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LED | Color | Connected To | Description and Notes |
---|---|---|---|
D2 | Red | MIO9, U1 | |
D6 | Green | Bank 34, U1 | FPGA_LED |
D7 | Green | 3.3V | PWR_LED |
MIO | Function | Connected To | Notes |
---|---|---|---|
0 | SDCARD | J10-9 | Card detect switch. |
1 | QSPI | U5-1 | SP0-CS |
2 | QSPI | U5-5 | SPI0-DQ0 |
3 | QSPI | U5-2 | SPI0-DQ1 |
4 | QSPI | U5-3 | SPI0-DQ2 |
5 | QSPI | U5-7 | SPI0-DQ3 |
6 | QSPI | U5-6 | SPI0-SCK |
7 | GPIO | U18-27 | USB PHY reset |
9 | LED | D2 | Red LED |
10 | SDCARD | J10-7 | DAT0 |
11 | SDCARD | J10-3 | CMD |
12 | SDCARD | J10-5 | CLK |
13 | SDCARD | J10-8 | DAT1 |
14 | SDCARD | J10-1 | DAT2 |
15 | SDCARD | J10-2 | CD/DAT3 |
28 | USB-OTG | U18-7 | OTG-DATA4 |
29 | USB-OTG | U18-31 | OTG-DIR |
30 | USB-OTG | U18-29 | OTG-STP |
31 | USB-OTG | U18-2 | OTG-NXT |
32 | USB-OTG | U18-3 | OTG-DATA0 |
33 | USB-OTG | U18-4 | OTG-DATA1 |
34 | USB-OTG | U18-5 | OTG-DATA2 |
35 | USB-OTG | U18-6 | OTG-DATA3 |
36 | USB-OTG | U18-1 | OTG-CLK |
37 | USB-OTG | U18-9 | OTG-DATA5 |
38 | USB-OTG | U18-10 | OTG-DATA6 |
39 | USB-OTG | U18-13 | OTG-DATA7 |
48 | ESP | J5-2 | ESP_TXD |
49 | ESP | J5-7 | ESP_RXD |
52 | ESP | J5-6 | MOD_RST |
53 | ESP | J5-3 | ESP_GPIO0 |
I2C interface pins from the ZYNQ SoC PL bank 34 are connected to the connector J1. There are no on-board I2C slave devices.
Signal | ZYNQ SoC Pin | Connected To |
---|---|---|
SDA | R13 | J1-9 |
SCL | P13 | J1-10 |
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
VIN supply voltage | -0.5 | 3.6 | V | Xilinx datasheet DS187, "Zynq-7000 All Programmable SoC: DC and AC Switching Characteristics". |
Storage temperature | -40 | +85 | °C |
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
Supply voltage | 1.14 | 3.465 | V | Xilinx datasheet DS187, "Zynq-7000 All Programmable SoC: DC and AC Switching Characteristics". |
Note |
---|
Assembly variants for higher storage temperature range are available on request. |
Module size: 68.58 mm × 53.34 mm. Please download the assembly diagram for exact numbers.
PCB thickness: 1.6 mm.
Highest part on PCB: approx. 4 mm. Please download the step model for exact numbers.
Please note that two different units are used on the figures below, SI system millimeters (mm) and imperial system thousandths of an inch(mil). To convert mils to millimeters and vice versa use formula 100mil's = 2,54mm.
Commercial grade: 0°C to +70°C.
Industrial grade: -40°C to +85°C.
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
... g - Plain module
... g - Set of bolts and nuts
Date | Revision | Notes | PCN | Documentation Link |
---|---|---|---|---|
2016-07-15 | 03 | Click to see PCN. | TE0723-03 | |
2015-11-06 | 02 | TE0723-02 | ||
01 |
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Hardware revision number is printed on the PCB board together with the module model number separated by the dash.
Date | Revision | Contributors | Description |
---|---|---|---|
2017-02-11 | Jan Kumann | Initial document. |
Include Page | ||||
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