intel Cyclone 10

Configuration clock from Flash memory


MSEL0...1Intel Cyclone 10 GX (U23) - Bank CSS

Intel Cyclone 10

Configuration mode signals


DEV_CLRN, INIT_DONEIntel Cyclone 10 GX (U23) - Bank 2A

M10_IO0...4Intel Cyclone 10 GX (U23) - Bank 2A

Bank 5

DIS_GROUP1...4N-Channel MOSFET, T1...4Fast Discharching
MAX_IO23...26B2B, J2Intel MAX 10 GPIO

PG_0.95V, EN_0.95V

PG_1.8VIO, EN_1.8VIO

Voltage Regulator, U7

Voltage Regulator, U6

Power control signals
Bank 6




M10_CLK25 MHz Oscillator, U21Intel MAX 10 Clock

VADJ_VS0...2, VADJ_EN

PG_1.35V, EN_1.35V

PG_1.8V, EN_1.8V

PG_VTT, EN_VTT

PG_0V9, EN_0V9

Voltage Regulator, U11

Voltage Regulator, U8

Voltage Regulator, U5

Voltage Regulator, U9

Voltage Regulator, U4

Power control signals
PHY1_33LED1...2

B2B, J2

Ethernet LED

LED_FP_1

LED_FP_2...4

D1

D2...4

User LEDs

Red LED

Green LED

Bank 8

M10_nSTATUS, M10_nCONFIG

B2B, J2Intel MAX 10 configuration signals
MAX_IO1...20, 22B2B, J2Intel MAX 10 GPIO
Intel MAX 10 banks information

LEDs

DesignatorColorConnected toActive LevelNote
D1RedLED_FP_1Active high
D2GreenLED_FP_2Active high
D3GreenLED_FP_3Active high
D4GreenLED_FP_4Active high
On-board LEDs

Clock Sources

The TEI0006 has three crystal oscillator and a programmable clock generator. 

DesignatorDescriptionFrequencyNote
U21Crystal Oscillator25MHz
U15Crystal Oscillator25MHz
U17Crystal Oscillator48MHz
U14Programmable OscillatorVariable
Osillators


SignalsClock TypeIn/ OutConnected toFrequencyNote

IN0_P

IN0_N

Differential

In

In

Oscillator, U15

GND

25 MHz
IN1..3 DifferentialInB2B, J3Variable

XA

XB

Differential

Oscillator, U17

GND

48 MHz

CLK0

DifferentialOutIntel Cyclon 10 GX (U23)- Bank 2AUserDefault off

CLK1...4

DifferentialOutB2B, J3UserDefault off
REFCLK_EMIFPDifferentialOutIntel Cyclon 10 GX (U23)- Bank 3BUserDefault off
CLK6...7DifferentialOutIntel Cyclon 10 GX (U23)- Bank 1DUserDefault off
CLK8...9DifferentialOutIntel Cyclon 10 GX (U23)- Bank 1CUserDefault off
Programmable Oscillator connections

Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of 1 A for system startup is recommended.

Power Consumption

FPGATypical Current
Intel Cyclone 10 GXTBD*
Intel MAX 10TBD*
Power Consumption

* TBD - To Be Determined

Power Distribution Dependencies

Power Distribution

Power-On Sequence

Voltage regulators can be enabled through U18 (Intel MAX 10) - Bank 5 and 6.

Power Sequence

Power Rails

Power Rail Name

B2B Connector

J1 Pin

B2B Connector

J2 Pin

B2B Connector

J3 Pin

Voltage LevelDirectionNotes
VIN145, 147,149, 151, 153, 155, 157, 159--5 VInput
VCCIO2K53, 54--1.2 V, 1.25 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V or 3.0 VInput
VADJ140,142--adjustable between 1.8 V - 3.0 VOutputVoltages according to EP53A8HQI datasheet but restricted to allowed bank voltage
VCCIO2J-29,30-1.2 V, 1.25 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V or 3.0 VInput

3.3V

-149,150-3.3 VOutput
1.8_VIO--1391.8 VOutput
Module power rails.

Bank Voltages

FPGAFPGA BankVoltage LevelNotes
Intel Cyclone 10 GXBank 1C0.95 V

Bank 1D

0.95 V
Bank 2A1.8 V1.8VIO
Bank 2J1.2 V, 1.25 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V or 3.0 VVCCIO2J
Bank 2K1.2 V, 1.25 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V or 3.0 VVCCIO2K
Bank 2Ladjustable between 1.8 V - 3.0 VVoltages according to EP53A8HQI datasheet
Bank 3A1.35 VVDD_DDR
Bank 3B1.35 VVDD_DDR
Intel Max 10Bank 1A3.3 V
Bank 1B3.3 V
Bank 21.8 V1.8VIO
Bank 31.8 V1.8VIO
Bank 53.3V
Bank 63.3V
Bank 83.3V
SoC bank voltages.


Board to Board Connectors

The module has three 160-pin double-row REF-192552-02 connector on the bottom side. The counterpart REF-192552-01 is placed on the base board.

Order
number

REF NumberSamtec NumberTypeMated HeightData sheetComment
27220REF-192552-02ST5-80-1.50-L-D-P-TRModule connector5 mmhttp://suddendocs.samtec.com/catalog_english/st5.pdfStandard connector
used on module
27219REF-192552-01SS5-80-3.50-L-D-K-TRBaseboard connector5 mmhttp://suddendocs.samtec.com/catalog_english/ss5.pdfStandard connector
used on board
Connectors.

 With different connectors from the used series other mating heights are possible (according to the Datasheet). The module and base board can be manufactured using other connectors upon request.

Connector SpecificationsValue
Insulator materialLiquid crystal polymer
Stacking height5 mm
Contact materialPhosphor-bronze
PlatingAu or Sn over 50 μ" (1.27 μm) Ni
Current rating1.6 A per pin (2 pins powered)
Operating temperature range-55 °C to +125 °C
RoHS compliantYes
Connector specifications.
Connector Speed Ratings

The LSHM connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
5 mm, Single-Ended 13.5GHz /  27Gbps
5 mm, Differential 20GHz / 40Gbps
4 mm, Single-Ended 13GHz /  26Gbps
4 mm, Differential 13.5GHz / 27Gbps
Speed rating.
Current Rating

Current rating of  Samtec Razor Beam™ SS5/ST5 B2B connectors is 1.6A per pin (2 pins powered).

Connector Mechanical Ratings
  • Shock: 100G, 6 ms sawtooth wave
  • Vibration: 7.56G 'RMS', 2 hours per axis, 3 axes total
Manufacturer Documentation

  File Modified
PDF File hsc-report-sma_st5-ss5-04mm_web.pdf 07 06, 2019 by John Hartfiel
PDF File hsc-report-sma_st5-ss5-05mm_web.pdf 07 06, 2019 by John Hartfiel
PDF File ss5_catalog.pdf 07 06, 2019 by John Hartfiel
PDF File ss5-st5_specs.pdf 07 06, 2019 by John Hartfiel



Technical Specifications

Absolute Maximum Ratings

SymbolsDescriptionMinMaxUnitNote
VINPower supply-0.36.0VDetemined by U10.
VCCIO - 3 V I/OI/O buffers power supply-0.54.10V

Intel Cyclone 10 GX

VCCIO - LVDS I/OI/O buffers power supply-0.52.46V

Intel Cyclone 10 GX

VADJAdjustable voltage-0.54.10V

Intel Cyclone 10 GX

T_STGStorage temperature-4085°C
Absolute maximum ratings

Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

ParameterMinMaxUnitReference Document
VIN5.05.0V
VCCIO2.853.15VSee Intel Cyclone 10 GX datasheet.
VADJ2.853.15VVCCIO
Recommended operating conditions.

Physical Dimensions

  • Module size: 60 mm × 80 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 5 mm.

  • PCB thickness: 1.7 mm

Physical Dimension

Currently Offered Variants 

Trenz shop TEI0006 overview page
English pageGerman page
Trenz Electronic Shop Overview

Revision History

Hardware Revision History

DateRevisionChangesDocumentation Link
2018-08-1001-REV01
Hardware Revision History

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Board hardware revision number.

Document Change History

DateRevisionContributorDescription

Pedram Babakhani

  • Figures updated

  • Technical specifications updated

2019-05-29

v.69Pedram Babakhani
  • initial release

--

all

Pedram Babakhani , ED , John Hartfiel

  • --
Document change history.

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.





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