TE0706 TRM

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Overview

The Trenz Electronic TE0706 Carrier Board provides functionalities for testing, evaluation and development purposes of company's 4 x 5 cm SoMs. The Carrier Board is equipped with various components and connectors for different configuration setups and needs. The interfaces of the SoM's functional units and PL I/O-banks are connected via board-to-board connectors to the Carrier Board's components and connectors for easy user access.

See "4 x 5 SoM Carriers" page for more information about supported 4 x 5 cm SoMs.

Refer to http://trenz.org/te0706-info for the current online version of this manual and other available documentation.

Key Features

• 3 x Samtec LSHM Series Board to Board Connectors
• VG96 connector (mounting holes and solder pads, J6) and 50-pin IDC male connector socket (J5) for access to PL I/O-bank pins
• USB2.0 type A connector, or optionally Micro USB 2.0 connector
• 1 x RJ45 GbE MagJack (J3), connected via MDI to B2B connector JB1
• 1 x Marvell Alaska 88E1512 GbE PHY, providing Ethernet interface in conjunction with RJ45 GbE MagJack (J2)
• 4 A High-Efficiency Power SoC DC-DC Step-Down Converter (Enpirion EN6347) for 3.3V power supply
• XMOD JTAG- / UART-header JX1
• Micro SD card socket
• SDIO port expander with voltage-level translation and jumper (J13) for selection of SDIO voltage on SoM side
• DIP-switches S1 to set SoM's control signals
• 1 x user-push button (S2), by default configured as system reset button
• 3 x VCCIO selection jumper J10, J11 and J12 to set SoM's PL I/O-bank voltages
• 5V power supply barrel jack

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

Main Components

1. 5V power connector jack, J1
2. Reset switch, S2
3. USB2.0 type A receptacle, J7
4. Micro SD card socket with Card Detect, J4
5. 50 pin IDC male connector, J5
6. 1000Base-T Gigabit RJ45 Ethernet MagJack, J3
7. 1000Base-T Gigabit RJ45 Ethernet MagJack, J2
8. XMOD JTAG- / UART-header, JX1
9. User DIP-switch, S1
10. VCCIO selection jumper block, J10 - J12
11. External connector (VG96) placeholder, J6
12. Samtec Razor Beam™ LSHM-150 B2B connector, JB1
13. Samtec Razor Beam™ LSHM-150 B2B connector, JB2
14. Samtec Razor Beam™ LSHM-130 B2B connector, JB3
15. SoM SDIO voltage selection jumper, J13

Initial Delivery State

There is no hardware component to be programmed on the carrier.

Board is shipped in following configuration:

• VCCIO voltage selection jumpers are all set to 1.8 V.
• S2 switch configured as reset button.

Different delivery configurations are available upon request.

Configuration Signals

There is a user push button which is used for RESET signal.

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

With the TE0706 Carrier Board's Board-to-Board Connectors (B2B) the MIO- and PL I/O-bank's pins and further interfaces of the mounted SoM can be accessed. A large quantity of these I/Os are also usable as LVDS-pairs. The connectors provide also VCCIO voltages to operate the I/Os properly.

Following table gives a summary of the available I/Os, interfaces and LVDS-pairs of the B2B connectors JB1, JB2 and JB3:

On-board Connector

The TE0706 Carrier Board has a 50-pin IDC male connector J5 and soldering pads as place-holder to mount a VG96 connectors J6 to get access the PL I/O-bank's pins and further interfaces of the mounted SoM. With these connectors, SoM's PL-I/Os are available to the user, a large quantity of these I/Os are also usable as  differential pairs.

Following table gives a summary of the pin-assignment, available interfaces and functional I/Os of the connectors J5 and J6:

JTAG/UART Interface Base

JTAG/UART access to the TE0706 carrier is available through XMOD header JX1, which has a 'XMOD FTDI JTAG Adapter'-compatible pin-assignment. This header provides also a UART interface, usually established by MIO-pins of the PS-bank of the mounted SoM's Zynq device. XMOD USB2.0 to JTAG/UART adapter TE0790 is provided by Trenz Electronic. More information is available here. Devices of the mounted SoM can be programed via USB2.0 interface.

When using XMOD FTDI JTAG Adapter TE0790, the adapter-board's VIO will be sourced by the mounted SoM's 'VCCJTAG' (pin JB2-92). Set the DIP-switch with the setting:

SD Card Socket

The SD Socket is routed to the on-board Texas Instruments TXS02612 SDIO port expander U4. This IC provides a necessary VDD/VCCIO translation between the MicroSD Card socket J4 (3.3V) and the SoM's Zynq device MIO-bank (1.8V/3.3V depending on Module, compare jumper J13 ):

USB2.0 connector

TE0706-03 board has one physical USB2.0 type A socket J7, the differential data signals of the USB2.0 socket are routed to the B2B connector JB3, where they can be accessed by the corresponding USB2.0 PHY transceiver of the mounted SoM.

There is also the option to equip the board with a Micro USB 2.0 type B (receptacle) socket (J8) to the board as alternative fitting option. With this fitting option (Micro USB2.0 type B), the USB2.0 interface can also be used for Device mode, OTG and Host Modes.

For USB2.0 Host mode, the Carrier Board is additionally equipped with a power distribution switch U5 to provide the USB2.0 interface with the USB supply voltage USB-VBUS with nominal value of 5V. OTG mode is not available with USB2.0 Type A socket.

Following table gives an overview of the USB2.0 connector signals:

RJ45 Gigabit Ethernet Connectors

The TE0706 Carrier Board is equipped with two Gigabit Ethernet ports. One of them (J2) is routed to Marvell Alaska 88E1512 Gigabit Ethernet PHY (U6). The GbE MegJack J2 has two integrated LEDs (both green), its signals are routed as MDI (Media Dependent Interface) to the GbE PHY. The MegJack J3 is connected via MDI directly to the B2B connector JB1. There is usually a corresponding Gigabit Ethernet PHY on 4 x 5 SoMs (e.g. TE0715 or TE0720), which can be used in conjunction with the baseboard MagJack J3.

MIO Pins

On-board Peripherals

4-bit DIP-switch

Table below describes DIP-switch S1 settings for configuration of the mounted SoM:

VCC Selection Jumpers

The Carrier Board VCCIO for the PL I/O-banks of the mounted SoM are selectable by the jumpers J10, J11 and J12.

Following table describes how to configure the VCCIO of the SoM's PL I/O-banks with jumpers:

Only one supply-source is allowed to configure the base-board supply-voltages, either by jumper, by 0-Ohm-resistor or by connector J6. If a supply-voltage is configured by 0-Ohm-resistor or connector J6, then the corresponding configuration-jumper has to be removed. There aren't 0-Ohm-resistors and supply-voltages by connector J6 allowed if the corresponding base-board supply-voltage is configured by jumper. Vice versa jumpers and 0-Ohm-resistors have to be removed if supplying corresponding base-board supply-voltage by connector J6.

Note: If supplying base-board supply-voltages by connector J6, the module's internal 3.3V voltage-level on pins 9 and 11 of B2B-connector JB2 has to be reached stable state.

The SDIO voltage on the SoM side can be selected by jumper J13.

RTC Buffer Voltage Supply Header

The buffer voltage of the SoM's RTC can be supplied through the header J9 (VBAT-pin). Refer to the SoM's TRM for recommended voltage range and absolute maximum ratings.

Push Button

The Carrier Board's push button S2 is connected to the 'RESIN' signal, the function of the button is to trigger a reset of the mounted SoM by driving the reset-signal 'RESIN' to ground.

Gigabit Ethernet PHY

The TE0706 Carrier Board is equipped with a Marvell Alaska 88E1512 Gigabit Ethernet PHY (U6), which provides in conjunction with the Gigabit Ethernet MagJack J2 a 1000Base-T Ethernet (GbE) interface. The Ethernet PHY RGMII interface is connected to the B2B connector JB3, where they can be accessed by the mounted SoM's PS bank. The I/O Voltage is fixed at 1.8V. Reference clock input of the PHY is supplied from the on-board 25.000000 MHz oscillator (U7), the 125MHz output clock signal *CLK125' is connected to the B2B connector pin JB3-32.

SDIO Port Expander

The TE0706 Carrier Board is equipped with a Texas Instruments TXS02612 SDIO Port Expander, which is needed for voltage translation due to different voltage levels of the Micro SD Card and the PS MIO-bank of the Zynq device of the mounted SoM. The Micro SD Card has 3.3V signal voltage level, but the PS MIO-bank on the AMD Zynq module has VCCIO of 1.8V or 3.3V depending on the attached module. This has to be selected by J13.

Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of 3A for system startup is recommended.

Power Consumption

The maximum power consumption of the Carrier Board depends mainly on the mounted SoM's FPGA design running on the Zynq device.

AMD provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

 * TBD - To Be Determined.

Power supply with minimum current capability of 3A for system startup is recommended.

Power Distribution Dependencies

The Carrier Board needs one single power supply voltage with a nominal value of 5V. Following diagram shows the distribution of the input voltage '5VIN' to the on-board components on the mounted SoM:

Power Rails

The voltage direction of the power rails is directed at on-board connectors' view:

Board to Board Connectors

Technical Specifications

Absolute Maximum Ratings

Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

The TE0706 Carrier Board itself is capable to be operated at industrial grade temperature range (-40 °C ..+85 °C).

Please check the operating temperature range of the mounted SoM, which determine the relevant operating temperature range of the overall system.

Physical Dimensions

• Board size:  PCB 100mm ×  64.5mm. Notice that the USB type A socket on the left and the Ethernet RJ-45 jacks on the right are hanging slightly over the edge of the PCB making the total width of the longer side approximately 106mm. Please download the assembly diagram for exact numbers.

• Mating height of the module with standard connectors: 8mm

• PCB thickness: 1.65mm

• Highest parts on the PCB are USB type A socket and the Ethernet RJ-45 jacks, approximately 15mm. Please download the step model for exact numbers.

 All dimensions are given in millimeters.

Currently Offered Variants 

Revision History

Hardware Revision History

List of online PCNs can be found here.

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Document Change History

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