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Overview

Refer to https://shop.trenz-electronic.de/en/Download/?path=Trenz_Electronic/carrier_boards/TEBF0808/REV04 for downloadable version of this manual and additional technical documentation of the product.

The Trenz Electronic TEBF0808 Carrier Board is a baseboard for the Xilinx Zynq Ultrascale+ MPSoC modules TE0808 and TE0803, which exposes the module's B2B connector pins to accessible connectors and provides a whole range of on-board components to test the Zynq Ultrascale+ SoMs.

Key Features

List key features here, like FPGA type, amount and type of RAM, type of flash, etc.

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

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Main Components

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Initial Delivery State

Signals, Interfaces and Pins

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Connections and Interfaces or B2B Pin's which are accessible by User
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Board to Board (B2B) I/Os

I/O signals connected to the SoCs I/O bank and B2B connector: 

All MIO banks are powered from on-module DC-DC power rail. All PL I/O Banks have separate VCCO pins in the B2B connectors, valid VCCO should be supplied from the baseboard.

For detailed information about the pin out, please refer to the Pin-out Tables. 

The configuration of the I/O's MIOx, MIOx ... MIOx, ... are depending on the base-board peripherals connected to these pins.

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MGT Lanes

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JTAG Interface

JTAG access to the ... is provided through B2B connector .... 

System Controller I/O Pins

Special purpose pins are connected to smaller System Controller CPLD and have following default configuration:

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For the detailed function of the pins and signals, the internal signal assignment and implemented logic, look to the Wiki reference page SC CPLD of this module or into the bitfile of the SC CPLD.
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Quad SPI Interface

Quad SPI Flash (U14) is connected to the Zynq PS QSPI0 interface via PS MIO bank 500, pins MIO1 ... MIO6.

Gigabit Ethernet

On board Gigabit Ethernet PHY is provided with ...

Ethernet PHY connection

USB Interface

USB PHY is provided with ...

The schematics for the USB connector and required components is different depending on the USB usage. USB standard A or B connectors can be used for Host or Device modes. A Mini USB connector can be used for USB Device mode. A USB Micro connector can be used for Device mode, OTG Mode or Host Mode.

I2C Interface

On-board I2C devices are connected to MIO.. and MIO.. which are configured as I2C... by default. I2C addresses for on-board devices are listed in the table below:

Boot Process

By default the ... supports QSPI and SD Card boot modes which is controlled by the MODE input signal from the B2B connector.

On-board Peripherals

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Components on the Module, like Flash, PLL, PHY...
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System Controller CPLD

The System Controller CPLD (U2) is provided by Lattice Semiconductor LCMXO2-256HC (MachXO2 Product Family). The  SC-CPLD is the central system management unit where essential control signals are logically linked by the implemented logic in CPLD firmware, which generates output signals to control the system, the on-board peripherals and the interfaces. Interfaces like JTAG and I²C between the on-board peripherals and to the FPGA-module are by-passed, forwarded and controlled by the System Controller CPLD.

Other tasks of the System Controller CPLD are the monitoring of the power-on sequence and to display the programming state of the FPGA module.

For detailed information, refer to the reference page of the SC CPLD firmware of this module.

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Quad SPI Flash Memory

On-board QSPI flash memory (U14) on the TE0745-02 is provided by Micron Serial NOR Flash Memory N25Q256A with 256 Mbit (32 MByte) storage capacity. This non volatile memory is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used.

Gigabit Ethernet PHY

On-board Gigabit Ethernet PHY (U7) is provided with Marvell Alaska 88E1512 IC (U8). The Ethernet PHY RGMII interface is connected to the Zynq Ethernet0 PS GEM0. I/O voltage is fixed at 1.8V for HSTL signaling. The reference clock input of the PHY is supplied from an on-board 25.000000 MHz oscillator (U9), the 125MHz output clock signal CLK_125MHZ is connected to the pin J2-150 of B2B connector J2.

High-speed USB ULPI PHY

Hi-speed USB ULPI PHY (U32) is provided with USB3320 from Microchip. The ULPI interface is connected to the Zynq PS USB0 via MIO28..39, bank 501 (see also section). The I/O voltage is fixed at 1.8V and PHY reference clock input is supplied from the on-board 52.000000 MHz oscillator (U33).

MAC Address EEPROM

A Microchip 24AA025E48 serial EEPROM (U23) contains a globally unique 48-bit node address, which is compatible with EUI-48(TM) specification. The device is organized as two blocks of 128 x 8-bit memory. One of the blocks stores the 48-bit node address and is write protected, the other block is available for application use. It is accessible over I²C bus with slave device address 0x53.

RTC - Real Time Clock

An temperature compensated Intersil ISL...

Programmable PLL Clock (Phase-Locked Loop)

There is a Silicon Labs I²C programmable quad PLL clock generator Si5338A (U..) ..

Oscillators

The SoC module has following reference clocking signals provided by external baseboard sources and on-board oscillators:

On-board LEDs

Power and Power-On Sequence

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Power Consumption

The maximum power consumption of a module mainly depends on the design which is running on the FPGA.

Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

 * TBD - To Be Determined soon with reference design setup.

Power supply with minimum current capability of ...A for system startup is recommended.

For the lowest power consumption and highest efficiency of on board DC-DC regulators it is recommended to powering the module from one single 3.3V supply. All input power supplies have a nominal value of 3.3V. Although the input power supplies can be powered up in any order, it is recommended to power them up simultaneously.

The on-board voltages of the TE07xx SoC module will be powered-up in order of a determined sequence after the external voltages '...', '...' and '...' are available. All those power-rails can be powered up, with 3.3V power sources, also shared.

Power Distribution Dependencies

regulator dependencies and max. current.

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See Xilinx data sheet ... for additional information. User should also check related base board documentation when intending base board design for TE07xx module.

Power-On Sequence Diagram

The TE07xx SoM meets the recommended criteria to power up the Xilinx Zynq MPSoC properly by keeping a specific sequence of enabling the on-board DCDC converters dedicated to the particular functional units of the Zynq chip and powering up the on-board voltages.

Following diagram clarifies the sequence of enabling the particular on-board voltages, which will power-up in descending order as listed in the blocks of the diagram:

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Voltage Monitor Circuit

if this circuit is fitted on module, describe it here...

Power Rails

Bank Voltages

Board to Board Connectors

Variants Currently In Production

Technical Specifications

Absolute Maximum Ratings

Recommended Operating Conditions

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

Extended grade: 0°C to +85°C.

Module operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Physical Dimensions

• Module size: ... mm × ... mm.  Please download the assembly diagram for exact numbers.

• Mating height with standard connectors: ... mm.

• PCB thickness: ... mm.

• Highest part on PCB: approx. ... mm. Please download the step model for exact numbers.

 All dimensions are given in millimeters.

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Revision History

Hardware Revision History

Hardware revision number is printed on the PCB board together with the module model number separated by the dash.

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Document Change History

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Disclaimer

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