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The Trenz Electronic TE0706 Carrier Board provides functionalities for testing, evaluation and development purposes of company's 4 x 5 cm SoMs. The Carrier Board is equipped with various components and connectors for different configuration setups and needs. The interfaces of the SoM's functional units and PL I/O-banks are connected via board-to-board connectors to the Carrier Board's components and connectors for easy user access.

See "4 x 5 SoM Carriers" page for more information about supported 4 x 5 cm SoMs.

Refer to for the current online version of this manual and other available documentation.

Key Features

  • 3 x Samtec LSHM Series Board to Board Connectors
  • VG96 connector (mounting holes and solder pads, J6) and 50-pin IDC male connector socket (J5) for access to PL I/O-bank pins
  • USB2.0 type A connector, or optionally Micro USB 2.0 connector
  • 1 x RJ45 GbE MagJack (J3), connected via MDI to B2B connector JB1
  • 1 x Marvell Alaska 88E1512 GbE PHY, providing Ethernet interface in conjunction with RJ45 GbE MagJack (J2)
  • 4 A High-Efficiency Power SoC DC-DC Step-Down Converter (Enpirion EN6347) for 3.3V power supply
  • XMOD JTAG- / UART-header JX1
  • Micro SD card socket
  • SDIO port expander with voltage-level translation and jumper (J13) for selection of SDIO voltage on SoM side
  • DIP-switches S1 to set SoM's control signals
  • 1 x user-push button (S2), by default configured as system reset button
  • 3 x VCCIO selection jumper J10, J11 and J12 to set SoM's PL I/O-bank voltages
  • 5V power supply barrel jack

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

TE0706 block diagram

Main Components

TE0706 main components
  1. 5V power connector jack, J1
  2. Reset switch, S2
  3. USB2.0 type A receptacle, J7
  4. Micro SD card socket with Card Detect, J4
  5. 50 pin IDC male connector, J5
  6. 1000Base-T Gigabit RJ45 Ethernet MagJack, J3
  7. 1000Base-T Gigabit RJ45 Ethernet MagJack, J2
  8. XMOD JTAG- / UART-header, JX1
  9. User DIP-switch, S1
  10. VCCIO selection jumper block, J10 - J12
  11. External connector (VG96) placeholder, J6
  12. Samtec Razor Beam™ LSHM-150 B2B connector, JB1
  13. Samtec Razor Beam™ LSHM-150 B2B connector, JB2
  14. Samtec Razor Beam™ LSHM-130 B2B connector, JB3
  15. SoM SDIO voltage selection jumper, J13

Initial Delivery State

There is no hardware component to be programmed on the carrier.

Storage device name



Initial delivery state of programmable devices on the module

Board is shipped in following configuration:

  • VCCIO voltage selection jumpers are all set to 1.8 V.
  • S2 switch configured as reset button.
  • One VG96 connector (not soldered to the board, but included in the package as separate component)

Different delivery configurations are available upon request.

Configuration Signals




S1-3JB1-31ONDrive SoM SC CPLD pin 'MODE' low.Usually SD-Boot
OFFLeave SoM SC CPLD pin 'MODE' open.Usually  QSPI-Boot
EN1S1-4JB1-27ONDrive SoM SC CPLD pin 'EN1' low.

Usually used to enable/disable FPGA core-voltage supply. (Depends also on SoM's SC CPLD firmware).

Note: Power-on sequence will be intermitted if S1-4 is set to OFF and if functionality is supported by SoM.

OFFDrive SoM SC CPLD pin 'EN1' high.
Boot process.

There is a user push button which is used for RESET signal.




S2JB2-17Aktive Low
Reset process.

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

With the TE0706 Carrier Board's Board-to-Board Connectors (B2B) the MIO- and PL I/O-bank's pins and further interfaces of the mounted SoM can be accessed. A large quantity of these I/Os are also usable as LVDS-pairs. The connectors provide also VCCIO voltages to operate the I/Os properly.

Following table gives a summary of the available I/Os, interfaces and LVDS-pairs of the B2B connectors JB1, JB2 and JB3:

B2B ConnectorInterfaces

Count of I/Os

JB1User I/O48 single ended or 24 differential-
8 single endedMIO with Zynq Modules
GbE MagJack J3 MDI8-
SoM control signals5EN1, PGOOD, MODE, NOSEQ, PRPGMODE
USB2.0 (OTG, device and host mode)5-
JB2User I/O18 single ended-
48 single ended or 24 differential-
SoM control signals1RESIN
GbE MagJack J3 LEDs2-
Board to Board signals

On-board Connector

The TE0706 Carrier Board has a 50-pin IDC male connector J5 and soldering pads as place-holder to mount a VG96 connectors J6 to get access the PL I/O-bank's pins and further interfaces of the mounted SoM. With these connectors, SoM's PL-I/Os are available to the user, a large quantity of these I/Os are also usable as  differential pairs.

Following table gives a summary of the pin-assignment, available interfaces and functional I/Os of the connectors J5 and J6:

On-board ConnectorControl Signals and InterfacesCount of I/OsNotes
J5User I/O18 single ended-
14 single ended or 7 differential-
GbE MagJack J2 LEDs2-

User I/O

82 single ended or 41 differential-
SoM control signals2'PGOOD', 'NOSEQ'
Overview of PL IO signals, SoMs interfaces and control signals connected to the on-board connectors.

JTAG/UART Interface Base

JTAG/UART access to the TE0706 carrier is available through XMOD header JX1, which has a 'XMOD FTDI JTAG Adapter'-compatible pin-assignment. This header provides also a UART interface, usually established by MIO-pins of the PS-bank of the mounted SoM's Zynq device. XMOD USB2.0 to JTAG/UART adapter TE0790 is provided by Trenz Electronic. More information is available here. Devices of the mounted SoM can be programed via USB2.0 interface.

XMOD DesignatorDesignatorB2B PinXMOD Header JX1Note
AMIO15JB1-86JX1-3UART Txd - (transmit line)
BMIO14JB1-91JX1-7UART Rxd - (receive line)


VIOVCCJTAGJB2-92JX1-6VIO is connected to 3.3V which is supplied by carrier
JTAG interface Base

When using XMOD FTDI JTAG Adapter TE0790, the adapter-board's VIO will be sourced by the mounted SoM's 'VCCJTAG' (pin JB2-92). Set the DIP-switch with the setting:

XMOD DIP-switchesPosition
Switch 1ON
Switch 2OFF
Switch 3OFF
Switch 4ON
XMOD adapter board DIP-switch positions for voltage configuration

Use Xilinx compatible TE0790 adapter board (designation TE-0790-xx with out 'L') to program the Xilinx Zynq devices.

The TE0790 adapter board's CPLD have to be configured with the Standard variant of the firmware. Refer to the TE0790 Resources Site for further information and firmware download.

SD Card Socket

The SD Socket is routed to the on-board Texas Instruments TXS02612 SDIO port expander U4. This IC provides a necessary VDD/VCCIO translation between the MicroSD Card socket J4 (3.3V) and the SoM's Zynq device MIO-bank (1.8V/3.3V depending on Module, compare jumper J13 ):

SD IO Signal Schematic NameConnected toNote
eSD_DAT0U4-18SD IO data
eSD_DAT1U4-16SD IO data
eSD_DAT2U4-23SD IO data
eSD_DAT3U4-22SD IO data
eSD_CLKU4-19SD IO clock
eSD_CMDU4-20SD IO command
MIO0J5-29Card Detect signal
SD IO interface signals

USB2.0 connector

TE0706-03 board has one physical USB2.0 type A socket J7, the differential data signals of the USB2.0 socket are routed to the B2B connector JB3, where they can be accessed by the corresponding USB2.0 PHY transceiver of the mounted SoM.

There is also the option to equip the board with a Micro USB 2.0 type B (receptacle) socket (J8) to the board as alternative fitting option. With this fitting option (Micro USB2.0 type B), the USB2.0 interface can also be used for Device mode, OTG and Host Modes.

For USB2.0 Host mode, the Carrier Board is additionally equipped with a power distribution switch U5 to provide the USB2.0 interface with the USB supply voltage USB-VBUS with nominal value of 5V. OTG mode is not available with USB2.0 Type A socket.

Following table gives an overview of the USB2.0 connector signals:

USB2.0 Signal Schematic NameB2BConnected to (type A) Connected to (optional replacement for type A J7)Note


J7-2J8-2USB2.0 data
OTG-D_PJB2-50J7-3J8-3USB2.0 data
OTG-IDJB2-52NCJ8-4Ground this pin for A-Device (host),  left floating this pin for B-Device (peripheral).
VBUS_V_ENJB2-54U5-4U5-4Enable USB-VBUS.
USB-VBUSJB2-56J7-1J8-1USB supply voltage in Host mode.
USB2.0 interface signals and connections

RJ45 Gigabit Ethernet Connectors

The TE0706 Carrier Board is equipped with two Gigabit Ethernet ports. One of them (J2) is routed to Marvell Alaska 88E1512 Gigabit Ethernet PHY (U6). The GbE MegJack J2 has two integrated LEDs (both green), its signals are routed as MDI (Media Dependent Interface) to the GbE PHY. The MegJack J3 is connected via MDI directly to the B2B connector JB1. There is usually a corresponding Gigabit Ethernet PHY on 4 x 5 SoMs (e.g. TE0715 or TE0720), which can be used in conjunction with the baseboard MagJack J3.

MegJack J2SignalConnected to
J2 Green MegJack LEDPHY_LED0U6-14
J2 Green MegJack LEDPHY_LED1U6-13
RJ45 connectors J2

MegJack J3SignalB2B


J3 Green MegJack LEDETH_LED1


J3 Yellow MegJack LEDETH_LED2JB2-99
RJ45 connectors J3

MIO Pins

Signal (MIO Pin)Connected toB2BNotes

micro SD-Card, J5-29

JB1-88Card detect
MIO10J5-28JB1-96I²C clock line
MIO11J5-27JB1-94I²C data line
MIO15XMOD, J5-31JB1-86
6 x MIOSD-CardJB1B2B positions see SDIO Port Expander. MIO positions depend on attached SoM.
MIOs pins

On-board Peripherals


4-bit DIP-switch

S1Bit 1 not connected

VCC Selection Jumper


RTC Buffer Voltage Supply Header


Push Button


Gigabit Ethernet PHY


SDIO Port Expander

On board peripherals

4-bit DIP-switch

Table below describes DIP-switch S1 settings for configuration of the mounted SoM:

SwitchSignal NameONOFFNotes
S1-1---Not connected.
S1-2PROGMODEJTAG enabled for programing mounted SoM's Zynq-SoC.JTAG enabled for programing mounted SoM's SC-CPLD.-
S1-3MODEDrive SoM SC CPLD pin 'MODE' low. (SD-Boot)Leave SoM SC CPLD pin 'MODE' open. (QSPI-Boot)

Boot mode configuration, if supported by SoM. (Depends also on SoM's SC-CPLD firmware).

S1-4EN1Drive SoM SC CPLD pin 'EN1' low.Drive SoM SC CPLD pin 'EN1' high.

Usually used to enable/disable FPGA core-voltage supply. (Depends also on SoM's SC CPLD firmware).

Note: Power-on sequence will be intermitted if S1-4 is set to OFF and if functionality is supported by SoM.

DIP-switch SoM configuration settings

Note: Compared to the former revision 02 of this board, the DIP-switch is rotated by 180° due to routing issues.

User DIP-switch S1

VCC Selection Jumpers

Note: The corresponding PL I/O-bank supply-voltages of the 4 x 5 SoM to the selectable base-board voltages VCCIOA, VCCIOB and VCCIOC are depending on the mounted 4 x 5 SoM and varying in order of the used model.

Refer to the SoM's schematic for information about the specific pin assignments on module's B2B-connectors regarding the PL I/O-bank supply-voltages and to the 4 x 5 Module integration Guide for VCCIO voltage options.

The Carrier Board VCCIO for the PL I/O-banks of the mounted SoM are selectable by the jumpers J10, J11 and J12.

Following table describes how to configure the VCCIO of the SoM's PL I/O-banks with jumpers:

Supply Voltage by JumperSupply Voltage by 0-Ohm ResistorSupply Connector PinSupplied Connector Pin
Voltage Level1.8V3.3V1.8V3.3V

VCCIOAJ10: 1-2, 3J10: 1, 2-3-R20J6-B32 JB1-10, JB1-12
VCCIOBJ11: 1-2, 3J11: 1, 2-3R29R21-JB2-6
VCCIOCJ12: 1-2, 3J12: 1, 2-3R30R22J6-B1 JB2-8, JB2-10
VCCIO jumper settings

Only one supply-source is allowed to configure the base-board supply-voltages, either by jumper, by 0-Ohm-resistor or by connector J6. If a supply-voltage is configured by 0-Ohm-resistor or connector J6, then the corresponding configuration-jumper has to be removed. There aren't 0-Ohm-resistors and supply-voltages by connector J6 allowed if the corresponding base-board supply-voltage is configured by jumper. Vice versa jumpers and 0-Ohm-resistors have to be removed if supplying corresponding base-board supply-voltage by connector J6.

Note: If supplying base-board supply-voltages by connector J6, the module's internal 3.3V voltage-level on pins 9 and 11 of B2B-connector JB2 has to be reached stable state.

Take care of the VCCO voltage ranges of the  particular PL IO-banks (HR, HP) of the mounted SoM, otherwise damages may occur to the FPGA. Therefore, refer to the TRM of the mounted SoM to get the specific information of the voltage ranges.

It is recommended to set and measure the PL IO-bank supply-voltages before mounting of TE 4 x 5 module to avoid failures and damages to the functionality of the mounted SoM.

The SDIO voltage on the SoM side can be selected by jumper J13.

Supply Voltage by JumperSupplied Connector Pin
Voltage Level1.8V3.3V
SD_VCCAJ13: 1-2, 3J13: 1, 2-3U4-5
SD Card jumper settings

Base-board supply-voltages (VCCIOA, VCCIOB, VCCIOC, SD_VCCA) selection jumpers

RTC Buffer Voltage Supply Header

The buffer voltage of the SoM's RTC can be supplied through the header J9 (VBAT-pin). Refer to the SoM's TRM for recommended voltage range and absolute maximum ratings.

Push Button

The Carrier Board's push button S2 is connected to the 'RESIN' signal, the function of the button is to trigger a reset of the mounted SoM by driving the reset-signal 'RESIN' to ground.

Gigabit Ethernet PHY

The TE0706 Carrier Board is equipped with a Marvell Alaska 88E1512 Gigabit Ethernet PHY (U6), which provides in conjunction with the Gigabit Ethernet MagJack J2 a 1000Base-T Ethernet (GbE) interface. The Ethernet PHY RGMII interface is connected to the B2B connector JB3, where they can be accessed by the mounted SoM's PS bank. The I/O Voltage is fixed at 1.8V. Reference clock input of the PHY is supplied from the on-board 25.000000 MHz oscillator (U7), the 125MHz output clock signal *CLK125' is connected to the B2B connector pin JB3-32.

PHY U6 pinsB2B-pinNotes
PHY_LED0-Connected to GbE MagJack J2 LED0 (green). Also connected to J5-24 (PHY_LED0_CON).
PHY_LED1-Connected to GbE MagJack J2 LED1 (green). Also connected to J5-23 (PHY_LED1_CON).
CLK125JB3-32PHY Clock (125 MHz) output.
JB3-37 - JB-44
JB3-57 - JB-59

Reduced Gigabit Media Independent Interface. 12 pins.

ETH-RXCK is connected via 0Ohm to JB3-31 (R18)and JB3-58 (R19). Usage depends on Module and Xilinx IP restrictions
In case of performance  problems remove 0Ohm resistor from the unused Pin.


Serial Gigabit Media Independent Interface.

Not connected.


Media Dependent Interface.

Connected to Gigabit Ethernet MagJack J2.

RJ45 connectors

SDIO Port Expander

The TE0706 Carrier Board is equipped with a Texas Instruments TXS02612 SDIO Port Expander, which is needed for voltage translation due to different voltage levels of the Micro SD Card and the PS MIO-bank of the Zynq device of the mounted SoM. The Micro SD Card has 3.3V signal voltage level, but the PS MIO-bank on the Xilinx Zynq module has VCCIO of 1.8V or 3.3V depending on the attached module. This has to be selected by J13.

SD-Card Signal Schematic NameSD-Card Connected to Connected toSD IO Signal Schematic NameB2BNote
eSD_DAT0U4-18U4-6SD_DAT0JB1-24SD IO data
eSD_DAT1U4-16U4-7SD_DAT1JB1-22SD IO data
eSD_DAT2U4-23U4-1SD_DAT2JB1-20SD IO data
eSD_DAT3U4-22U4-3SD_DAT3JB1-18SD IO data
eSD_CLKU4-19U4-9SD_CLKJB1-28SD IO clock
eSD_CMDU4-20U4-4SD_CMDJB1-26SD IO command
MIO0---JB1-88Card Detect signal
SDIO Port Expander

Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of 3A for system startup is recommended.

Power Consumption

The maximum power consumption of the Carrier Board depends mainly on the mounted SoM's FPGA design running on the Zynq device.

Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

Power Input PinTypical Current
Power Consumption

 * TBD - To Be Determined.

Power supply with minimum current capability of 3A for system startup is recommended.

To avoid any damage to the module, check for stabilized on-board voltages and VCCIOs before put voltages on PL I/O-banks and interfaces. All I/Os should be tri-stated during power-on sequence.

Power Distribution Dependencies

The Carrier Board needs one single power supply voltage with a nominal value of 5V. Following diagram shows the distribution of the input voltage '5VIN' to the on-board components on the mounted SoM:

Power Distribution

Power Rails

The voltage direction of the power rails is directed at on-board connectors' view:

Module Connector (B2B) DesignatorVCC / VCCIODirectionPinsNotes



2, 4, 6, 14, 16

3.3V module supply voltage
M1.8VOUTIn401.8V module output voltage
VBATOut80RTC buffer voltage



2, 4

1.8V module supply voltage
M3.3VOUTIn9, 113.3V module output voltage
JB3USB-VBUSOut56USB Host supply voltage
Power pin description of B2B module connectors.

On-board Connector DesignatorVCC / VCCIODirectionPinsNotes



6, 45

3.3V module supply voltage
M3.3VOUTOut5, 463.3V module output voltage


Out / In


PL IO-bank VCCIO, depends on Jumper settings
VCCIOCOut / InB1PL IO-bank VCCIO, depends on Jumper settings
M3.3VOUTOutC323.3V module output voltage
3.3VOutC313.3V module supply voltage
5VINOutA1, A2Carrier Board supply power
Power Pin description of on-board connector.

Jumper / Header DesignatorVCC / VCCIODirectionPinsNotes


Power Pin description of VCCIO selection jumper pin header

Main Power Jack and Pins DesignatorVCC / VCCIODirectionPinsNotes


Power Jack 2.1mm 90° SMD
J9VBATIn1Attention: Pin 2 connected to ground. VBAT voltage connected on this pin cause short-circuit.
Main Power jack and pins description.

Peripheral Socket DesignatorVCC / VCCIODirectionPinsNotes
J7 / J8USB-VBUSIn / Out1Direction depends on USB mode
J4M3.3VOUTOut4MikroSD Card socket VDD
Power pin description of peripheral connector.

XMOD Header DesignatorVCC / VCCIODirectionPinsNotes
JX13.3V-5not connected
VIOOut6connected to 'VCCJTAG' (pin JB2-92)
Power pin description of XMOD/JTAG Connector.

Board to Board Connectors

These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.

4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.

  • 2 x REF-189016-02 (compatible to LSHM-150-04.0-L-DV-A-S-K-TR), (100 pins, "50" per row)
  • 1 x REF-189017-02 (compatible to LSHM-130-04.0-L-DV-A-S-K-TR), (60 pins, "30" per row) (depending on module)
Connector Mating height

When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height

Order numberConnector on baseboardcompatible toMating height
23836REF-189016-01LSHM-150-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-150-03.0-L-DV-A-S-K-TRLSHM-150-03.0-L-DV-A-S-K-TR7.0 mm
23838REF-189016-02LSHM-150-04.0-L-DV-A-S-K-TR8.0 mm

26125REF-189017-01LSHM-130-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-130-03.0-L-DV-A-S-K-TRLSHM-130-03.0-L-DV-A-S-K-TR7.0 mm
24903 REF-189017-02LSHM-130-04.0-L-DV-A-S-K-TR8.0 mm


The module can be manufactured using other connectors upon request.

Connector Speed Ratings

The LSHM connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
12 mm, Single-Ended7.5 GHz / 15 Gbps
12 mm, Differential

6.5 GHz / 13 Gbps

5 mm, Single-Ended11.5 GHz / 23 Gbps
5 mm, Differential7.0 GHz / 14 Gbps
Speed rating.
Current Rating

Current rating of  Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).

Connector Mechanical Ratings
  • Shock: 100G, 6 ms Sine
  • Vibration: 7.5G random, 2 hours per axis, 3 axes total

Manufacturer Documentation

  File Modified
PDF File hsc-report_lshm-lshm-05mm_web.pdf High speed test report 07 04, 2016 by Thorsten Trenz
PDF File lshm_dv.pdf LSHM catalog page 07 04, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf Recommended layout and stencil drawing 07 04, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf Technical drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189016-01.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189016-02.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189017-01.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189017-02.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File TC0923--2523_report_Rev_2_qua.pdf Design qualification test report 07 04, 2016 by Thorsten Trenz
PDF File tc0929--2611_qua(1).pdf Shock and vibration report 07 04, 2016 by Thorsten Trenz

Technical Specifications

Absolute Maximum Ratings




Reference Document

5VIN supply voltage

 -0.3 7


MP5010A, EN6347QI, EN5311QI data sheet

Storage temperature




Marvell 88E1512 data sheet
Power System absolute maximum ratings

Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

ParameterMinMaxUnitsReference Document
5VIN supply voltage 4.755.25 VUSB2.0 specification concerning 'VBUS' voltage
Operating temperature -40+85°C-
Recommended operating conditions.

The TE0706 Carrier Board itself is capable to be operated at industrial grade temperature range (-40 °C ..+85 °C).

Please check the operating temperature range of the mounted SoM, which determine the relevant operating temperature range of the overall system.

Physical Dimensions

  • Board size:  PCB 100mm ×  64.5mm. Notice that the USB type A socket on the left and the Ethernet RJ-45 jacks on the right are hanging slightly over the edge of the PCB making the total width of the longer side approximately 106mm. Please download the assembly diagram for exact numbers.

  • Mating height of the module with standard connectors: 8mm

  • PCB thickness: 1.65mm

  • Highest parts on the PCB are USB type A socket and the Ethernet RJ-45 jacks, approximately 15mm. Please download the step model for exact numbers.

 All dimensions are given in millimeters.

Physical Dimension

Currently Offered Variants 

Trenz shop TE0728 overview page
English pageGerman page
Trenz Electronic Shop Overview

Revision History

Hardware Revision History

List of online PCNs can be found here.



Documentation Link


  • Prototypes
  • First Production Release
  • Refer to Changes list in Schematic

    for further details in changes to REV01

  • all components are industrial temperature range
  • added SDIO Levelshifter
Hardware Revision History

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Board hardware revision number.

Document Change History





  • Note to PHY connection
2010-07-16v.74John Hartfiel
  • update Physical Dimensions
2019-05-27v.73Martin Rohrmüller
  • Updated to REV03
  • Updated to TRM v28
2018-06-03v.66John Hartfiel
  • Add note to DIP settings


John Hartfiel
  • Replace B2B connector section
2017-11-09v.60Ali Naseri
  • TRM revision to new common style


Ali Naseri, Jan Kumann
  • Hardware revision 02 specific changes.
2017-01-06v.1Ali Naseri
  • initial document to board revision 02
  • ---
Document change history.


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Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.


Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.

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