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  • 3 x Samtec LSHM Series Board to Board Connectors
  • VG96 connector (mounting holes and solder pads, J6 1)) and 50-pin IDC male connector socket (J5) for access to PL I/O-bank pins
  • USB2.0 type A connector, or optionally Micro USB 2.0 connector
  • 1 x RJ45 GbE MagJack (J3), connected via MDI to B2B connector JB1
  • 1 x Marvell Alaska 88E1512 GbE PHY, providing Ethernet interface in conjunction with RJ45 GbE MagJack (J2)
  • 4 A High-Efficiency Power SoC DC-DC Step-Down Converter (Enpirion EN6347) for 3.3V power supply
  • XMOD JTAG- / UART-header JX1
  • Micro SD card socket
  • SDIO port expander with voltage-level translation and jumper (J13) for selection of SDIO voltage on SoM side
  • DIP-switches S1 to set SoM's control signals
  • 1 x user-push button (S2), by default configured as system reset button
  • 3 x VCCIO selection jumper J10, J11 and J12 to set SoM's PL I/O-bank voltages
  • 5V power supply barrel jack

Additional assembly options are available for cost or performance optimization upon request.

1) No longer delivered within board. Needs to be ordered seperately. Refer to PCN-20231106 TE0706-03 BOM Change for more information.

Block Diagram

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add drawIO object here.

Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


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Date

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  • Updated to PCN-20231106 more clearly.

2023-11-07

v.77

ED

  • Changed Xilinx to AMD.
  • Updated to PCN-20231106.

2021-02-19

v.76

John Hartfiel

  • Note to PHY connection
2010-07-16v.74John Hartfiel
  • update Physical Dimensions
2019-05-27v.73Martin Rohrmüller
  • Updated to REV03
  • Updated to TRM v28
2018-06-03v.66John Hartfiel
  • Add note to DIP settings
2017-11-10

v.64

John Hartfiel
  • Replace B2B connector section
2017-11-09v.60Ali Naseri
  • TRM revision to new common style

2017-07-06

v.52
Ali Naseri, Jan Kumann
  • Hardware revision 02 specific changes.
2017-01-06v.1Ali Naseri
  • initial document to board revision 02
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